This paper presents a residual stress analyses based on two bonding systems, silicon-aluminum-glass and silicon-aluminum-quartz, for MEMS packaging applications: The predicted residual stress generated in the Pyrex glass bonding system is 60 to 74 GPa that is close to the fracture strength of Pyrex glass at 69 GPa. In the quartz bonding system, the predicted residual stress is 100 to 207 GPa that far exceeds the fracture strength of Quartz at 48 GPa. Experimental results are consistent with analytical predictions that small cracks are found in the glass bonding system and big fracture lines are observed in the quartz bonding system. As such, this residual stress analysis model serves as an excellent tool to assist the development of new bonding systems in the areas of material selection, geometrical design of the bonding area and the dimensions of the bonding solders.

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