Recent trend in assembly techniques in automotive industry has shown that adhesive bonding is gaining new applications. The main problem faced with the usage of adhesives is the need to understand the effects of adhesive bonding on the dimensional tolerances. Adhesive shrinkage depends on various parameters like base metal’s surface roughness, reflectivity, curing intensity etc., to name a few. In order to allocate the shrinkage allowance, we need to establish the parameters affecting the shrinkage. For this, we need to design a set of experiments and design a measurement system for calculating the adhesive shrinkage. This paper discusses the development of typical real time measurement system used for volumetric shrinkage measurement. The system is integrated with specialized laser, rotary mechanism, imaging system, data acquisition and virtual instrument. The paper details a systematic methodology that can be easily duplicated, the initial design stages planned and executed, and the repeatability and reproducibility test results done on the initial system. The test data is stored in spreadsheet format along with other parameters under consideration like the base plate’s surface roughness, reflectivity, and curing intensity. Based on the initial study, the root cause analysis will be done and further tests will be conducted on the new system utilizing the taguchi method. The tests would help us find the parameters controlling the shrinkage and also their interdependence factors.
Skip Nav Destination
ASME 2003 International Mechanical Engineering Congress and Exposition
November 15–21, 2003
Washington, DC, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
0-7918-3720-3
PROCEEDINGS PAPER
Non-Contact Virtual Instrument Measurement System for Analyzing the Liquid Droplet Shrinkage Parameters
Suresh K. Ramasamy,
Suresh K. Ramasamy
University of Hartford, West Hartford, CT
Search for other works by this author on:
Devdas Shetty
Devdas Shetty
University of Hartford, West Hartford, CT
Search for other works by this author on:
Suresh K. Ramasamy
University of Hartford, West Hartford, CT
Devdas Shetty
University of Hartford, West Hartford, CT
Paper No:
IMECE2003-41729, pp. 329-337; 9 pages
Published Online:
May 12, 2008
Citation
Ramasamy, SK, & Shetty, D. "Non-Contact Virtual Instrument Measurement System for Analyzing the Liquid Droplet Shrinkage Parameters." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Manufacturing. Washington, DC, USA. November 15–21, 2003. pp. 329-337. ASME. https://doi.org/10.1115/IMECE2003-41729
Download citation file:
6
Views
Related Proceedings Papers
Characterization of Non-Conductive Adhesives
InterPACK2005
Related Articles
Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
J. Electron. Packag (December,2009)
Optical Measurements of Shrinkage in UV-Cured Adhesives
J. Electron. Packag (December,2002)
Analysis and Modeling of Laser Measurement System Performance for Wood Surface
J. Eng. Ind (February,1990)
Related Chapters
Case Studies
Taguchi Methods for Robust Design
Measurement System of Holographic Microwave Imaging
Basic Principles and Potential Applications of Holographic Microwave Imaging
Taguchi Methods for Challenges in Manufacturing
Taguchi Methods: Benefits, Impacts, Mathematics, Statistics and Applications