In this study we report the design, fabrication and testing of a surface micro-machined array of temperature sensors for studying micro-scale features in film boiling. The fabrication steps involved deposition by metal evaporation and “lift-off” process. The thermocouple junction sizes were less than 50μm wide and 100-250nm thick. Wire bonding techniques were explored for packaging. An apparatus for boiling experiments was constructed to test the micro-machined temperature sensors. The apparatus consists of a viewing chamber containing a metal block (copper block covered with a steel jacket) in which cartridge heaters and thermocouples are embedded. A silicon wafer with the surface micro-machined thermocouple arrays was clamped on top of this metal block. Surface temperatures were measured, during boiling experiments with PF-5060 as the working liquid, using the surface micro-machined thermocouple. Since the micro-machined thermocouples have very low characteristic time constant, temperature measurements can be performed with better accuracy, spatial resolution and temporal precision, than standard thermocouples.
Micro-Machined Temperature Sensor Arrays for Studying Micro-Scale Features in Film Boiling
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Ahn, HS, Sinha, N, & Banerjee, D. "Micro-Machined Temperature Sensor Arrays for Studying Micro-Scale Features in Film Boiling." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Heat Transfer, Part B. Orlando, Florida, USA. November 5–11, 2005. pp. 317-324. ASME. https://doi.org/10.1115/IMECE2005-81869
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