This work reports on the development of a scanning hot probe technique for the measurement of thermoelectric properties of thin-films. In this method a resistively heated thermal probe of an Atomic Force Microscope (AFM) is brought in contact with the sample surface giving rise to a temperature gradient and a Seebeck voltage in the specimen. The average temperature rise of the probe is determined from the change in its electrical resistance. The heat transfer rate between the probe and the sample is estimated using a heat transfer model that takes into account the major heat transfer mechanisms in the system. The thermal conductivity is determined from the measured thermal resistance of the film. The Seebeck coefficient value is calculated using the measured temperature drop and the Seebeck voltage in the plane of the sample. The method is calibrated on glass and silicon substrates. Preliminary experimental results are presented for a thermoelectric film composed of randomly aligned Bi2Te3 nanowires deposited on a glass substrate.
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ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4222-3
PROCEEDINGS PAPER
Development of a Scanning Hot Probe Technique for Thin-Film Thermoelectric Properties Characterization Available to Purchase
Claudiu L. Hapenciuc,
Claudiu L. Hapenciuc
Rensselaer Polytechnic Institute
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Theodorian Borca-Tasciuc
Theodorian Borca-Tasciuc
Rensselaer Polytechnic Institute
Search for other works by this author on:
Claudiu L. Hapenciuc
Rensselaer Polytechnic Institute
Theodorian Borca-Tasciuc
Rensselaer Polytechnic Institute
Paper No:
IMECE2005-82626, pp. 697-701; 5 pages
Published Online:
February 5, 2008
Citation
Hapenciuc, CL, & Borca-Tasciuc, T. "Development of a Scanning Hot Probe Technique for Thin-Film Thermoelectric Properties Characterization." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Heat Transfer, Part B. Orlando, Florida, USA. November 5–11, 2005. pp. 697-701. ASME. https://doi.org/10.1115/IMECE2005-82626
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