The punch and die operation is widely used for forming and processing of both metal and non-metal sheets due to its ease-of-operation. Moreover, this method is characterized by a higher degree of cost-effectiveness and accuracy as compared to other processing modes, such as casting, forging and metal processing. The typical field of application covers parts manufacturing for timekeepers, vehicles, sheet metals or motors and various thin plates. With the development of IC (Integrated circuit) processing technology, passive components are being increasingly miniaturized, ranging from 0603 (0.06″ × 0.03″) chips to existing 0402 (0.04″ × 0.02″) and 0201 chips. Because of increasing miniaturization of passive components, the smaller aperture of composite paper bags for various IC will be required. The IC chips need to be packaged for sale. The packaging bag has many small apertures to store the chips. Micro punches and dies are use to punch this aperture. The accuracy of aperture for packaging bags, however, depends on the clearance between the punch and die. This study utilizes an Image Vision System to measure the clearance of micro dies and the burr size of processed composite materials in order to estimate which condition is better for micro dies. The relational expression was established between input parameters and outputs via a Neural Network. This can help to anticipate the burr size under any clearance, and contributes to the design and application of smaller punches in the future.

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