This paper presents the dynamic analysis of a thermoelastically actuated circular composite diaphragm, for MEMS applications. The diaphragm is used as an acoustic transmitter, actuated at ultrasonic frequencies via a diffused surface heater at its center. The principle of operation of the thermal actuator is the generation of an oscillating temperature gradient across the diaphragm cross-section due to Joule heating of the diffused heater, creating a thermal moment that results in out-of-plane bending of the diaphragm. The mechanical analysis of the diaphragm, modeled as a composite plate, is based on the classical laminated plate theory. The time harmonic heat conduction resulting from the Joule heating of the diffused surface heater, modeled as a surface heat flux input, is analyzed using the Fourier heat conduction model. Analytical expressions have been obtained for the temperature distribution, and the resulting thermal moment, and plate deflection.
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ASME 2002 International Mechanical Engineering Congress and Exposition
November 17–22, 2002
New Orleans, Louisiana, USA
Conference Sponsors:
- Microelectromechanical Systems
ISBN:
0-7918-3642-8
PROCEEDINGS PAPER
Thermoelastic Actuation: Solution for Circular Composite Plates With Application in MEMS
Venkataraman Chandrasekaran,
Venkataraman Chandrasekaran
University of Florida, Gainesville, FL
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Mark Sheplak,
Mark Sheplak
University of Florida, Gainesville, FL
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Louis N. Cattafesta,
Louis N. Cattafesta
University of Florida, Gainesville, FL
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Bhavani V. Sankar
Bhavani V. Sankar
University of Florida, Gainesville, FL
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Venkataraman Chandrasekaran
University of Florida, Gainesville, FL
Mark Sheplak
University of Florida, Gainesville, FL
Louis N. Cattafesta
University of Florida, Gainesville, FL
Bhavani V. Sankar
University of Florida, Gainesville, FL
Paper No:
IMECE2002-39328, pp. 327-332; 6 pages
Published Online:
June 3, 2008
Citation
Chandrasekaran, V, Sheplak, M, Cattafesta, LN, & Sankar, BV. "Thermoelastic Actuation: Solution for Circular Composite Plates With Application in MEMS." Proceedings of the ASME 2002 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. New Orleans, Louisiana, USA. November 17–22, 2002. pp. 327-332. ASME. https://doi.org/10.1115/IMECE2002-39328
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