Design parameters for a new micro tensile testing arrangement have been presented. The device is well suited for conducting in-situ tensile test experimentation on the SEM using SPDIC technique to obtain strains and material properties of free-standing thin film specimens. A high precision, high resolution hybrid linear actuator is employed to apply the necessary tensile force. Resolution of linear motion of the actuator is around ±0.3μm. Applied forces are measured using a high precision load cell. The DAQ device is a laboratory computer running a measurement and automation software. Use of the apparatus facilitates real time capturing of images of specimens undergoing strain. Key features of the apparatus are ease of use, portability and simplicity of the entire design while maintaining high accuracy and precision data acquisition capabilities. Coupled with SPDIC techniques, the apparatus can be used to measure in-plane displacements with a resolution up to 10nm.

1.
Brotzen
F. R.
,
1994
, “
Mechanical Testing of Thin Films
,”
International Materials Reviews
,
39
,
24
45
.
2.
Sharpe, W.N., 2001, “Mechanical Properties of MEMS Materials,” The MEMS Handbook, CRC Press, 3-1 to 3–33.
3.
Haque
M. A.
and
Saif
M. T. A.
,
2002
, “
In-Situ Tensile Testing of Nano-Scale Specimens in SEM and TEM
Experimental Mechanics
,
42
(
1
),
123
128
.
4.
Read
David T.
and
Dally
James W.
,
1992
, “
A new method for measuring the strength and ductility of thin films
,”
Journal of Materials Research
,
8
(
7
),
1542
1549
.
5.
Chu
T. C.
,
Ranson
W. F.
,
Sutton
M. A.
, and
Peters
W. H.
,
1986
, “
Application of Digital Image-Correlation Techniques to Experimental Mechanics
,”
Experimental Mechanics
,
26
,
230
237
.
6.
Vendroux
G.
and
Knauss
W. G.
,
1998
, “
Submicron Deformation Fields Measurements: part 1. Developing a Digital Scanning Tunneling Microscope
,”
Experimental Mechanics
,
38
(
1
)
18
23
.
7.
Vendroux
G.
and
Knauss
W. G.
,
1998
, “
Submicron Deformation Fields Measurements: part 2. Improved Digital Image Correlation
,”
Experimental Mechanics
,
38
(
2
),
86
92
.
8.
Vendroux
G.
and
Knauss
W. G.
,
1998
, “
Submicron Deformation Fields Measurements: part 3. Demonstration of Deformation Determinations
,”
Experimental Mechanics
,
38
(
3
),
154
160
.
9.
Chiang, F.P., Wang, Q. and Lehman, F., 1997, “New Developments in Full Field Strain Measurements Using Speckles,” Nontraditional Methods of Sensing Stress, Strain and Damage in Materials and Structures, ASTM STP 1318, George F. Lucas and David A. Stubbs, Eds., American Society for Testing and Materials, 156–169.
10.
Chang, S., Warren, J., Ho, D., and Chiang, F.P., 2002, “Testing Mechanical Properties of EPON SU-8 with SIEM,” Proceedings of the 2002 SEM Conference, 125.
This content is only available via PDF.
You do not currently have access to this content.