This paper reports a manufacturing process suitable for lithography-compatible fabrication of suspended micro-structures from any conductive material (including bulk metal) that is available in sheet form. It uses two aligned steps of batch mode micro-electro-discharge machining followed by a series of filling and lapping steps similar to a damascene process. The process is demonstrated by the fabrication of a bi-stable RF switch from #302 stainless steel foil. The fabricated devices have a footprint of 5 × 5 mm2, with 25 μm thickness, and a minimum feature size of 5 μm.

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