From a manufacturing perspective optoelectronics packaging is often quite immature and significant optimization still possible. This may, however, require some understanding of the optics as well as of the mechanical and thermal design, materials, and process issues. This is certainly the case for single mode laser diode packaging, where optical alignment and coupling plays a dominant role. Referring to a couple of current generic packages for illustration the present work offers a discussion of some of the manufacturing issues involved and potentials for improvements. This includes alternatives in terms of package design and contents, optical alignment and coupling schemes, and the use of laser welding, soldering, and adhesives.

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