Topics: Avionics , Design , Electronic packaging , Aeronautics , Aviation , Electronic packages , Engineers , Failure , Finite element methods , Packaging

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan

IMECE 1997; 15-20https://doi.org/10.1115/IMECE1997-0811

Abstract

View Articletitled, Assessment of Chip-Scale Package Design Options

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Topics: Design , Manufacturing , Simulation , Density , Equipment performance , Finite element analysis , Flip-chip , Shrinkage (Materials) , Thermal stresses

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella

IMECE 1997; 21-31https://doi.org/10.1115/IMECE1997-0812

Abstract

View Articletitled, Manufacturability of Underfill Processing for Low Cost Flip Chip

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Topics: Flip-chip , Flip-chip devices , Flow (Dynamics) , Compression , Electronics , Manufacturing , Printed circuit boards , Reliability , Semiconductor devices , Surface mount packaging

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

IMECE 1997; 33-54https://doi.org/10.1115/IMECE1997-0813

Abstract

View Articletitled, Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

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Topics: Epoxy adhesives , Epoxy resins , Glass fibers , Stress , Fibers , Buckling , Delamination , Design , Metals , Optical fiber

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee

IMECE 1997; 55-63https://doi.org/10.1115/IMECE1997-0814

Abstract

View Articletitled, Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

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Topics: Ball-Grid-Array packaging , Ceramics , Computer simulation , Die cutting , Disks , Displacement , Finite element analysis , Finite element methods , Flip-chip packages , Geometry

Low Cost Plastic Packaging of the Network Interface Unit

M. A. Zimmerman

IMECE 1997; 65-80https://doi.org/10.1115/IMECE1997-0815

Abstract

View Articletitled, Low Cost Plastic Packaging of the Network Interface Unit

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Topics: Packaging , Electronics , Snap fitting , Design , Fire resistance , Gaskets , Heat , Hinges , Injection molded plastics , Low temperature

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Qazi S. Ilyas, Ephraim Suhir

IMECE 1997; 81-88https://doi.org/10.1115/IMECE1997-0816

Abstract

View Articletitled, “Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

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Topics: Failure , Electronic packages , Microelectronic devices , Molding , Optical fiber , Structural analysis

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

IMECE 1997; 89-139https://doi.org/10.1115/IMECE1997-0817

Abstract

View Articletitled, Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

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Topics: Failure , Adhesion , Fracture mechanics , Manufacturing , Mechanical behavior , Microelectronic devices , Modeling , Molding , Reliability , Surfaces (Materials)

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir

IMECE 1997; 141-170https://doi.org/10.1115/IMECE1997-0818

Abstract

View Articletitled, Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

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Topics: Diffusion (Physics) , Epoxy adhesives , Epoxy resins , Molding , Particulate matter , Fillers (Materials) , Stress , Weight (Mass) , Electronic packaging , Indium compounds

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott

IMECE 1997; 171-206https://doi.org/10.1115/IMECE1997-0819

Abstract

View Articletitled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

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Topics: Composite materials , Molding , Thermoelasticity , Fillers (Materials) , Thermal stresses , Epoxy adhesives , Epoxy resins , Design , Integrated circuits , Reliability

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

IMECE 1997; 207-217https://doi.org/10.1115/IMECE1997-0820

Abstract

View Articletitled, A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

PDF

Topics: Epoxy adhesives , Epoxy resins , Fracture toughness , Reliability , Solders , Adhesives , Bonding , Creep , Fatigue , Fracture (Materials)

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada

IMECE 1997; 219-225https://doi.org/10.1115/IMECE1997-0821

Abstract

View Articletitled, Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

PDF

Topics: Printing , Solders , Flow (Dynamics) , Printed circuit boards , Temperature , Visualization

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

IMECE 1997; 227-242https://doi.org/10.1115/IMECE1997-0822

Abstract

View Articletitled, A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

PDF

Topics: Dynamic testing (Materials) , Reliability , Solder joints , Dynamic analysis , Failure mechanisms , Solders , Constitutive equations , Cycles , Defense industry , Failure

Comparison of Different Solder Systems Based on Propensity for Damage

Vijay Sarihan

IMECE 1997; 243-248https://doi.org/10.1115/IMECE1997-0823

Abstract

View Articletitled, Comparison of Different Solder Systems Based on Propensity for Damage

PDF

Topics: Damage , Solders , Stress , Temperature , Cycles , Fatigue , Fatigue life , Finite element methods , Alloys , Eutectic alloys

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

IMECE 1997; 249-259https://doi.org/10.1115/IMECE1997-0824

Abstract

View Articletitled, Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

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Topics: Creep , Fatigue , Fracture (Materials) , Fracture (Process) , Solder joints , Temperature , Printed circuit boards , Damage , Melting , Separation (Technology)

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee

IMECE 1997; 261-269https://doi.org/10.1115/IMECE1997-0825

Abstract

View Articletitled, Structural Integrity of Optical Fibers in Connectors

PDF

Topics: Epoxy adhesives , Epoxy resins , Fibers , Finite element analysis , Fracture (Materials) , Fracture (Process) , Optical fiber , Reliability , Stress analysis (Engineering) , Structural analysis

All Years

Structural Analysis in Microelectronics and Fiber Optics

Design Considerations in Avionics Electronic Packaging

Assessment of Chip-Scale Package Design Options

Manufacturability of Underfill Processing for Low Cost Flip Chip

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

Low Cost Plastic Packaging of the Network Interface Unit

“Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: Experimental Evaluation of Their Propensity to Moisture-Induced Failures

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Comparison of Different Solder Systems Based on Propensity for Damage

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Structural Integrity of Optical Fibers in Connectors

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