With the rapid trend for miniaturization of electronic products, new optical techniques are increasingly needed for measuring the surface profile or deflection/warpage in the micro-scale for electronic packages mounted on printed circuit boards. In this paper, we reduced the grating spacing of the digital projection moire´ (DPM) by directing the grating pattern into a stereo zoom microscope and performed surface profile measurement under this microscope. In this method, the reference grating is generated digitally having sinusoidal intensity. Another digitally generated grating is projected by the means of a digital light processing (DLP) projector and a set of carefully arranged optical lens into the microscope to form the object grating. The pitch of micro-scaled object gratings can be adjusted by the reduction ratio of the microscope. As a result, this micro-scaled digital projection moire´ method produces micro object gratings on the order of 10-um pitch and is suitable for surface profile measurement in a square dimension on the order of 100-um. The method of linear mismatch is utilized to obtain more fringes in each measurement and the guideline to achieve the optimal degree of linear mismatch between the reference and the object gratings is proposed. In addition, the phase shifting technique is employed to extract the data between the recorded fringes. Verification of the method is demonstrated by measuring an inclined plane of a micro prism. The deviation between the measured data and the given values was found to be less than 5%, which demonstrates the validity of the developed method.
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ASME 2004 International Mechanical Engineering Congress and Exposition
November 13–19, 2004
Anaheim, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4707-1
PROCEEDINGS PAPER
Micro-Scaled Surface Profile Measurement on Packages by Digital Projection Moire´
Chia-Shou Chang,
Chia-Shou Chang
National Taiwan University
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Ching-An Shao,
Ching-An Shao
Chin Min Institute of Technology
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Enboa Wu
Enboa Wu
National Taiwan University
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Chia-Shou Chang
National Taiwan University
Ching-An Shao
Chin Min Institute of Technology
Enboa Wu
National Taiwan University
Paper No:
IMECE2004-59913, pp. 161-166; 6 pages
Published Online:
March 24, 2008
Citation
Chang, C, Shao, C, & Wu, E. "Micro-Scaled Surface Profile Measurement on Packages by Digital Projection Moire´." Proceedings of the ASME 2004 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Anaheim, California, USA. November 13–19, 2004. pp. 161-166. ASME. https://doi.org/10.1115/IMECE2004-59913
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