Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire Bonding
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Bro¨kelmann, M, Wallaschek, J, & Hesse, HJ. "Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire Bonding." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Aerospace. Orlando, Florida, USA. November 5–11, 2005. pp. 219-226. ASME. https://doi.org/10.1115/IMECE2005-80790
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