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Proceedings Papers
In This Volume
Volume 10: Micro- and Nano-Systems Engineering and Packaging
Micro- and Nano-Systems Engineering and Packaging
Advanced Packaging: Sensors and 3D/2.5D Packaging
Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC
IMECE 2016; V010T13A001https://doi.org/10.1115/IMECE2016-65543
Topics:
Thermal resistance
,
Computer simulation
,
Design
,
Temperature
,
Boundary-value problems
,
Data acquisition
,
Heating
,
Modeling
,
Reliability
,
Thermal analysis
Crystallinity Control of Electroplated Interconnections for Improving Their Stability and Lifetime
IMECE 2016; V010T13A003https://doi.org/10.1115/IMECE2016-67737
Topics:
Stability
,
Thin films
,
Copper
,
Stress
,
Annealing
,
Grain boundaries
,
Texture (Materials)
,
Bulk solids
,
Chemical properties
,
Density
Applications of Micro and Nano Systems in Medicine and Biology
STRETCHABLE Lab-on-Chip Device With Impedance Spectroscopy Capability for Mammalian Cell Studies
IMECE 2016; V010T13A005https://doi.org/10.1115/IMECE2016-66156
Topics:
Electrochemical impedance spectroscopy
,
Electrodes
,
Membranes
,
Sensors
,
Blood flow
,
Elongation
,
Endothelial cells
,
Manufacturing
,
Physiology
,
Polymers
Arterial Pulse Signal Monitoring During the Valsalva Maneuver via a Flexible Microfluidic-Based Sensor
IMECE 2016; V010T13A007https://doi.org/10.1115/IMECE2016-66735
Topics:
Microfluidics
,
Sensors
,
Signals
,
Deflection
,
Heart failure
,
Transducers
,
Electrolytes
,
Hemodynamics
,
Plasma desorption mass spectrometry
,
Stress
Electrolyte-Free Nano-Electronic Sensor for the Rapid Quantification of DNA
IMECE 2016; V010T13A009https://doi.org/10.1115/IMECE2016-67622
Topics:
DNA
,
Electrolytes
,
Nanoelectronics
,
Sensors
,
Water
,
Anisotropy
,
Biosensors
,
Cantilevers
,
Electric current
,
Electric fields
Applied Mechanics and Materials
Modeling Nanoscale Rheological and Mechanical Properties of Thin Film Asphalt Binder
IMECE 2016; V010T13A013https://doi.org/10.1115/IMECE2016-65531
Topics:
Asphalt
,
Binders (Materials)
,
Mechanical properties
,
Modeling
,
Nanoscale phenomena
,
Rheology
,
Thin films
,
Nanoindentation
,
Displacement
,
Elastic moduli
Finite Element Investigation of a Piston Assembly of a Diesel Engine
IMECE 2016; V010T13A014https://doi.org/10.1115/IMECE2016-65991
Topics:
Diesel engines
,
Finite element analysis
,
Manufacturing
,
Pistons
,
Stress
,
Combustion
,
Simulation
,
Engines
,
Failure
,
Combustion chambers
Design Optimization of Driveshaft and Universal Joint Using Finite Element Technique
Mosfequr Rahman, Gustavo Molina, Sirajus Salekeen, Ana Dungan, Isaac Hyers, Daniel Griffin, Alexander Berman
IMECE 2016; V010T13A015https://doi.org/10.1115/IMECE2016-66241
Topics:
Design
,
Finite element analysis
,
Optimization
,
Universal joints
,
Carbon fibers
,
Composite materials
,
Safety
,
Torque
,
Titanium
,
Computer software
Nonlinear Structural Behavior of Double-Layers Based MEMS Actuator
IMECE 2016; V010T13A016https://doi.org/10.1115/IMECE2016-66353
Topics:
Actuators
,
Microelectromechanical systems
,
Microbeams
,
Eigenvalues
,
Mode shapes
,
Modeling
,
Stress
,
Switches
Evaluation of Stress Wave Attenuation in a Polymer Matrix Composite Using Finite Element Analysis Technique
IMECE 2016; V010T13A018https://doi.org/10.1115/IMECE2016-67055
Topics:
Finite element analysis
,
Polymer composites
,
Stress
,
Waves
,
Modeling
,
Bonding
,
Finite element model
,
Polymers
,
Adhesion
,
Composite materials
Computational Studies on MEMS and Nanostructures
Effect of Geometric and Material Properties on Thermoelastic Damping (TED) of 3D Hemispherical Inertial Resonator
IMECE 2016; V010T13A019https://doi.org/10.1115/IMECE2016-66277
Topics:
Materials properties
,
Thermoelastic damping
,
Q-factor
,
Glass
,
Shells
,
Design
,
Microelectromechanical systems
,
Oscillations
Numerically Determining Material Coefficients of Micro-Injection Molded PVDF/PZT Piezoelectric Composites With Controlled Filler Orientation
IMECE 2016; V010T13A020https://doi.org/10.1115/IMECE2016-66600
Topics:
Composite materials
,
Fillers (Materials)
,
Flow (Dynamics)
,
Matlab
,
Molding
,
Stiffness
Study on Bonding and Shear Flow Phenomena of Shear Probe Test for BGA Solder Joint in Nano-Scale Analysis
IMECE 2016; V010T13A022https://doi.org/10.1115/IMECE2016-66773
Topics:
Ball-Grid-Array packaging
,
Bonding
,
Nanoscale phenomena
,
Probes
,
Shear (Mechanics)
,
Shear flow
,
Solder joints
,
Tin
,
Atoms
,
Crystal structure
Design and Fabrication, Analysis, Processes, and Technology for Micro and Nano Devices and Systems
Inkjet Printing of Carbon Nanotube-Polyimide Nanocomposite Strain Sensor
IMECE 2016; V010T13A025https://doi.org/10.1115/IMECE2016-67233
Topics:
Carbon
,
Nanocomposites
,
Nanotubes
,
Printing
,
Strain sensors
,
Carbon nanotubes
,
Temperature
,
Thin films
,
Geometry
,
Calibration
General Topics of MEMS/NEMS
Static and Dynamic Amplification Using Strong Mechanical Coupling
IMECE 2016; V010T13A026https://doi.org/10.1115/IMECE2016-66104
Topics:
Dynamics (Mechanics)
,
Microbeams
,
Resonance
,
Sensors
,
Signal to noise ratio
,
Signals
,
Stress
,
Switches
The Phonon Dissipation Mode in Nanofriction
IMECE 2016; V010T13A027https://doi.org/10.1115/IMECE2016-66402
Topics:
Energy dissipation
,
Phonons
,
Friction
,
Temperature
,
Graphene
,
Atoms
,
Computer simulation
,
Low temperature
,
Molecular dynamics
,
Simulation results
Tunable Bandpass Filter Based on Electrothermally and Electrostatically Actuated MEMS Arch Resonator
IMECE 2016; V010T13A029https://doi.org/10.1115/IMECE2016-66700
Topics:
Arches
,
Filters
,
Microelectromechanical systems
,
Resonance
,
Hardening
,
Heat
,
Semiconductor wafers
,
Shapes
,
Silicon-on-insulator
,
Stiffness
Direct Writing on Phosphate Glass Using Atomic Force Microscopy for Rapid Fabrication of Nanostructures
IMECE 2016; V010T13A030https://doi.org/10.1115/IMECE2016-67471
Topics:
Atomic force microscopy
,
Glass
,
Manufacturing
,
Nanostructures
,
Silver
,
Lithography
,
Shapes
,
Cathode rays
,
Electrical conductivity
,
Electrodes
Manufacturing, Materials and Processes in Electronics and Photonics Packaging
3D Printed Porous Dielectric Substrates for RF Applications
IMECE 2016; V010T13A031https://doi.org/10.1115/IMECE2016-65880
Topics:
Additive manufacturing
,
Resonance
,
Computerized tomography
,
Density
,
Dielectric materials
,
Dimensions
,
Machinery
,
Manufacturing
,
Microscopes
,
Microscopy
Self-Aligned Carbon Nanotube Yarns for Multifunctional Optoelectronic Applications
M. Jasim Uddin, Glenn Grissom, Miguel Leal, Veronica Galvez, Tarek Trad, Ahmed Touhami, Nazmul Islam, Jason Parsons, H. Justin Moore
IMECE 2016; V010T13A032https://doi.org/10.1115/IMECE2016-67441
Topics:
Carbon nanotubes
,
Yarns
,
Chemical stability
,
Coating processes
,
Coatings
,
Durability
,
Electron field emission
,
Electrons
,
Energy conversion
,
Photons
Mechanical Testing for Stretchable Electronics
Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Rajendra Dias, Pramod Malatkar, Ravi Mahajan
IMECE 2016; V010T13A033https://doi.org/10.1115/IMECE2016-68215
Topics:
Electronics
,
Mechanical testing
,
Damage
,
Reliability
,
Testing
,
Biomedicine
,
Cycles
,
Failure mechanisms
,
Muscle
,
Shock (Mechanics)
Micro and Nano Devices
Design, Analysis and System-Level Modelling of a Single Axis Capacitive Accelerometer
IMECE 2016; V010T13A034https://doi.org/10.1115/IMECE2016-66004
Topics:
Accelerometers
,
Design
,
Modeling
,
Noise (Sound)
,
Radiation (Physics)
,
Capacitance
,
Circuits
,
Displacement
,
Electronics
,
Microelectromechanical systems
Development of a Solid-State Inflation Balloon Deorbiter
IMECE 2016; V010T13A035https://doi.org/10.1115/IMECE2016-67467
Topics:
Crystals
,
Design
,
Drag (Fluid dynamics)
,
Engineering simulation
,
Epoxy adhesives
,
Epoxy resins
,
Generators
,
Glass
,
Leakage
,
Metals
Highly-Sensitive Graphene Nano-Ribbon-Base Strain Sensor
IMECE 2016; V010T13A036https://doi.org/10.1115/IMECE2016-67602
Microfluidics 2016 Fluid Engineering in Micro- and Nanosystems
Target Cell Detection via Microfluidic Magnetic Beads Assay
IMECE 2016; V010T13A037https://doi.org/10.1115/IMECE2016-65088
Topics:
Microfluidics
,
Magnetic fields
,
Delays
,
Fluids
Thermal Modeling and Design Analysis of a Hybrid Microdevice for Continuous-Flow PCR Using One Heater
IMECE 2016; V010T13A038https://doi.org/10.1115/IMECE2016-65594
Topics:
Design
,
Flow (Dynamics)
,
Modeling
,
Microfluidics
,
Alloys
,
Temperature distribution
,
Biomedicine
,
Boundary-value problems
,
Chain
,
Food products
Transient Electroosmotic Flow of Newtonian Fluids in a Microchannel With Heterogeneous Zeta Potentials at the Walls
IMECE 2016; V010T13A039https://doi.org/10.1115/IMECE2016-65939
Topics:
Electroosmosis
,
Fluids
,
Microchannels
,
Transients (Dynamics)
,
Flow (Dynamics)
,
Flat plates
,
Lubrication theory
,
Microfluidics
,
Momentum
,
Pressure
Influence of Solution pH on DNA Translocation Velocity Through Alumina Nanopores
IMECE 2016; V010T13A040https://doi.org/10.1115/IMECE2016-66403
Topics:
DNA
,
Nanopores
,
Diffusion (Physics)
,
Electrolytes
,
Density
,
Electrodes
,
Electromagnetic scattering
,
Modeling
,
Sensors
A MoS2 Field-Effect Transistor With a Liquid Back Gate
IMECE 2016; V010T13A041https://doi.org/10.1115/IMECE2016-66544
Posters
Design and Development of Compliant Microgripper-Based Assembly Station
IMECE 2016; V010T13A045https://doi.org/10.1115/IMECE2016-68210
Topics:
Design
,
Manufacturing
,
Bending (Stress)
,
Deflection
,
Engineering prototypes
,
Genetic algorithms
,
Metals
,
Modeling
,
Simulation
,
Wire
Quality and Reliability of Electronic/Photonic Packaging
CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Uwe Muehle, Ehrenfried Zschech, Riko Radojcic
IMECE 2016; V010T13A046https://doi.org/10.1115/IMECE2016-65171
Topics:
Electron mobility
,
Silicon
,
Stress
,
Simulation
,
Design
,
Flow (Dynamics)
,
Calibration
,
Circuits
,
Finite element analysis
,
Fittings
High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Edvin Cetegen, David McCoy, Pramod Malatkar
IMECE 2016; V010T13A047https://doi.org/10.1115/IMECE2016-67007
Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Vijay Subramanian, Tsgereda Alazar, Kyle Yazzie, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
IMECE 2016; V010T13A048https://doi.org/10.1115/IMECE2016-67145
Topics:
Electronic packaging
,
Fracture (Materials)
,
Thin films
,
Fracture toughness
,
Packaging
,
Epoxy resins
,
Testing
,
Blades
,
Dimensions
,
Failure
Effects of Linear Hysteric Material Damping and Shock Pulse Shapes for Uniform Board Response
IMECE 2016; V010T13A049https://doi.org/10.1115/IMECE2016-68119
Topics:
Damping
,
Shapes
,
Shock (Mechanics)
,
Stress
,
Finite element analysis
,
Stiffness
,
Computer simulation
,
Interpolation
,
Lumber
,
Solder joints
Thermal Management of Electronics
Small Form Factor Peltier-Based Liquid Cooling for High Power Density Electronics
IMECE 2016; V010T13A051https://doi.org/10.1115/IMECE2016-65680
Topics:
Cooling
,
Electronics
,
Power density
,
Thermoelectric coolers
,
Water
,
Density
,
Design
,
Manufacturing
,
Reliability
,
Temperature
Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer
Jimil M. Shah, Oluwaseun Awe, Pavan Agarwal, Iziren Akhigbe, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
IMECE 2016; V010T13A052https://doi.org/10.1115/IMECE2016-66199
Topics:
Corrosion
,
Damage
,
Data centers
,
Reliability
,
Contamination
,
Temperature
,
Particulate matter
,
Evaporative cooling
,
Bearings
,
Climate
Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications
IMECE 2016; V010T13A053https://doi.org/10.1115/IMECE2016-67229
Topics:
Copper
,
Design
,
Flat heat pipes
,
Fluids
,
Genetic algorithms
,
Heat
,
Modeling
,
Optimization
,
Pressure
,
Stress
Design Considerations Relating to Non-Thermal Aspects of Oil Immersion Cooling
Jimil M. Shah, Syed Haider I. Rizvi, Indu Sravani Kota, Sahithi Reddy Nagilla, Dhaval Thakkar, Dereje Agonafer
IMECE 2016; V010T13A054https://doi.org/10.1115/IMECE2016-67320
Topics:
Cooling
,
Design
,
Data centers
,
Mineral oil
,
Oils
,
Petroleum
,
Fluids
,
Hazards
,
Maintainability
,
Safety
Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base
IMECE 2016; V010T13A055https://doi.org/10.1115/IMECE2016-67639
Topics:
Heat
,
Heat sinks
,
Transient analysis
,
Temperature
,
Coolants
,
Transients (Dynamics)
,
Architecture
,
Boundary-value problems
,
Flow (Dynamics)
,
Geometry
Thermal Modeling of Memory Access Operations in Microprocessors
IMECE 2016; V010T13A056https://doi.org/10.1115/IMECE2016-67697
Topics:
Modeling
,
Transients (Dynamics)
,
Microelectronic devices
,
Temperature
,
Cooling
,
Design
,
Finite element analysis
,
Heat
,
Simulation results
,
Temperature effects
Heat Transfer in Liquid-Liquid Taylor Flow in Mini-Scale Curved Tubing for Constant Wall Temperature
IMECE 2016; V010T13A057https://doi.org/10.1115/IMECE2016-67700
Topics:
Flow (Dynamics)
,
Heat transfer
,
Tubing
,
Wall temperature
,
Boundary-value problems
,
Copper
,
Oils
,
Petroleum
,
Prandtl number
,
Silicones