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ASME 1998 International Mechanical Engineering Congress and Exposition

November 15–20, 1998

Anaheim, California, USA

Conference Sponsors:

ASME

ISBN:

978-0-7918-1591-5

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In This Volume

Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (17)

Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures

On the Life Prediction and Accelerated Testing of Solder Joints

Zhengfang Qian, Sheng Liu

IMECE 1998; 1-11doi:https://doi.org/10.1115/IMECE1998-0422

Abstract

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Topics: Solder joints , Testing , Fatigue life , Flip-chip packages , Constitutive equations , Finite element analysis , Finite element model , Modeling , Solders , Temperature

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen

IMECE 1998; 13-20doi:https://doi.org/10.1115/IMECE1998-0423

Abstract

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Topics: Ball-Grid-Array packaging , Reliability , Solder joints , Ball-Grid-Array packages , Design , Fatigue , Geometry , Corners (Structural elements) , Finite element analysis , Manufacturing

On Enhancing Eutectic Solder Joint Reliability Using a 2^nd-Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng

IMECE 1998; 21-25doi:https://doi.org/10.1115/IMECE1998-0424

Abstract

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Topics: Reliability , Solder joints , Solders , Ball-Grid-Array packaging , Geometry , Fatigue life , Flip-chip , Flip-chip devices , Materials properties

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin

IMECE 1998; 27-33doi:https://doi.org/10.1115/IMECE1998-0425

Abstract

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Topics: Flip-chip , Flip-chip devices , Manufacturing , Flow (Dynamics) , Solders , Vehicles , Compression , Ovens , Printing

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu

IMECE 1998; 35-42doi:https://doi.org/10.1115/IMECE1998-0426

Abstract

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Topics: Flip-chip packages , Manufacturing , Reliability , Solders , Simulation results , Finite element analysis , Finite element model , Interferometry , Warping , Contamination

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Minfu Lu, Zhengfang Qian, Sheng Liu, Jianhau Wu

IMECE 1998; 43-49doi:https://doi.org/10.1115/IMECE1998-0427

Abstract

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Topics: Fatigue testing , Linear motors , Solder joints , Fatigue , Damage , Engines , Motors , Solders , Failure , Fracture (Materials)

Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moiré and Finite Element Method

D. S. Liu, S. C. Hsu, Y. C. Tung

IMECE 1998; 51-58doi:https://doi.org/10.1115/IMECE1998-0428

Abstract

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Topics: Finite element methods , Thermal deformation , Finite element model , Testing , Computer simulation , Constitutive equations , Deformation , Design , Dimensions , Interferometry

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

IMECE 1998; 59-64doi:https://doi.org/10.1115/IMECE1998-0429

Abstract

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Topics: Circuits , Control equipment , Corners (Structural elements) , Deformation , Density , Displacement , Electronic packages , Flip-chip , Flip-chip packages , Interferometers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu

IMECE 1998; 65-70doi:https://doi.org/10.1115/IMECE1998-0430

Abstract

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Topics: Warping , Deformation , Ball-Grid-Array packaging , Shapes , Computer software , Diffraction gratings , Imaging , Manufacturing , Modeling , Packaging

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

K. Kurabayashi, M. Asheghi, M. N. Touzelbaev, K. E. Goodson

IMECE 1998; 71-81doi:https://doi.org/10.1115/IMECE1998-0431

Abstract

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Topics: Anisotropy , Electronic systems , Polymer films , Thermal characterization , Micromachining , Temperature , Thermal conductivity , Actuators , Heating , Integrated circuits

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Tomoo Kayaba, Akinori Inoue, Masumi Saka, Hiroyuki Abé

IMECE 1998; 83-85doi:https://doi.org/10.1115/IMECE1998-0432

Abstract

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Topics: Diamonds , Molecular dynamics , Nucleation (Physics) , Silicon , Atoms , Carbon , Chemical vapor deposition , Diamond films , Simulation , Aluminum

Analysis of Electromigration Considering Thomson Effect

Kazuhiko Sasagawa, Manabu Yagi, Masumi Saka, Hiroyuki Abé

IMECE 1998; 87-92doi:https://doi.org/10.1115/IMECE1998-0433

Abstract

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Topics: Electrodiffusion , Thermoelectricity , Temperature distribution , Metals , Corners (Structural elements) , Current density , Damage , Temperature

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han

IMECE 1998; 93-99doi:https://doi.org/10.1115/IMECE1998-0434

Abstract

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Topics: Interferometry , Microelectronic devices , Warping , Surface roughness , Computers , Design for Manufacturing , Infrared radiation , Surface topography

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin

IMECE 1998; 101-106doi:https://doi.org/10.1115/IMECE1998-0435

Abstract

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Topics: Flip-chip assemblies , Stress analysis (Engineering) , Stress , Reliability , Cycles , Accelerated life testing , Electronic packages , Failure , Manufacturing , Simulation models

Die Stress Measurements Using High Temperature Die-Attachment Materials

Yida Zou, Jeffrey C. Suhling, Richard C. Jaeger, Shun-Tien Lin, Jeffrey T. Benoit, Richard R. Grzybowski

IMECE 1998; 107-117doi:https://doi.org/10.1115/IMECE1998-0436

Abstract

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Topics: High temperature , Stress , Temperature , Adhesives , Sensors , Ceramics , Engineering simulation , Finite element analysis , Glass , Packaging

Flow Modeling and Validation of the Encapsulation of Plastic Packages

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang

IMECE 1998; 119-134doi:https://doi.org/10.1115/IMECE1998-0437

Abstract

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Topics: Flow (Dynamics) , Modeling , Simulation , Chemically reactive flow , Computer software , Computer-aided design , Cycles , Deformation , Design , Design for Manufacturing

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Yifan Guo, Dianne Mitchell, Vijay Sarihan, Dawei Zheng

IMECE 1998; 135-140doi:https://doi.org/10.1115/IMECE1998-0438

Abstract

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Topics: Semiconductor wafers , Stress , Testing , Membranes , Sensors , Pressure sensors , Deformation , Residual stresses , Signals

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Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures

On the Life Prediction and Accelerated Testing of Solder Joints

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

On Enhancing Eutectic Solder Joint Reliability Using a 2^nd-Reflow-Process Approach

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moiré and Finite Element Method

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Automatic Warpage Measurement of Advanced Packages by Optical Method

Thermal Characterization of Anisotropic Polymer Films for Electronic Systems

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Analysis of Electromigration Considering Thomson Effect

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Die Stress Measurements Using High Temperature Die-Attachment Materials

Flow Modeling and Validation of the Encapsulation of Plastic Packages

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

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