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Proceedings Papers
In This Volume
Volume 10: Micro- and Nano-Systems Engineering and Packaging
Micro- and Nano-Systems Engineering and Packaging
Applications of Micro and Nano Systems in Medicine and Biology
Bioparticle Manipulation by an Orthogonal Electrode Preconcentrator
IMECE 2015; V010T13A003https://doi.org/10.1115/IMECE2015-52724
Topics:
Electrodes
,
Electrokinetics
,
Design
,
Flow (Dynamics)
,
Geometry
,
Particulate matter
,
Reliability
Applied Mechanics and Materials
Finite Element Analysis of Various Projectiles Modeled as Bullets
Mosfequr Rahman, Steven Chrysosferidis, Sirajus Salekeen, Adam Chevalier, David Bell, Bowen Jones, Adam Barlow
IMECE 2015; V010T13A006https://doi.org/10.1115/IMECE2015-53007
Topics:
Bullets
,
Finite element analysis
,
Projectiles
,
Concretes
,
Dynamics (Mechanics)
,
Cavitation
,
Deformation
,
Firing
,
Flow simulation
,
Manufacturing
Computational Studies on MEMS and Nanostructures
The Effect of a Mini-Scale Flame-Holder on Nano-Particulate Soot Aerosol Formation and CO/CO2 Emissions From a Jet Fuel Combustion Chamber
IMECE 2015; V010T13A007https://doi.org/10.1115/IMECE2015-50082
Topics:
Aerosols
,
Carbon dioxide
,
Combustion chambers
,
Emissions
,
Flames
,
Jet fuels
,
Particulate matter
,
Soot
,
Temperature
,
Turbulence
MEMS Wind Speed Sensor: Large Deflection of Curved Micro-Cantilever Beam Under Uniform Horizontal Force
IMECE 2015; V010T13A008https://doi.org/10.1115/IMECE2015-50560
Topics:
Deflection
,
Microcantilevers
,
Microelectromechanical systems
,
Sensors
,
Wind velocity
,
Differential equations
,
Dimensions
,
Integral equations
,
Pressure
,
Wind
Finite Element and Mechanical Modeling of Fatigue Behavior of Partial Vapor-Conditioned Viscoelastic Material
IMECE 2015; V010T13A010https://doi.org/10.1115/IMECE2015-51147
Topics:
Fatigue
,
Finite element analysis
,
Modeling
,
Vapors
,
Viscoelastic materials
,
Asphalt
,
Binders (Materials)
,
Finite element methods
,
Creep
,
Potassium
Computational Studies on the Effects of Non-Linear Temperature Functions in Thermal Creep Membranes of Radiantly Driven Knudsen Compressors
IMECE 2015; V010T13A011https://doi.org/10.1115/IMECE2015-51813
Topics:
Compressors
,
Creep
,
Membranes
,
Temperature
,
Carbon
,
Radiation (Physics)
,
Simulation
,
Temperature distribution
,
Flow (Dynamics)
,
Gas compressors
Static Response of Microbeams due to Capillary and Electrostatic Forces
IMECE 2015; V010T13A012https://doi.org/10.1115/IMECE2015-52037
Topics:
Microbeams
,
Electrodes
,
Stability
,
Fluids
,
Manufacturing
,
Switches
,
Water
,
Cantilevers
,
Chemical etching
,
Condensation
Enhanced Light Absorption in Thin Crystalline Silicon Solar Cells With Silica Nanoparticles
IMECE 2015; V010T13A013https://doi.org/10.1115/IMECE2015-52492
Topics:
Light absorption
,
Nanoparticles
,
Silicon
,
Solar cells
,
Particulate matter
,
Computer simulation
,
Reflection
,
Refractive index
,
Wavelength
,
Circuits
Design and Fabrication, Analysis, Processes, and Technology for Micro and Nano Devices and Systems
Fabrication of 2.5D Rock-Based Micromodels With High Resolution Features
IMECE 2015; V010T13A014https://doi.org/10.1115/IMECE2015-50657
Topics:
Manufacturing
,
Resolution (Optics)
,
Rocks
,
Nickel
,
Electroforming
,
Lithography
,
Ultraviolet radiation
,
Ceramics
,
Current density
,
Electroplating
Effects of the Structural Layer Material and its Thickness on Positive Displacement Piezoelectric Micropump Performance
IMECE 2015; V010T13A015https://doi.org/10.1115/IMECE2015-51937
Topics:
Displacement
,
Micropumps
,
Flow (Dynamics)
,
Fluid dynamics
,
Membranes
,
Microfluidics
,
Borosilicate glasses
,
Deformation
,
Density
,
Design
Emerging Technologies in Electronics and Photonic Packaging
Convective Electronic Device Cooling Using Microencapsulated Phase Change Material Slurry in Planar Spiral Coil
IMECE 2015; V010T13A019https://doi.org/10.1115/IMECE2015-52748
Topics:
Cooling
,
Phase change materials
,
Slurries
,
Heat
,
Thermal management
,
Flow (Dynamics)
,
Heat exchangers
,
Heat transfer
,
Temperature
,
Boundary-value problems
Numerical Investigation Into the Thermal Performance of Two-Layered Microchannels With Varying Axial Length and Temperature Dependent Fluid Properties
IMECE 2015; V010T13A020https://doi.org/10.1115/IMECE2015-52888
Topics:
Fluids
,
Microchannels
,
Temperature
,
Pressure drop
,
Geometry
,
Heat
,
Heat flux
,
Heat sinks
,
Silicon
,
Stress
Manufacturing, Materials and Processes in Electronics and Photonics Packaging
Thermal Analysis of a Laser Peeling Technique for Removing Micro Edge Cracks of Ultrathin Glass Substrates for Web Processing
Tian-Shiang Yang, Guang-Di Chen, Kuo-Shen Chen, Rong-Can Hong, Tz-Cheng Chiu, Chang-Da Wen, Chun-Han Li, Chien-Jung Huang, Kun-Tso Chen, Mao-Chi Lin
IMECE 2015; V010T13A021https://doi.org/10.1115/IMECE2015-50316
Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
IMECE 2015; V010T13A022https://doi.org/10.1115/IMECE2015-53742
Topics:
Corrosion
,
Wire
,
Copper
,
Diffusion (Physics)
,
Electrolytic corrosion
,
Ions
,
Electrical resistivity
,
Molding
,
Temperature
,
Aluminum
Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature
IMECE 2015; V010T13A023https://doi.org/10.1115/IMECE2015-53751
Topics:
High temperature
,
Mechanical behavior
,
Viscoplasticity
,
Solders
,
Temperature
,
Deformation
,
Operating temperature
,
Storage
,
Electronics
,
Constitutive equations
Micro and Nano Devices
Photonically Sintered PZT Energy Harvester
IMECE 2015; V010T13A024https://doi.org/10.1115/IMECE2015-50769
Topics:
Energy harvesting
,
Stress
,
Aerosols
,
Bending (Stress)
,
Electric fields
,
Electrodes
,
Manufacturing
,
Melting
,
Melting point
,
Signals
Transient Interface Shape and Deposition Profile Left by Desiccation of Colloidal Droplets on Multiple Surfaces
IMECE 2015; V010T13A026https://doi.org/10.1115/IMECE2015-52216
Topics:
Drops
,
Shapes
,
Transients (Dynamics)
,
Glass
,
Particulate matter
,
Electric fields
,
Patient diagnosis
,
Photoresists
,
Printing
Small-Scale Thermal Energy Harvester With Copper Foams and Thermal Energy Storage
IMECE 2015; V010T13A027https://doi.org/10.1115/IMECE2015-52406
Topics:
Copper
,
Foams (Chemistry)
,
Thermal energy
,
Thermal energy storage
,
Fluids
,
Heat exchangers
,
Thermal conductivity
,
Paraffin wax
,
Porosity
,
Batteries
The Effects of Material Properties on Pillar-Based QCM Sensors
Hamed Esmaeilzadeh, George Cernigliaro, Junwei Su, Lin Gong, Iman Mirzaee, Majid Charmchi, Hongwei Sun
IMECE 2015; V010T13A028https://doi.org/10.1115/IMECE2015-52533
Topics:
Columns (Structural)
,
Materials properties
,
Sensors
,
Drugs
,
Manufacturing
,
Microscale devices
,
Organic compounds
,
Performance
,
Proteins
,
Quartz crystals
Water Based Propellant for Cold Gas Thruster
IMECE 2015; V010T13A029https://doi.org/10.1115/IMECE2015-52776
Highly Sensitive Pressure Sensor Using Two-Dimensionally Aligned Carbon Nanotube Bundles
IMECE 2015; V010T13A030https://doi.org/10.1115/IMECE2015-53059
Topics:
Buckling
,
Carbon
,
Carbon nanotubes
,
Deformation
,
Dielectric materials
,
Elastic constants
,
Gages
,
Manganese (Metal)
,
Multi-walled carbon nanotubes
,
Nanotubes
Microfluidics: Fluid Engineering in Micro- and Nanosystems
Fabrication of Plastic Micro-Channels for Microfluidics Solvent Extraction
IMECE 2015; V010T13A033https://doi.org/10.1115/IMECE2015-53526
Topics:
Manufacturing
,
Microchannels
,
Microfluidics
,
Fluids
,
Flow (Dynamics)
,
Laser welding
,
Water
Nanomaterials for Porous Media
Removal of Pharmaceutical Contaminants in Water
IMECE 2015; V010T13A035https://doi.org/10.1115/IMECE2015-53240
Topics:
Drugs
,
Water
,
Filtration
,
Membranes
,
Activated carbon
,
Cancer
,
Damage
,
Sands
,
Wastewater treatment
Nanostructured Materials
Quality and Reliability in Electronics and Photonic Packaging
A Study on the Effect of Mean Cyclic Temperature on the Thermal Fatigue Reliability of SAC Solder Joints Using Digital Image Correlation
IMECE 2015; V010T13A037https://doi.org/10.1115/IMECE2015-53476
Topics:
Fatigue
,
Reliability
,
Solder joints
,
Temperature
,
Cycles
,
Electronics
,
Alloys
,
Failure
,
High temperature
,
Mechanical properties
Addressing Thermal Management Concerns for a Power Electronics Module Using an Integrated Micro-Cooling Chip Array Scheme
IMECE 2015; V010T13A038https://doi.org/10.1115/IMECE2015-53728
Topics:
Cooling
,
Electronics
,
Thermal management
,
Design
,
Heat exchangers
,
Circuits
,
Coolants
,
Flow (Dynamics)
,
Flux (Metallurgy)
,
Heat
Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics
IMECE 2015; V010T13A039https://doi.org/10.1115/IMECE2015-53749
Topics:
Electronics
,
Packaging
,
Reliability
,
Thermal conductivity
,
Diamonds
,
Failure
,
Composite materials
,
Solder joints
,
Cooling
,
Copper
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