This paper proposes a new solution for high heat flux chip cooling. The authors attempted to apply Heatlane technology for a heat sink of high-end server chip cooling. This unique technology, which is also called oscillating or pulsating heat pipe, showed very high thermal performance, and the experimental results were compared with conventional copper base heat sink in this paper. The experimental and analysis results showed that the Heatlane technology transferred heat very effectively and highly improved the fin efficiency. And the Heatlane heat sink also showed very small gravity effect and high reliability under vibrating conditions. Those experimental results were also shown in this paper. From this study, the authors has convinced that the Heatlane technology for a heat sink can be a strong candidate to solve a thermal issue of high heat flux chip cooling, especially for high-end server applications.

This content is only available via PDF.
You do not currently have access to this content.