Skip Nav Destination
Proceedings Papers
In This Volume
Manufacturing Science and Engineering: Volume 1
Sensor Fused Intelligent Machining Systems
A Multi-Purpose Laser Sensor for Cutting Tools
IMECE 1997; 9-14https://doi.org/10.1115/IMECE1997-1069
Topics:
Cutting tools
,
Lasers
,
Sensors
,
Milling
,
Displacement
,
Geometry
,
Chatter
,
Engineering prototypes
,
Failure
,
Laser beams
Open Architecture Modular Tool Kit for Motion and Machining Process Control
IMECE 1997; 15-22https://doi.org/10.1115/IMECE1997-1070
Topics:
Computer numerical control machine tools
,
Machining
,
Process control
,
Robots
,
Computers
,
Lumber
,
Machine tools
,
Computer software
,
Control systems
,
Sensors
A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems
IMECE 1997; 23-30https://doi.org/10.1115/IMECE1997-1071
Topics:
Bearings
,
Control systems
,
Design
,
Machine tool spindles
,
Stress
,
Thermomechanics
,
Roller bearings
,
Thermal expansion
,
Centrifugal force
,
Deflection
Integrated Digitizing, Path Planning, and Five-Axis Machining for the Refurbishment of Compressor and Turbine Blades
IMECE 1997; 31-38https://doi.org/10.1115/IMECE1997-1072
Topics:
Compressors
,
Machining
,
Path planning
,
Turbine blades
,
Blades
,
Shapes
,
Aircraft engines
,
Computers
,
Integrated systems
,
Machine tools
PC Based Open Architecture Machine Tool Control
IMECE 1997; 39-48https://doi.org/10.1115/IMECE1997-1073
Topics:
Machine tools
,
Machinery
,
Control equipment
,
Control systems
,
Design
,
Machining
,
Process monitoring
,
Vibration
Flexible Monitoring Strategies for Milling Operations
IMECE 1997; 83-90https://doi.org/10.1115/IMECE1997-1079
Topics:
Milling
,
Machining
,
Drilling
,
Evaluation methods
,
Manufacturing
,
Process monitoring
Active Structural Control of Vertical Turning Lathe Vibrations
IMECE 1997; 105-112https://doi.org/10.1115/IMECE1997-1082
Topics:
Turning
,
Vibration
,
Control equipment
,
Signals
,
Accelerometers
,
Actuators
,
Capacitors
,
Chatter
,
Control systems
,
Electronic components
Prediction of Shear Angle in Oblique Cutting With Maximum Shear Stress and Minimum Energy Principles
IMECE 1997; 121-128https://doi.org/10.1115/IMECE1997-1084
Topics:
Cutting
,
Shear (Mechanics)
,
Shear stress
,
Deformation
,
Flow (Dynamics)
,
Friction
,
Geometry
,
Kinematics
,
Materials properties
,
Milling
Development of a Magnetostrictive Torque Sensor for Milling Process Monitoring
IMECE 1997; 129-136https://doi.org/10.1115/IMECE1997-1085
Topics:
Milling
,
Process monitoring
,
Sensors
,
Torque
,
Cutting
,
Alloys
,
Failure
,
Fracture (Materials)
,
Fracture (Process)
,
Permeability
Quality of Traditionally and Nontraditionally Machined Surfaces: Modeling, Analysis and Measurement
Modeling Texture of Peripheral-Milled Surfaces Using a Neural Network and Fractal Method With Evidence of Chaos
IMECE 1997; 153-160https://doi.org/10.1115/IMECE1997-1088
Topics:
Artificial neural networks
,
Chaos
,
Fractals
,
Modeling
,
Texture (Materials)
,
Splines
,
Cutting
,
Deflection
,
Dimensions
,
Displacement
Experimental Study of the Pre-Stressing Capability Through Residual Stress Generation in Superfinish Machining of Hardened Steel
IMECE 1997; 197-207https://doi.org/10.1115/IMECE1997-1093
Topics:
Machining
,
Martensitic steel
,
Stress
,
Finishes
,
Fatigue life
,
Grinding
,
Turning
,
Compressive stress
,
Diamonds
,
Fatigue
Mechanics of Polishing
IMECE 1997; 225-233https://doi.org/10.1115/IMECE1997-1096
Topics:
Polishing
,
Particulate matter
,
Particle size
,
Manganese (Metal)
,
Microhardness
,
Stress
Residual Stresses and Workpiece Deformation due to Polishing and Plating of Computer Hard Disk Substrates
IMECE 1997; 235-244https://doi.org/10.1115/IMECE1997-1097
Topics:
Computers
,
Deformation
,
Disks
,
Plating
,
Polishing
,
Residual stresses
,
Stress
,
Aluminum alloys
,
Displacement
,
Model development
A Dynamic Model for Bound Abrasive Grinding of Optical Materials: The Effect of Grinding Conditions on the Workpiece Surface Quality
IMECE 1997; 253-259https://doi.org/10.1115/IMECE1997-1099
Topics:
Dynamic models
,
Grinding
,
Optical materials
,
Surface quality
,
Computer numerical control machine tools
,
Machinery
,
Machining
,
Stiffness
,
Stress
Automatic Deburring and Finishing Methods: Nontraditional and Traditional Processes
Development of Force-Control Model for Edge-Deburring With Filamentary Brush
IMECE 1997; 281-291https://doi.org/10.1115/IMECE1997-1102
Topics:
Deburring
,
Force control
,
Machining
,
Finishing
,
Damage
,
Errors
,
Geometry
,
Manufacturing engineering
,
Risk
,
Uncertainty
Striation Formation and Surface Finish in Laser Cutting of Mild Steel
IMECE 1997; 301-307https://doi.org/10.1115/IMECE1997-1104
Topics:
Finishes
,
Laser cutting
,
Steel
,
Cutting
,
Lubrication theory
,
Oxidation
,
Diffusion (Physics)
,
Heat transfer
,
Liquid films
,
Rupture
Process Sensoring, Monitoring, Modeling and Verification in Electronic Packaging — Part A
Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
IMECE 1997; 377-382https://doi.org/10.1115/IMECE1997-1113
Topics:
Modeling
,
Polymer films
,
Viscoelasticity
,
Viscoplasticity
,
Deformation
,
Stress
,
Chain
,
Constitutive equations
,
Drag (Fluid dynamics)
,
Temperature effects
Prediction of the Solder Joint Configuration Under Various Geometric Parameters
IMECE 1997; 397-400https://doi.org/10.1115/IMECE1997-1116
Topics:
Solder joints
,
Shapes
,
Electronic packaging
,
Energy conservation
,
Gravity (Force)
,
Numerical analysis
,
Shape design
,
Solders
,
Surface tension
,
Weight (Mass)
Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions
IMECE 1997; 411-421https://doi.org/10.1115/IMECE1997-1118
Topics:
Fracture toughness
,
Fracture (Materials)
,
Temperature
,
Stress
,
Displacement
,
Finite element analysis
,
Interferometry
,
Molding
,
Silicon
,
Density
Process Sensoring, Monitoring, Modeling and Verification in Electronic Packaging — Part B
Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
IMECE 1997; 439-446https://doi.org/10.1115/IMECE1997-1121
Topics:
Modeling
,
Semiconductor wafers
,
Stress
,
Particulate matter
,
Wire
,
Cutting
,
Silicon
,
Abrasives
,
Fracture (Materials)
,
Slurries
New Concepts in Manufacturing Engineering Education
Video Based Manufacturing Courses for Electronics
IMECE 1997; 471-477https://doi.org/10.1115/IMECE1997-1126
Topics:
Electronics
,
Manufacturing
,
Defense industry
,
Packaging
,
Students
,
Wire
Email alerts
Most Read Proceedings Papers in IMECE
IMECE2024 Front Matter
IMECE2024
IMECE2024 Front Matter
IMECE2024