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ASME 1997 International Mechanical Engineering Congress and Exposition

November 16–21, 1997

Dallas, Texas, USA

Conference Sponsors:

ASME

ISBN:

978-0-7918-1852-7

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CAE/CAD and Thermal Management Issues in Electronic Systems (12)

CAE/CAD and Thermal Management Issues in Electronic Systems

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

A.-F. Bastawros, A. G. Evans

IMECE 1997; 1-6https://doi.org/10.1115/IMECE1997-1208

Abstract

View Articletitled, Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

PDF

Topics: Aluminum alloys , Foams (Chemistry) , Heat sinks , Cross-flow , Cylinders , Dimensions , Fluid dynamics , Fluids , Heat transfer coefficients , Pressure drop

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.

IMECE 1997; 7-12https://doi.org/10.1115/IMECE1997-1209

Abstract

View Articletitled, Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

PDF

Topics: Solders , Thermomechanics , Ceramics , Cracking (Materials) , Cycles , Design , Energy dissipation , Fatigue life , Finite element methods , Finite element model

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

IMECE 1997; 13-21https://doi.org/10.1115/IMECE1997-1210

Abstract

View Articletitled, Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

PDF

Topics: Automotive industry , Ball-Grid-Array packaging , Temperature , Junctions , Printed circuit boards , Computational fluid dynamics , Thermal conductivity , Heat transfer , Transients (Dynamics) , Energy dissipation

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton

IMECE 1997; 23-31https://doi.org/10.1115/IMECE1997-1211

Abstract

View Articletitled, Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

PDF

Topics: Electronic packaging , Manufacturing , Printed circuit boards , Product quality , Warping , Ovens , Economics , Materials properties , Temperature , Thermomechanics

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Diego R. Tamburini, Russell S. Peak, Robert E. Fulton

IMECE 1997; 33-45https://doi.org/10.1115/IMECE1997-1212

Abstract

View Articletitled, Driving PWA Thermomechanical Analysis From Step AP210 Product Models

PDF

Topics: Thermomechanics , Design , Arches , Computer programming , Electrical wires , Geometry , Manufacturing , Mentoring , Product design , Thrust

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau

IMECE 1997; 47-54https://doi.org/10.1115/IMECE1997-1213

Abstract

View Articletitled, The Recommended Geometry for Laminar Microchannel Heat Sinks

PDF

Topics: Geometry , Heat sinks , Microchannels , Design , Coolants , Cooling , Heat flux , Heat transfer , Integrated circuits , Optical instruments

Experimental Study of Automotive Brake System Temperatures

A. F. Emery, P. Kumar, J. C. Firey

IMECE 1997; 55-64https://doi.org/10.1115/IMECE1997-1214

Abstract

View Articletitled, Experimental Study of Automotive Brake System Temperatures

PDF

Topics: Automotive brakes , Temperature , Brakes , Braking , Fluids , Boiling , Disks , Vehicles , Energy dissipation , Failure

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

IMECE 1997; 65-73https://doi.org/10.1115/IMECE1997-1215

Abstract

View Articletitled, Transient Thermal Analysis of Outdoor Electronic Equipment

PDF

Topics: Electronic equipment , Thermal analysis , Transients (Dynamics) , Temperature , Cycles , Design , Electronic components , Flow (Dynamics) , Junctions , Reliability

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki

IMECE 1997; 75-81https://doi.org/10.1115/IMECE1997-1216

Abstract

View Articletitled, Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

PDF

Topics: Multi-chip modules , Thermal analysis , Transients (Dynamics) , Density , Design , Electronic circuits , Energy dissipation , Heat , Packaging , Reliability

Natural Convection Heat Sink With Heated Shroud

Andrew T. Morrison, S. M. You

IMECE 1997; 83-88https://doi.org/10.1115/IMECE1997-1217

Abstract

View Articletitled, Natural Convection Heat Sink With Heated Shroud

PDF

Topics: Heat sinks , Natural convection , Heat , Stress , Boundary layers , Clearances (Engineering) , Heat flux , Heat transfer , Laminar flow , Plates (structures)

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

Chang J. Park, Deborah A. Kaminski

IMECE 1997; 89-97https://doi.org/10.1115/IMECE1997-1218

Abstract

View Articletitled, Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

PDF

Topics: Bolted joints , Contact resistance , Plates (structures) , Separation (Technology) , Calibration , Equations , Finishes , Finite element methods , Materials properties , Metals

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Chang J. Park, Deborah A. Kaminski

IMECE 1997; 99-108https://doi.org/10.1115/IMECE1997-1219

Abstract

View Articletitled, Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

PDF

Topics: Bolted joints , Contact resistance , Plates (structures) , Boundary-value problems , Copper , Pressure , Cooling , Design , Finishes , Geometry

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CAE/CAD and Thermal Management Issues in Electronic Systems

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

The Recommended Geometry for Laminar Microchannel Heat Sinks

Experimental Study of Automotive Brake System Temperatures

Transient Thermal Analysis of Outdoor Electronic Equipment

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Natural Convection Heat Sink With Heated Shroud

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 1 — Study of Contact Area

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

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