There is a need for a fast and effective electroplating process for 100 nm or smaller structures. It is necessary to develop effective and high throughput process that meets the needs for the required side wall step coverage and gapfill. This work investigates the effect of a non-contact physical mechanism (acoustic streaming) to enhance the convection of chemicals near the substrate and improve the gap fill characteristics for copper microplating process.

This content is only available via PDF.
You do not currently have access to this content.