This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of Integrated Power Electronics Modules (IPEM). This model is based on the expanded Lumped Thermal Capacitance Method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced to only time. Applying this procedure a simple, non-spatial, but highly non-linear model is obtained. Steady and transient results of the model are validated against results from a thermal analysis software tool, FLOTHERM 3.1™. A comparison between thermal results obtained with the reduced model and experimental data is presented indicating a need for incorporating the dynamic electrical performance in the reduced model. The development of this model presents an alternative to reduce the complexity level developed in commercial multidimensional and transient software for power electronics applications.
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ASME 2003 International Mechanical Engineering Congress and Exposition
November 15–21, 2003
Washington, DC, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3718-1
PROCEEDINGS PAPER
Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis Available to Purchase
M. Herna´ndez-Mora,
M. Herna´ndez-Mora
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
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J. E. Gonza´lez,
J. E. Gonza´lez
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
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M. Ve´lez-Reyes,
M. Ve´lez-Reyes
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
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J. M. Orti´z,
J. M. Orti´z
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
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Y. Pang,
Y. Pang
Virginia Polytechnic Institute and State University, Blacksburg, VA
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E. Scott
E. Scott
Virginia Polytechnic Institute and State University, Blacksburg, VA
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M. Herna´ndez-Mora
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
J. E. Gonza´lez
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
M. Ve´lez-Reyes
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
J. M. Orti´z
University of Puerto Rico at Mayagu¨ez, Mayagu¨ez, Puerto Rico
Y. Pang
Virginia Polytechnic Institute and State University, Blacksburg, VA
E. Scott
Virginia Polytechnic Institute and State University, Blacksburg, VA
Paper No:
IMECE2003-42446, pp. 291-298; 8 pages
Published Online:
May 12, 2008
Citation
Herna´ndez-Mora, M, Gonza´lez, JE, Ve´lez-Reyes, M, Orti´z, JM, Pang, Y, & Scott, E. "Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM): Part I — Thermal Analysis." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 2. Washington, DC, USA. November 15–21, 2003. pp. 291-298. ASME. https://doi.org/10.1115/IMECE2003-42446
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