In recent years, there has been an increasing demand for low temperature (<400°C) packaging technologies that can vacuum seal MEMS devices at the wafer level with a minimal amount of wasted die area. Several emerging classes of devices require wafer-level vacuum packaging. There has been growing development of micro-resonators for RF communications systems [1]. The devices require the high Q-factor performance generated by vacuum sealing in order to function as highly selective filters and oscillators. There has also been considerable development in the field of resonant gyroscopes [2], which also require a low pressure ambient for optimal performance. The rapid development of MEMS devices requiring low cost vacuum packaging has outpaced the development of suitable sealing technologies.

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