Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.

Volume Subject Area:
Aerospace
Keywords:
Ultrasonic wire bonding, quality monitoring, transient load estimation, model based
Topics:
Actuators, Sensors, Wire bonding
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