Following the increasing adoption of TFT-type LCD modules in mobile and other equipment, COG (chip-on-glass) mounting is being increasingly employed instead of TCP (tape carrier package) mounting to make LCD modules smaller, thinner, and cheaper. Since the IC and LCD panel electrodes are bonded together by the conductive particles embedded in ACF (anisotropic conductive film), the bonding conditions depend substantially on the respective characteristics of the IC electrodes and the conductive particles in the ACF. We examined the effects of the arrangement, area and material properties of IC electrodes and of the profile and material properties of conductive ACF particles.

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