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Proceedings Papers
In This Volume
Volume 10: Micro- and Nano-Systems Engineering and Packaging
Micro- and Nano-Systems Engineering and Packaging
Advanced Packaging: Sensors and 3D/2.5D Packaging
Applications of Micro and Nano Systems in Medicine and Biology
Applied Mechanics and Materials
Design Optimization of Driveshaft and Universal Joint Using Finite Element Technique
Mosfequr Rahman, Gustavo Molina, Sirajus Salekeen, Ana Dungan, Isaac Hyers, Daniel Griffin, Alexander Berman
Topics:
Design
,
Finite element analysis
,
Optimization
,
Universal joints
,
Carbon fibers
,
Composite materials
,
Safety
,
Torque
,
Titanium
,
Computer software
Computational Studies on MEMS and Nanostructures
Design and Fabrication, Analysis, Processes, and Technology for Micro and Nano Devices and Systems
General Topics of MEMS/NEMS
Manufacturing, Materials and Processes in Electronics and Photonics Packaging
Self-Aligned Carbon Nanotube Yarns for Multifunctional Optoelectronic Applications
M. Jasim Uddin, Glenn Grissom, Miguel Leal, Veronica Galvez, Tarek Trad, Ahmed Touhami, Nazmul Islam, Jason Parsons, H. Justin Moore
Topics:
Carbon nanotubes
,
Yarns
,
Chemical stability
,
Coating processes
,
Coatings
,
Durability
,
Electron field emission
,
Electrons
,
Energy conversion
,
Photons
Micro and Nano Devices
Microfluidics 2016 Fluid Engineering in Micro- and Nanosystems
Posters
Quality and Reliability of Electronic/Photonic Packaging
CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Uwe Muehle, Ehrenfried Zschech, Riko Radojcic
Topics:
Electron mobility
,
Silicon
,
Stress
,
Simulation
,
Design
,
Flow (Dynamics)
,
Calibration
,
Circuits
,
Finite element analysis
,
Fittings
Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Vijay Subramanian, Tsgereda Alazar, Kyle Yazzie, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Topics:
Electronic packaging
,
Fracture (Materials)
,
Thin films
,
Fracture toughness
,
Packaging
,
Epoxy resins
,
Testing
,
Blades
,
Dimensions
,
Failure
Thermal Management of Electronics
Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer
Jimil M. Shah, Oluwaseun Awe, Pavan Agarwal, Iziren Akhigbe, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Topics:
Corrosion
,
Damage
,
Data centers
,
Reliability
,
Contamination
,
Temperature
,
Particulate matter
,
Evaporative cooling
,
Bearings
,
Climate
Design Considerations Relating to Non-Thermal Aspects of Oil Immersion Cooling
Jimil M. Shah, Syed Haider I. Rizvi, Indu Sravani Kota, Sahithi Reddy Nagilla, Dhaval Thakkar, Dereje Agonafer
Topics:
Cooling
,
Design
,
Data centers
,
Mineral oil
,
Oils
,
Petroleum
,
Fluids
,
Hazards
,
Maintainability
,
Safety
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