Mechanical, and electrical effects generated by the galvanic corrosion of polysilicon immersed in various hydrofluoric acid (HF)-based solutions are described. Micromachined test structures consisting of phosphorus-doped polysilicon in contact with a gold metallization layer are utilized. A suite of otherwise identical test (metal added) and reference (no metal) structures were used to investigate changes in key performance parameters. Corroded test structures demonstrate an increase in through-thickness strain gradient, a decrease in the characteristic frequency of mechanical resonance, no change in in-plane strain, greatly increased electrical resistance, a decrease in hardness, and a decrease in elastic modulus. Noteworthy results were observed for aqueous-hydrochloric acid, ethanol, water, ammonium fluoride (found in buffered oxide etchant), Triton-X-100, as well as vapor-HF based chemistries. This first systematic study validates preliminary experiments and demonstrates the impact of corrosion on miniaturized structures, indicating a potential influence upon the material properties, design, performance, fatigue, tribology (friction/ wear), manufacture, and packaging of micro-and nano-scale devices.
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ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
- Microelectromechanical Systems Division
ISBN:
0-7918-4224-X
PROCEEDINGS PAPER
Mechanical Effects of Galvanic Corrosion of Thin Film Polysilicon
David C. Miller,
David C. Miller
University of Colorado at Boulder
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Conrad R. Stoldt
Conrad R. Stoldt
University of Colorado at Boulder
Search for other works by this author on:
David C. Miller
University of Colorado at Boulder
Ken Gall
Georgia Institute of Technology
Conrad R. Stoldt
University of Colorado at Boulder
Paper No:
IMECE2005-79295, pp. 325-334; 10 pages
Published Online:
February 5, 2008
Citation
Miller, DC, Gall, K, & Stoldt, CR. "Mechanical Effects of Galvanic Corrosion of Thin Film Polysilicon." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. Orlando, Florida, USA. November 5–11, 2005. pp. 325-334. ASME. https://doi.org/10.1115/IMECE2005-79295
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