The objectives of this article are to suggest a way to evaluate the quality of polycrystalline silicon film from the thin film optics analysis and also to investigate the heat transfer characteristics in a rapid thermal annealing system for LCD manufacturing. The characteristic transmission matrix method is used to calculate the transmittance, and the predictions are compared with the experimental data for two different samples. The transient and one-dimensional conductive and radiative heat transfer equations are additionally solved to predict the surface temperatures of thin films. The two-flux method is also used for radiation and the ray-tracing method is utilized to consider the wave interference. As the film thickness increases, the peak transmittance increases and the wavelength for the peak becomes longer due to wave interferences. These characteristics can be used for in-situ and practical estimation of the silicon film quality during the crystallization process. From thermal analysis, it is shown that the selective heating in the multilayer film structure acts as an important mechanism during the annealing of silicon film deposited on the glass.
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ASME 2004 International Mechanical Engineering Congress and Exposition
November 13–19, 2004
Anaheim, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4711-X
PROCEEDINGS PAPER
Optical and Heat Transfer Characteristics in a Rapid Thermal Annealing System for LCD Manufacturing Procedures Available to Purchase
Joon Sik Lee
Joon Sik Lee
Seoul National University
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Seong Hyuk Lee
Chung-Ang University
Hyoung June Kim
Hongik University
Dong Hoon Shin
Viatron Technologies, Inc.
Young Ki Choi
Chung-Ang University
Seungho Park
Hongik University
Joon Sik Lee
Seoul National University
Paper No:
IMECE2004-61088, pp. 527-533; 7 pages
Published Online:
March 24, 2008
Citation
Lee, SH, Kim, HJ, Shin, DH, Choi, YK, Park, S, & Lee, JS. "Optical and Heat Transfer Characteristics in a Rapid Thermal Annealing System for LCD Manufacturing Procedures." Proceedings of the ASME 2004 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 3. Anaheim, California, USA. November 13–19, 2004. pp. 527-533. ASME. https://doi.org/10.1115/IMECE2004-61088
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