This paper presents an experimental investigation on the solder ball shear strength of plastic ball grid array (PBGA) packages. The emphasis is placed on showing the effect of room temperature aging on the degradation of solder ball shear strength. The specimens under investigation are standard commercial PBGA packages with 63Sn-37Pb eutectic solder balls. The specimens are subject to various lengths (up to 72 hours) of room temperature aging after the reflow. Afterwards, ball shear tests are performed to evaluate the solder ball shear strength. The experimental results show that the solder ball shear strength may drop up to 10% within 3 days of room temperature aging. The outcome of the present study may give a general guideline for the meaningful comparison of solder ball shear strength.

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