Boiling heat transfer and critical heat flux—CHF—in mist cooling were investigated experimentally. In particular, the heat transfer in the mist cooling for low droplet density was examined focusing on the effects of liquid and air flow rates and behaviors of droplets and a liquid film on the heat transfer characteristics. Steady heat transfer experiments of a copper block were conducted for mist flow of air and water in a range of air flow rate from 40 to 120 1N/min. Water flow rate was 0.3, 1.8, 4.0 and 8.0 1/hr, respectively. Three correlations of the mist cooling rate for non-boiling, evaporation of droplets and evaporation of the liquid film were developed with microscopic parameters of two-phase flow, respectively. Furthermore, a CHF model based on maximum evaporation rate of actual liquid fraction on a heater was presented through comparison with the present experimental results.
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ASME 2003 International Mechanical Engineering Congress and Exposition
November 15–21, 2003
Washington, DC, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3718-1
PROCEEDINGS PAPER
Study on Boiling Heat Transfer and Critical Heat Flux in Mist Cooling: Effect of Air Flow Rate on Heat Transfer and Behavior of Liquid on Heating Surface Available to Purchase
Hiroyasu Ohtake,
Hiroyasu Ohtake
Kogakuin University, Tokyo, Japan
Search for other works by this author on:
Yasuo Koizumi
Yasuo Koizumi
Kogakuin University, Tokyo, Japan
Search for other works by this author on:
Hiroyasu Ohtake
Kogakuin University, Tokyo, Japan
Yasuo Koizumi
Kogakuin University, Tokyo, Japan
Paper No:
IMECE2003-41604, pp. 55-59; 5 pages
Published Online:
May 12, 2008
Citation
Ohtake, H, & Koizumi, Y. "Study on Boiling Heat Transfer and Critical Heat Flux in Mist Cooling: Effect of Air Flow Rate on Heat Transfer and Behavior of Liquid on Heating Surface." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 4. Washington, DC, USA. November 15–21, 2003. pp. 55-59. ASME. https://doi.org/10.1115/IMECE2003-41604
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