Abstract
This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.
