This paper presents an experimental investigation on the solder ball shear strength of plastic ball grid array (PBGA) packages. The emphasis is placed on showing the effect of room temperature aging on the degradation of solder ball shear strength. The specimens under investigation are standard commercial PBGA packages with 63Sn-37Pb eutectic solder balls. The specimens are subject to various lengths (up to 72 hours) of room temperature aging after the reflow. Afterwards, ball shear tests are performed to evaluate the solder ball shear strength. The experimental results show that the solder ball shear strength may drop up to 10% within 3 days of room temperature aging. The outcome of the present study may give a general guideline for the meaningful comparison of solder ball shear strength.
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ASME 2002 International Mechanical Engineering Congress and Exposition
November 17–22, 2002
New Orleans, Louisiana, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-3648-7
PROCEEDINGS PAPER
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
S. W. Ricky Lee,
S. W. Ricky Lee
Hong Kong University of Science and Technology, Kowloon, Hong Kong
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Yat-Kit Tsui,
Yat-Kit Tsui
Hong Kong University of Science and Technology, Kowloon, Hong Kong
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Xingjia Hunag,
Xingjia Hunag
Hong Kong University of Science and Technology, Kowloon, Hong Kong
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Eric C. C. Yan
Eric C. C. Yan
Hong Kong University of Science and Technology, Kowloon, Hong Kong
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S. W. Ricky Lee
Hong Kong University of Science and Technology, Kowloon, Hong Kong
Yat-Kit Tsui
Hong Kong University of Science and Technology, Kowloon, Hong Kong
Xingjia Hunag
Hong Kong University of Science and Technology, Kowloon, Hong Kong
Eric C. C. Yan
Hong Kong University of Science and Technology, Kowloon, Hong Kong
Paper No:
IMECE2002-39514, pp. 259-262; 4 pages
Published Online:
June 3, 2008
Citation
Lee, SWR, Tsui, Y, Hunag, X, & Yan, ECC. "Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls." Proceedings of the ASME 2002 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. New Orleans, Louisiana, USA. November 17–22, 2002. pp. 259-262. ASME. https://doi.org/10.1115/IMECE2002-39514
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