Abstract

Reliability issues are discussed for a plastic laminate-based package with partially exposed die active area. Thermal-mechanical stresses are calculated with finite element analysis to examine the effect of encapsulant in comparison with a similar package with die fully encapsulated. Different material and geometry configurations are studied to assess the optimization of the package design.

Volume Subject Area:
Mechanics of SMT and Photonic Structures
Keywords:
exposed die, stress, finite element analysis
Topics:
Finite element analysis, Reliability, Stress, Design, Geometry, Laminates, Optimization
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Copyright © 2001 by The American Society of Mechanical Engineers
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