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Proceedings Papers

Proceedings Volume Cover
ASME 1999 International Mechanical Engineering Congress and Exposition
November 14–19, 1999
Nashville, Tennessee, USA
Conference Sponsors:
  • ASME
ISBN:
978-0-7918-1653-0
Electronics Manufacturing Issues

Technologies in Electronic Manufacturing and Packaging: Increased Productivity and Quality

Interaction Between Wire and Ingot in Wiresaw Slicing
Fuqian Yang, J. C. M. Li, Imin Kao
IMECE 1999; 3-8https://doi.org/10.1115/IMECE1999-0910
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Topics: Wire , Deformation , Stiffness , Friction , Tension , Cutting , Displacement , Finite element analysis , Pressure
An Integrated Model for Electromagnetic Field and Heat Transfer in a Cylindrical Silicon Tube Growth System
A. Roy, Q.-S. Chen, H. Zhang, V. Prasad
IMECE 1999; 9-14https://doi.org/10.1115/IMECE1999-0911
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Topics: Electromagnetic fields , Heat transfer , Silicon , Computer simulation , Crystal growth , Cylinders , Furnaces , Graphite , Magnetic fields , Modeling
High-Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moiré Technique
Songbin Wei, E. Guan, Imin Kao, Fu-Pen Chiang
IMECE 1999; 15-20https://doi.org/10.1115/IMECE1999-0912
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Topics: Resolution (Optics) , Semiconductor wafers , Shades and shadows , Topology , Diffraction gratings , Diffraction patterns , Interpolation , Algorithms , Calibration , Diffraction
Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw
Milind Bhagavat, Imin Kao
IMECE 1999; 21-30https://doi.org/10.1115/IMECE1999-0913
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Topics: Abrasive machining , Brittleness , Computer simulation , Silicon , Abrasives , Cutting , Finite element analysis , Fracture (Materials) , Abrasion , Machining

Advanced Electronics Manufacturing, Packaging, and Process Technologies

Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials
Ryan Thorpe, Daniel F. Baldwin
IMECE 1999; 33-38https://doi.org/10.1115/IMECE1999-0914
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Topics: Event history analysis , Flip-chip , Flip-chip devices , Flow (Dynamics) , Reliability
Acoustic Emission Analysis for Fatigue Prediction of Lap Solder Joints in Mode Two Shear
Bryan J. Van De Wal, Gay Kendall, Chittaranjan Sahay
IMECE 1999; 39-45https://doi.org/10.1115/IMECE1999-0915
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Topics: Acoustic emissions , Fatigue , Shear (Mechanics) , Solder joints , Failure , Alloys , Oscilloscopes , Signals , Steel , Acoustics
Process Characterization and the Effect of Process Defects on Flip Chip Reliability
Brian J. Lewis, Hilary Sasso
IMECE 1999; 47-52https://doi.org/10.1115/IMECE1999-0916
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Topics: Flip-chip devices , Reliability , Solders , Manufacturing , Crack propagation , Delamination , Engineers , Failure mechanisms , Flip-chip assemblies , Optimization
Fundamental Analyses of Smart Tooling for Assembly of Thin Flexible Circuit and Board Systems
Ruijun Chen, Daniel F. Baldwin
IMECE 1999; 53-58https://doi.org/10.1115/IMECE1999-0917
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Topics: Circuits , Manufacturing , Tooling , Fixturing , Printed circuit boards , Design , Flexible electronics , Lumber , Printing , Reflow soldering

Electronics Manufacturing

Design and Manufacturing Issues

A Performance & Manufacturability Evaluation of Bump Chip Carrier Packages
Lei L. Mercado, Vijay Sarihan, Russell Fiorenzo
IMECE 1999; 61-67https://doi.org/10.1115/IMECE1999-0918
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Topics: Corners (Structural elements) , Finite element analysis , Manufacturing , Packaging density (Electronics) , Reliability , Solders , Thermomechanics , Warping
Artwork Scaling Factor for Inner Layers in Multi-Layer Board Manufacture
Owen Christofferson, Chittaranjan Sahay
IMECE 1999; 69-73https://doi.org/10.1115/IMECE1999-0919
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Topics: Circuits , Density , Manufacturing , Printed circuit boards
A Study of the Aperture Filling Process in Solder Paste Stencil Printing
Jianbiao Pan, Gregory L. Tonkay
IMECE 1999; 75-82https://doi.org/10.1115/IMECE1999-0920
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Topics: Printing , Solders , Ball-Grid-Array packaging , Surface mount assemblies , Flip-chip , Flip-chip devices , Packaging
Design and Implementation of a Flexible Intelligent Electronics Remanufacturing System
Ismail Fidan, Russell P. Kraft, Stephen J. Derby
IMECE 1999; 83-90https://doi.org/10.1115/IMECE1999-0921
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Topics: Circuits , Density , Design , Electronics , End effectors , Lasers , Lumber , Manufacturing , Printed circuit boards , Robotics

Thermal Management and Transport in Manufacturing

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages
V. H. Adams, K. Ramakrishna
IMECE 1999; 99-106https://doi.org/10.1115/IMECE1999-0922
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Topics: Electronic packages , Heating , Performance characterization , Silicon , Heat , Temperature , Thermal characterization , Ball-Grid-Array packaging , Engineering simulation , Junctions
Performance of Thermal Enhancements in Chip on Flex
Gary Miller, Chittaranjan Sahay
IMECE 1999; 107-110https://doi.org/10.1115/IMECE1999-0923
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Topics: Blocks (Building materials) , Construction , Density , Economics , Engines , Integrated circuits
Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock
Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook
IMECE 1999; 111-119https://doi.org/10.1115/IMECE1999-0924
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Topics: Thermal shock , Transients (Dynamics) , Computational fluid dynamics , Stress , Boundary-value problems , Ball-Grid-Array packaging , Flip-chip , Heat transfer , Heat transfer coefficients , Molded plastics
Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques
Bahgat Sammakia, Sanjeev Sathe
IMECE 1999; 121-138https://doi.org/10.1115/IMECE1999-0925
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Topics: Manufacturing , Heat sinks , Adhesives , Delamination , Design , Lamination , Signals , Stress , Accounting , Ball-Grid-Array packaging

Structural Mechanics and Materials Issues in Manufacturing

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu
IMECE 1999; 139-147https://doi.org/10.1115/IMECE1999-0926
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Topics: Fracture (Materials) , Nucleation (Physics) , Damage , Cycles , Crack propagation , Dislocations , Fatigue cracks , Fracture mechanics , Microscale devices , Springs
Constitutive and Cyclic Damage Model of 63Sn-37Pb Solder
V. Stolkarts, L. M. Keer, M. E. Fine
IMECE 1999; 149-154https://doi.org/10.1115/IMECE1999-0927
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Topics: Damage , Solders , Fatigue , Thermomechanics
A Dual-Phase-Lag Diffusion Model for Predicting Thin Film Growth
J. K. Chen, J. E. Beraun, D. Y. Tzou
IMECE 1999; 155-161https://doi.org/10.1115/IMECE1999-0928
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Topics: Diffusion (Physics) , Thin films , Density , Model validation , Oxidation , Silicon
Effect of Volume on Ceramic Ball-Grid Array Solder Life
Stephen A. McKeown, Chittaranjan Sahay
IMECE 1999; 163-167https://doi.org/10.1115/IMECE1999-0929
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Topics: Ceramics , Solders , Finite element analysis , Solder joints , Cycles , Fatigue life , Modeling , Temperature
In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging
Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
IMECE 1999; 169-179https://doi.org/10.1115/IMECE1999-0930
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Topics: Packaging , Warping , Dielectric materials , Lasers , Stainless steel , Temperature , Thin films , Vehicles
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