The punch and die operation is widely used for forming and processing of both metal and non-metal sheets due to its ease-of-operation. Moreover, this method is characterized by a higher degree of cost-effectiveness and accuracy as compared to other processing modes, such as casting, forging and metal processing. The typical field of application covers parts manufacturing for timekeepers, vehicles, sheet metals or motors and various thin plates. With the development of IC (Integrated circuit) processing technology, passive components are being increasingly miniaturized, ranging from 0603 (0.06″ × 0.03″) chips to existing 0402 (0.04″ × 0.02″) and 0201 chips. Because of increasing miniaturization of passive components, the smaller aperture of composite paper bags for various IC will be required. The IC chips need to be packaged for sale. The packaging bag has many small apertures to store the chips. Micro punches and dies are use to punch this aperture. The accuracy of aperture for packaging bags, however, depends on the clearance between the punch and die. This study utilizes an Image Vision System to measure the clearance of micro dies and the burr size of processed composite materials in order to estimate which condition is better for micro dies. The relational expression was established between input parameters and outputs via a Neural Network. This can help to anticipate the burr size under any clearance, and contributes to the design and application of smaller punches in the future.
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ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
- Manufacturing Engineering Division and Materials Handling Division
ISBN:
0-7918-4223-1
PROCEEDINGS PAPER
Research of the Relationship Between the Clearance and Wear of Precise Micro Punch and Die
Ming-Fang Lu,
Ming-Fang Lu
Chien-Kuo Technology University
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Chainming Yen
Chainming Yen
National Formosa University
Search for other works by this author on:
Jui-Chang Lin
National Formosa University
Kingsun Lee
Chien-Kuo Technology University
Ming-Fang Lu
Chien-Kuo Technology University
Chainming Yen
National Formosa University
Paper No:
IMECE2005-80321, pp. 1101-1107; 7 pages
Published Online:
February 5, 2008
Citation
Lin, J, Lee, K, Lu, M, & Yen, C. "Research of the Relationship Between the Clearance and Wear of Precise Micro Punch and Die." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Manufacturing Engineering and Materials Handling, Parts A and B. Orlando, Florida, USA. November 5–11, 2005. pp. 1101-1107. ASME. https://doi.org/10.1115/IMECE2005-80321
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