The low temperature fabrication of passive electrical components (resistor, capacitor) on flexible substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print passive electrical components from gold nano-particles suspended in Alpha-Terpineol solution on a flexible polymer substrate. PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent was inkjet-printed as dielectric layer for capacitor. A pulsed laser beam was irradiated to produce finer electrical components, thereby overcoming the inherent limitation of inkjet processing. A continuous Ar laser beam was irradiated locally to evaporate carrier solvent as well as to cure the gold nano-particles in order to improve the electrical resistivity. Conductor lines and capacitors were fabricated on polymer substrate and their performance was analyzed.
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ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4217-7
PROCEEDINGS PAPER
Fabrication of Inkjet Printed Flexible Electronics by Low Temperature Subtractive Laser Processing
Seung Hwan Ko,
Seung Hwan Ko
University of California at Berkeley
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Yeonho Choi,
Yeonho Choi
University of California at Berkeley
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Costas P. Griogoropoulos,
Costas P. Griogoropoulos
University of California at Berkeley
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Dimos Poulikakos
Dimos Poulikakos
Laboratory of Thermodynamics in Emerging Technologies
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Seung Hwan Ko
University of California at Berkeley
Jaewon Chung
Korea University
Yeonho Choi
University of California at Berkeley
Costas P. Griogoropoulos
University of California at Berkeley
Dimos Poulikakos
Laboratory of Thermodynamics in Emerging Technologies
Paper No:
IMECE2005-80535, pp. 599-603; 5 pages
Published Online:
February 5, 2008
Citation
Ko, SH, Chung, J, Choi, Y, Griogoropoulos, CP, & Poulikakos, D. "Fabrication of Inkjet Printed Flexible Electronics by Low Temperature Subtractive Laser Processing." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Orlando, Florida, USA. November 5–11, 2005. pp. 599-603. ASME. https://doi.org/10.1115/IMECE2005-80535
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