The method of Design of Simulation (DOS) was used to guide and enhance a numerical simulation of fluid flow and heat transfer through offset-fin arrays which from the interior geometry of a cold plate. The basic problem involved 12 independent parameters. This prohibitive parametric burden was lessened by the creative use of nondimensionalization that was brought to fruition by a special transformation of the boundary conditions. Subsequent to the reduction of the number of parameters, the DOS method was employed to limit the number of simulation runs while maintaining an accurate representation of the parameter space. The DOS method also provided excellent correlations of both the dimensionless heat transfer and pressure drop results. The results were evaluated with respect to the Colburn Analogy for heat and momentum transfer. It was found that the offseting of the fins created a larger increase in the friction factor than that which was realized for the dimensionless heat transfer coefficient.
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ASME 2003 International Mechanical Engineering Congress and Exposition
November 15–21, 2003
Washington, DC, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3714-9
PROCEEDINGS PAPER
A DOS-Enhanced Numerical Simulation of Heat Transfer and Fluid Flow Through an Array of Offset Fins With Conjugate Heating in the Bounding Solid
Ephraim M. Sparrow,
Ephraim M. Sparrow
University of Minnesota, Minneapolis, MN
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John P. Abraham,
John P. Abraham
University of St. Thomas, St. Paul, MN
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Paul W. Chevalier
Paul W. Chevalier
University of Minnesota, Minneapolis, MN
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Ephraim M. Sparrow
University of Minnesota, Minneapolis, MN
John P. Abraham
University of St. Thomas, St. Paul, MN
Paul W. Chevalier
University of Minnesota, Minneapolis, MN
Paper No:
IMECE2003-42380, pp. 679-692; 14 pages
Published Online:
May 12, 2008
Citation
Sparrow, EM, Abraham, JP, & Chevalier, PW. "A DOS-Enhanced Numerical Simulation of Heat Transfer and Fluid Flow Through an Array of Offset Fins With Conjugate Heating in the Bounding Solid." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology. Washington, DC, USA. November 15–21, 2003. pp. 679-692. ASME. https://doi.org/10.1115/IMECE2003-42380
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