Knowledge of the mode-mixity (?) dependent interfacial fracture toughness (Γ) is needed to predict the interface delamination and the component reliability of thin-film structures. Mode-mixity, ?, is a measure of the relative shearing to tensile opening of the interface crack near the tip. Typically, Γ increases as ? increases, such that the delamination is less likely when the loading on the interface is shear-dominated. The measurement of mode-mixity dependent Γ has been a challenge for thin film interfaces. The single-strip superlayer test, developed by the authors, eliminates the shortcomings of current testing methods. This test employs a stress-engineered superlayer to drive the interfacial delamination between the thin-film and the substrate. An innovative aspect of the proposed test is to introduce a release layer of varying width between the interested interfaces to control the amount of energy available for delamination propagation. By designing a decreasing area of the release layer, it is possible to arrest the interfacial delamination at a given location, and the interfacial fracture toughness or critical energy release rate can be found at the location where the delamination ceases to propagate. Design, preparation, and execution of the test are presented. Results are shown for Ti/Si interfaces of different mode mixities.
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ASME 2004 International Mechanical Engineering Congress and Exposition
November 13–19, 2004
Anaheim, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4707-1
PROCEEDINGS PAPER
Superlayer Test for Interfacial Fracture Toughness Measurements
Jiantao Zheng,
Jiantao Zheng
Georgia Institute of Technology
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Suresh K. Sitaraman
Suresh K. Sitaraman
Georgia Institute of Technology
Search for other works by this author on:
Jiantao Zheng
Georgia Institute of Technology
Suresh K. Sitaraman
Georgia Institute of Technology
Paper No:
IMECE2004-61839, pp. 407-415; 9 pages
Published Online:
March 24, 2008
Citation
Zheng, J, & Sitaraman, SK. "Superlayer Test for Interfacial Fracture Toughness Measurements." Proceedings of the ASME 2004 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Anaheim, California, USA. November 13–19, 2004. pp. 407-415. ASME. https://doi.org/10.1115/IMECE2004-61839
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