Fabrication and Packaging of Microfluidic Devices With SU-8 Epoxy

Sealed fluidic microchannels were fabricated from SU-8 epoxy, sandwiched between glass and silicon substrates. The process flow for fabricating microfluidic devices, including packaging, is described. Features integrated in the packaged device include sealed channels, electrical circuits, membrane for thermal isolation and pressure sensing, as well as interconnects for fluids and electrical signal. The resulting channel is optically transparent from all sides. The objective is to introduce a new fabrication technique for microfluidic systems that is both flexible and cost-effective, allowing new designs and mass-production capabilities.