This paper describes a single-step method for assembling and encapsulating a microbubble chamber in which injection-molded plastic secures the fluidic and electrical interconnects. All of the necessary components for the chamber are loose assembled in a plastic-injection mold and subsequently packaged, encapsulated, and sealed in one molding step. These components include a silicon/Pyrex® bubble chamber, copper electrical leads, and small-gauge stainless steel fluidic headers. This approach delivers a fully integrated microbubble chamber with 1) zero dead volume, 2) low electrical contact resistance (<1 Ohm), 3) low compliance, in-plane fluid interconnects and 4) small overall dimensions (7.5 mm × 4 mm × 3 mm) conforming to the Dual In-Line Package (DIP) standard, Fig 1.

1.
Figeys, D., and Pinto D., 2000, “Lab-on-a-chip: A Revolution in Biological and Medical Sciences,” Analytical Chemistry, pp. 330A–335A
2.
Puntambekar, A., Ahn, C.H., 2002, “Self-aligning microfluidic interconnects for glass and plastic based microfluidic systems,” J. of Micromechanics and Microengineering, pp. 35–40
3.
Gray
H.
,
Jaeggi
D.
,
Mourlas
N.
,
van Drieenhuizen
B.
,
Williams
K.
,
Maluf
N.
,
Kovacs
C.
,
1999
, “
Novel interconnection technologies for integrated microfluidic systems
,”
Sensors & Actuators A-Physical
,
A77
, no.
1
, pp.
57
65
4.
Ming
E.
,
Wu
S.
,
Tai
Y.
,
2001
. “
Silicon Couplers for Microfluidic Applications
,”
Fresenius Journal of Anatical Chemistry
,
371
, issue
2
, pp.
270
275
.
5.
Frank, J. 2004, “Planar Microfluidic Devices for Control of Pressure-Driven Flow” Ph.D. Dissertation, University of California, Berkeley, pp. 148
6.
http://www.dow.com/primacor/
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