Skip Nav Destination

Proceedings Papers

Select Year

Select Volume

ASME 1997 International Mechanical Engineering Congress and Exposition

November 16–21, 1997

Dallas, Texas, USA

Conference Sponsors:

ASME

ISBN:

978-0-7918-1850-3

Previous Volume
Next Volume

In This Volume

Applications of Experimental Mechanics to Electronic Packaging (19)

Applications of Experimental Mechanics to Electronic Packaging

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

IMECE 1997; 1-5doi:https://doi.org/10.1115/IMECE1997-1220

Abstract

View Article

PDF

Topics: Stress , Sensors , Silicon , Circuits , Electronic packages , Energy dissipation , Integrated circuits , Operating temperature , Reliability , Resistors

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

IMECE 1997; 7-14doi:https://doi.org/10.1115/IMECE1997-1221

Abstract

View Article

PDF

Topics: Density , Electronics , Flip-chip , Flip-chip assemblies , Flip-chip devices , Fracture (Materials) , Fracture (Process) , Glass transition , Manufacturing , Printed circuit boards

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

IMECE 1997; 15-21doi:https://doi.org/10.1115/IMECE1997-1222

Abstract

View Article

PDF

Topics: Silicon , Stress , Finite element analysis , Temperature , Constitutive equations , Electronic packaging , Engineering simulation , Packaging , Sensors , Shear stress

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

IMECE 1997; 23-27doi:https://doi.org/10.1115/IMECE1997-1223

Abstract

View Article

PDF

Topics: Accelerated life testing , Membranes , Sensors , Reliability , Testing , Failure , High temperature , Stress , Cycles , Deformation

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger

IMECE 1997; 29-36doi:https://doi.org/10.1115/IMECE1997-1224

Abstract

View Article

PDF

Topics: Hydrostatics , Sensors , Stress , Hydrostatic testing , Resistors , Calibration , Manufacturing , Pressure , Pressure vessels , Semiconductor wafers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona

IMECE 1997; 37-43doi:https://doi.org/10.1115/IMECE1997-1225

Abstract

View Article

PDF

Topics: Semiconductor wafers , Temperature , Waves , Acoustics , Fibers , Interferometers , Mechanical properties , Nondestructive evaluation , Splines , Thermomechanics

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

G. Andrew Rabroker, C. Steve Suh, Christian P. Burger, Ravinder Chona

IMECE 1997; 45-50doi:https://doi.org/10.1115/IMECE1997-1226

Abstract

View Article

PDF

Topics: Lasers , Semiconductor wafers , Stress , Temperature measurement , Waves , Temperature , Anisotropy , Dispersion relations , Elastic constants , Rapid thermal processing

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

IMECE 1997; 51-57doi:https://doi.org/10.1115/IMECE1997-1227

Abstract

View Article

PDF

Topics: Creep , Finite element methods , Finite element model , Interferometry , Modeling , Epoxy adhesives , Epoxy resins , Molding , Constitutive equations , Deformation

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

IMECE 1997; 59-67doi:https://doi.org/10.1115/IMECE1997-1228

Abstract

View Article

PDF

Topics: Sensors , Stress , Resistors , Silicon , Anisotropy , Electronic packaging , Heat conduction , Semiconductor wafers , Simulation results , Temperature

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

IMECE 1997; 69-76doi:https://doi.org/10.1115/IMECE1997-1229

Abstract

View Article

PDF

Topics: Corners (Structural elements) , Deformation , Interferometry , Computer software , Electronic packaging , Failure , Flip-chip , Flip-chip packages , Image processing , Nanoscale phenomena

Measurement of Solder-Copper Interfacial Fracture Parameters Using u₂-Displacement Fields

H. V. Tippur, H. Krishnamoorthy

IMECE 1997; 77-84doi:https://doi.org/10.1115/IMECE1997-1230

Abstract

View Article

PDF

Topics: Copper , Displacement , Fracture (Materials) , Solders , Deformation , Fracture toughness , Interferometry , Strain gages

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

IMECE 1997; 85-90doi:https://doi.org/10.1115/IMECE1997-1231

Abstract

View Article

PDF

Topics: Electronic packaging , Testing , Cycles , Design , Electronic packages , Electronics , Engineering disciplines , Event history analysis , Experimental methods , Packaging

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

I. Mohammed, K. M. Liechti

IMECE 1997; 91-95doi:https://doi.org/10.1115/IMECE1997-1232

Abstract

View Article

PDF

Topics: Corners (Structural elements) , Fracture (Materials) , Nucleation (Physics) , Eigenvalues , Stress , Elasticity , Geometry , Microelectronic devices , Structural elements (Construction)

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo

IMECE 1997; 97-103doi:https://doi.org/10.1115/IMECE1997-1233

Abstract

View Article

PDF

Topics: Interferometry , Displacement , Computer software , Phase diagrams , Computer programming , Deformation , Diffraction gratings , Electronic packages , Flip-chip

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu

IMECE 1997; 105-112doi:https://doi.org/10.1115/IMECE1997-1234

Abstract

View Article

PDF

Topics: Modeling , Polymer films , Testing , Thermomechanics , Nylon film

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards

IMECE 1997; 113-116doi:https://doi.org/10.1115/IMECE1997-1235

Abstract

View Article

PDF

Topics: Polysilicon , Tensile testing , Thin films , Testing , ASTM International , Mechanical properties , Displacement , Fracture (Materials) , Fracture toughness , Mechanical testing

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Bernd Michel, Dietmar Vogel, Andreas Schubert, Jürgen Auersperg, Herbert Reichl

IMECE 1997; 117-123doi:https://doi.org/10.1115/IMECE1997-1236

Abstract

View Article

PDF

Topics: Algorithms , Computers , Displacement , Displacement measurement , Electron microscopy , Electronic packaging , Engineering simulation , Failure , Finite element analysis , Flip-chip assemblies

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

IMECE 1997; 125-130doi:https://doi.org/10.1115/IMECE1997-1237

Abstract

View Article

PDF

Topics: Alloys , Mechanical properties , Solders , Fatigue , Lead-free solders , Computers , Creep , Electronic packaging , Strips , Testing

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

A. Shirani, K. M. Liechti, F. J. Boerio

IMECE 1997; 131-133doi:https://doi.org/10.1115/IMECE1997-1238

Abstract

View Article

PDF

Topics: Fracture (Materials) , Fracture (Process) , Metals , Adhesives , Aluminum , Modeling

All Years

Email alerts

Latest Conference Proceedings Alert

Most Read Proceedings Papers in IMECE

IMECE2021 Front Matter

IMECE2021

Smart Travel Mug for Hot and Cold Beverages

IMECE2017

Compression and Hysteresis Curves of Nonlinear Polyurethane Foams Under Different Densities, Strain Rates and Different Environmental Conditions

IMECE2011

Simulation and Analysis of Transient Fuel Cell System Performance Based on a Dynamic Reactant Flow Model

IMECE2002

Image-Guided Multi-Response Modeling and Characterization of Design Defects in Metal Additive Manufacturing

IMECE2021

Applications of Experimental Mechanics to Electronic Packaging

Advances in Stress Test Chips

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Hydrostatic Response of Piezoresistive Stress Sensors

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Evaluation of Die Stress Using van der Pauw Sensors

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Measurement of Solder-Copper Interfacial Fracture Parameters Using u₂-Displacement Fields

Testing and Measurement Techniques Applied to Electronic Packaging Development

Moiré Interferometric Analysis of Crack Nucleation From Bimaterial Corners

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Advances in Tensile Testing of Polysilicon Thin Films

The MicroDAC Method: A Powerful Means for Microdeformation Analysis in Electronic Packaging

Thermal Mechanical Properties of Two Solder Alloys

Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters

Email alerts

Most Read Proceedings Papers in IMECE

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Proceedings Papers

Applications of Experimental Mechanics to Electronic Packaging

Email alerts

Most Read Proceedings Papers in IMECE

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only