Abstract
A new optical measurement method for evaluating the defects on silicon wafer surfaces quantitatively, applicable to in-process measurement, is presented. The experimental system for measuring the defects consists of a Fourier transform optical system using a high-power objective lens. In order to verify the feasibility of the applications of this method to automatic in-process measurement, a two-stage measurement for detecting and evaluating small particles, which are typical defects on silicon wafer surfaces, was carried out. The results showed that the proposed two-stage measurement method is effective for measuring small defects in the sub-micro meter scale size.
Volume Subject Area:
Sensor Based Control for Manufacturing and Mechatronic Systems
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