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Proceedings Papers
In This Volume
Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration
Nano and Micro Materials, Devices and Systems
Applied Mechanics and Materials
Numerical Analysis to Predict Dynamic Response of Mini Cantilever Beam Submerged in Viscous Fluids
IMECE 2011; 1-6https://doi.org/10.1115/IMECE2011-62188
Topics:
Cantilever beams
,
Dynamic response
,
Fluids
,
Numerical analysis
,
Finite element analysis
,
Q-factor
,
Resonance
,
Viscosity
,
Density
,
Design
Tribological Behavior of High Density Polyethylene Nanocomposites With Silane Treated Carbon Nanofibers
Songbo Xu, Aydar Akchurin, X. W. Tangpong, Iskander S. Akhatov, Tian Liu, Weston Wood, Wei-Hong Zhong
IMECE 2011; 7-13https://doi.org/10.1115/IMECE2011-62701
Topics:
Carbon
,
Density
,
Nanocomposites
,
Nanofibers
,
Tribology
,
Coatings
,
Friction
,
Microhardness
,
Wear
,
Biomedicine
The Morphologies and Adhesion of Ceramic Films on CLAM Steel Substrates for Nuclear Fusion Applications
IMECE 2011; 47-50https://doi.org/10.1115/IMECE2011-65106
Topics:
Adhesion
,
Ceramics
,
Nuclear fusion
,
Steel
,
Atomic force microscopy
,
Coatings
,
Manganese (Metal)
,
Metals
,
Stress
,
Ceramic coatings
Experimental Investigation on the Use of Photostrictive Optical Actuator for MEMS Devices and Verification With the FEA Modeling Results
IMECE 2011; 65-74https://doi.org/10.1115/IMECE2011-65581
Topics:
Actuators
,
Finite element analysis
,
Microelectromechanical systems
,
Modeling
,
Ceramics
,
Design
,
Signals
,
Thin films
,
Computational methods
,
Crystals
Bioinspired Materials and Structures
Carbon-Based Nano-Materials and Devices
Gate-Free Graphene-Based Sensor for pH Monitoring
IMECE 2011; 97-102https://doi.org/10.1115/IMECE2011-65166
Topics:
Gates (Closures)
,
Graphene
,
Sensors
,
Annealing
,
Electrical conductance
,
Electrodes
,
Etching
,
Focused ion beams
,
Graphite
,
Lithography
Orientation Dependent Binding Energy of Graphene on Pd(111)
IMECE 2011; 103-105https://doi.org/10.1115/IMECE2011-65217
Topics:
Binding energy
,
Graphene
,
Metals
,
Carbon
,
Charge transfer
,
Electrodes
,
Electron mobility
,
Energy gap
,
Geometry
,
Low-power electronics
Computational Studies on MEMS and Nanostructures
Finite Volume Method for Simulation of Creep in RF MEMS Devices
IMECE 2011; 119-128https://doi.org/10.1115/IMECE2011-62660
Topics:
Creep
,
Finite volume methods
,
Microelectromechanical systems
,
Simulation
,
Membranes
,
Actuators
,
Algebra
,
Electrodes
,
Reliability
,
Solids
Design, Fabrication, Dynamics, and Control of Micro and Nano Systems
A Polyimide Micro Heat Exchanger With a Suspended 3D Parallel Channel Structure for Cryogenic Application
IMECE 2011; 181-186https://doi.org/10.1115/IMECE2011-62513
Topics:
Heat exchangers
,
Manufacturing
,
Temperature
,
Copper
,
Dimensions
,
Flow (Dynamics)
,
Micromachining
,
Nitrogen
,
Pressure
,
Pressure drop
Design of Urinary Biomarker Sensor for Early Ovarian Cancer Detection
IMECE 2011; 203-204https://doi.org/10.1115/IMECE2011-62818
Topics:
Cancer
,
Design
,
Sensors
,
Microelectromechanical systems
,
Adhesion
,
Biosensors
,
Manufacturing
,
Proteins
,
Surface acoustic waves
,
Delays
Closed Form Solutions for the Problem of Statical Behavior of Nano/Micromirrors Under the Effect of Capillary Force and Van Der Waals Force
IMECE 2011; 213-219https://doi.org/10.1115/IMECE2011-63112
Topics:
Electromagnetic weapons
,
Van der Waals forces
,
Mirrors
,
Rotation
,
Stability
,
Approximation
,
Casimir force
,
Chemical etching
,
Manufacturing
,
Torque
Maskless Photolithography Using an Epifluorescent Microscope for Microfluidic Applications
IMECE 2011; 247-250https://doi.org/10.1115/IMECE2011-63698
Topics:
Microfluidics
,
Microscopes
,
Photolithography
,
Photoresists
,
Resolution (Optics)
,
Casting
,
Design
,
Photomasks
,
Plasma desorption mass spectrometry
,
Safety
Investigation of Microcantilever Sensor for Explosive Detection
IMECE 2011; 269-277https://doi.org/10.1115/IMECE2011-63930
Topics:
Explosives
,
Sensors
,
Microcantilevers
,
Temperature
,
Computer simulation
,
Currents
,
Deflection
,
Deformation
,
Ignition
,
Lasers
A Tri-Plate Variable Capacitor for Electrostatic Energy Harvesting
IMECE 2011; 279-280https://doi.org/10.1115/IMECE2011-64436
Topics:
Capacitors
,
Energy harvesting
,
Design
,
Displacement
,
Electrodes
,
Generators
,
Capacitance
,
Engineering simulation
,
Sensors
,
Simulation
Transient Performance and Coupled Acoustic Structural and Electrostatic Modeling of a Multistage Vacuum Micropump
IMECE 2011; 287-296https://doi.org/10.1115/IMECE2011-64548
Topics:
Acoustics
,
Micropumps
,
Modeling
,
Transients (Dynamics)
,
Vacuum
,
Design
,
Pressure
,
Membranes
,
Pumps
,
Steady state
Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe
IMECE 2011; 297-306https://doi.org/10.1115/IMECE2011-64676
Topics:
Heat pipes
,
Manufacturing
,
Microelectromechanical systems
,
Silicon
,
Semiconductor wafers
,
Etching
,
Evaporation
,
Thin films
,
Design
,
Condensers (steam plant)
Molecular Dynamics Simulation of Thermal Accommodation Coefficients for Laser-Induced Incandescence Sizing of Nickel Nanoparticles
IMECE 2011; 307-315https://doi.org/10.1115/IMECE2011-64747
Topics:
Lasers
,
Light emission
,
Molecular dynamics simulation
,
Nanoparticles
,
Nickel
,
Aerosols
,
Atoms
,
Desorption
,
Iron
,
Metals
High-Q Gallium Nitride Nanowire Resonators With Piezoresistive Readout
IMECE 2011; 323-327https://doi.org/10.1115/IMECE2011-65296
Topics:
Gallium nitride
,
Nanowires
,
Resonance
,
Manufacturing
,
Wire
,
Cooling
,
Dielectrophoresis
,
Gates (Closures)
,
Q-factor
,
Temperature
Capacitive Readout Technique for Studies of Dissipation in GaN Nanowire Mechanical Resonators
IMECE 2011; 329-333https://doi.org/10.1115/IMECE2011-65420
Topics:
Energy dissipation
,
Gallium nitride
,
Nanowires
,
Resonance
,
Nanoscale phenomena
,
Temperature
,
Crystals
,
Damping
,
Locks (Waterways)
,
Microwave measurement
Experimental Testing of Micro-Scale Self Assembly Process Model
IMECE 2011; 337-343https://doi.org/10.1115/IMECE2011-65728
Topics:
Microscale devices
,
Self-assembly
,
Testing
,
Binding energy
,
Manufacturing
,
Innovation
,
Kinetic energy
,
Mass production
,
Shapes
Energy, Power and Transport in Micro and Nano Scales
Coupled Computational Thermal and Mechanical Analysis of a Single Chip Flip Chip Module With Low-k Dielectric Medium
IMECE 2011; 353-358https://doi.org/10.1115/IMECE2011-63670
Topics:
Delays
,
Flip-chip
,
Gates (Closures)
,
Silicon
,
Stress
,
Thermomechanics
,
Dielectric materials
,
Temperature distribution
,
Transistors
,
Adhesion
Pool Boiling Enhancement via Micro Ratchets
IMECE 2011; 359-360https://doi.org/10.1115/IMECE2011-63736
Topics:
Brass (Metal)
,
Fluids
,
Heat transfer
,
Nucleate pool boiling
,
Polishing
,
Pool boiling
,
Water
General Topics of MEMS/NEMS and Nanotechnology
3D Microfabrication Using Bulk Lithography
IMECE 2011; 393-399https://doi.org/10.1115/IMECE2011-62473
Topics:
Lithography
,
Microfabrication
,
Manufacturing
,
Laser beams
,
Lasers
,
Photopolymers
,
Resins
Demonstration of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K
Ryan Lewis, M.-H. Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, Y. C. Lee
IMECE 2011; 423-428https://doi.org/10.1115/IMECE2011-63908
Topics:
Compressors
,
Cooling
,
Temperature
,
Coolers
,
Valves
,
Flow (Dynamics)
,
Glass
,
Glass fibers
,
Heat exchangers
,
Joules
High Temperature Materials
Reactive Heat Source for Standalone Thermoelectric Power Generator: Thermal Analysis of Pyrophoric Iron Mixture
IMECE 2011; 429-433https://doi.org/10.1115/IMECE2011-63695
Topics:
Generators
,
Heat
,
Iron
,
Thermal analysis
,
Combustion
,
Activated carbon
,
Chemical reactions
,
Differential scanning calorimetry
,
Fossil fuels
,
Iron powders
Micro and Nano Devices
Preliminary Studies of Stand-Alone Lance Concepts for Nanoinjection of DNA
IMECE 2011; 471-479https://doi.org/10.1115/IMECE2011-64026
Topics:
DNA
,
Computers
,
Electrodes
,
Manufacturing
,
Metals
,
Microelectromechanical systems
,
Micromachining
,
Probes
,
Testing
,
Tungsten
Conception and Fabrication of Silicon Ring Resonator With Piezo-Resistive Detection for Force Sensing Applications
IMECE 2011; 517-521https://doi.org/10.1115/IMECE2011-65083
Topics:
Atomic force microscopy
,
Excitation
,
Manufacturing
,
Probes
,
Q-factor
,
Resolution (Optics)
,
Resonance
,
Signals
,
Silicon
,
Vacuum
Vibration Rectification and Thermal Disturbances in Ultra Precision Inertial Sensors
IMECE 2011; 531-538https://doi.org/10.1115/IMECE2011-65518
Topics:
Sensors
,
Vibration
,
Errors
,
Accelerometers
,
Displacement
,
Electromagnetic noise
,
Filters
,
Microelectromechanical systems
,
Resolution (Optics)
,
Servomechanisms
Micro/NanoScale Phononic Crystals and Acoustic Metamaterials: Fundamentals, Devices and Applications
A Fast Method for Electronic Band Structure Calculations
IMECE 2011; 575-579https://doi.org/10.1115/IMECE2011-65681
Topics:
Crystals
,
Eigenvalues
,
Wave functions
,
Wave propagation
Microfluidics 2011: Fluid Engineering in Micro- and Nanosystems
Modeling of Aerosol Spray Characteristics for Synthesis of Mixed-Oxide Nanocomposite Sensor Film
IMECE 2011; 581-589https://doi.org/10.1115/IMECE2011-62252
Topics:
Aerosol sprays
,
Modeling
,
Nanocomposites
,
Sensors
,
Drops
,
Nozzles
,
Sprays
,
Aerosols
,
Chemical reactions
,
Computational fluid dynamics
Fabrication and Application of a Chemical Resistant Low-Cost Microdrop Generator
IMECE 2011; 601-610https://doi.org/10.1115/IMECE2011-62640
Topics:
Generators
,
Manufacturing
,
Fluids
,
Nozzles
,
Transducers
,
Borosilicate glasses
,
Silicon
,
Actuators
,
Diaphragms (Mechanical devices)
,
Diaphragms (Structural)
A Microfabricated Enzyme-Free Glucose Fuel Cell for Implantable Devices
IMECE 2011; 615-617https://doi.org/10.1115/IMECE2011-62893
Topics:
Enzymes
,
Fuel cells
,
Glucose
,
Electrodes
,
Catalysts
,
Current density
,
Oxygen
,
Carbon
,
Density
,
Design
Preconcentration of Cardiac Proteins in a Cascade Microchip
Mohammad R. Hossan, Talukder Z. Jubery, Danny R. Bottenus, Prashanta Dutta, Cornelius F. Ivory, Wenji Dong
IMECE 2011; 619-624https://doi.org/10.1115/IMECE2011-63812
Topics:
Cascades (Fluid dynamics)
,
Integrated circuits
,
Proteins
,
Ions
,
Microchannels
,
Anodes
,
Electric fields
,
Fluids
,
Microfluidics
,
Pacific Ocean
An Optofluidic Photobioreactor Strategy for Bioenergy
IMECE 2011; 629-631https://doi.org/10.1115/IMECE2011-64024
Topics:
Bioenergy conversion
,
Biofuel
,
Design
,
Fossil fuels
,
Membranes
,
Waveguides
,
Waves
Novel, Gasketless, Interconnect Using Parallel Superhydrophobic Surfaces for Modular Microfluidic Systems
Christopher R. Brown, Bahador Farshchian, Pin-Chuan Chen, Taehyun Park, Sunggook Park, Michael C. Murphy
IMECE 2011; 633-637https://doi.org/10.1115/IMECE2011-64073
Topics:
Microfluidics
,
Pressure
,
Bridges (Structures)
,
Fluids
,
Laplace equations
,
Rupture
,
Steady state
Ultrasonic Excitation Induced Wenzel to Cassie Transition
IMECE 2011; 639-641https://doi.org/10.1115/IMECE2011-64391
Topics:
Drops
,
Excitation
,
Fluids
,
Microscale devices
,
Solids
,
Surface roughness
,
Surface texture
,
Switches
,
Texture (Materials)
,
Wetting
Nanostructured Materials
Effect of Consolidation Mechanism on the Properties of Nanostructured WC-6, 9, 12 wt%Co Hardmetals
IMECE 2011; 667-674https://doi.org/10.1115/IMECE2011-63643
Topics:
Advanced materials
,
Alloys
,
Cutting
,
Drilling
,
Mechanical behavior
,
Microwaves
,
Nanomaterials
,
Particulate matter
,
Plasmas (Ionized gases)
,
Powder metallurgy
Ambient-Pressure, Plasma-Assisted Deposition of Conformal Nanocrystalline Zinc Oxide Thin Films
IMECE 2011; 687-692https://doi.org/10.1115/IMECE2011-64688
Topics:
Plasmas (Ionized gases)
,
Pressure
,
Thin films
,
Temperature
,
Annealing
,
Electromagnetic induction
,
Glass
,
Low temperature
,
Muscovite
,
Quartz
Molecular Dynamics of Crack Growth in Nickel and Nickel-Aluminum Bi-Metallic Interface System Under Cyclic Loading
IMECE 2011; 693-702https://doi.org/10.1115/IMECE2011-65150
Topics:
Aluminum
,
Fracture (Materials)
,
Molecular dynamics
,
Nickel
,
Crack propagation
,
Nucleation (Physics)
,
Atoms
,
Crystals
,
Deformation
,
Dislocations
Monte Carlo Study of the Molecular Beam Epitaxy Process for Manufacturing Iron Oxide Nano Scale Films and Similarities With Magnesium Oxide Films
IMECE 2011; 703-712https://doi.org/10.1115/IMECE2011-65570
Topics:
Iron
,
Magnesium (Metal)
,
Manufacturing
,
Molecular beam epitaxy
,
Metals
,
Thin films
,
Artificial neural networks
,
Nanoscale phenomena
,
Bonding
,
Chemistry
Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites
IMECE 2011; 713-714https://doi.org/10.1115/IMECE2011-65578
Topics:
Annealing
,
Epoxy adhesives
,
Epoxy resins
,
Nanocomposites
,
Silver
,
Temperature
,
Thermal conductivity
,
Nanoparticles
,
Polymers
,
Coating processes
Nanostructures and Nanomaterials for Sustainability
Effects of Annealing on CuInGaSe2 Solar Cell Prepared by Magnetron Sputtering
IMECE 2011; 725-731https://doi.org/10.1115/IMECE2011-62458
Topics:
Annealing
,
Solar cells
,
Sputtering (Irradiation)
,
Temperature
,
Thin films
,
Vapors
,
Fluorescence
,
Scanning electron microscopes
,
X-ray diffraction
,
X-rays
Adhesive and Mechanical Properties of Carbon Nanotube Probes Contacting Chemically-Treated Surfaces
IMECE 2011; 739-746https://doi.org/10.1115/IMECE2011-64403
Topics:
Adhesives
,
Carbon nanotubes
,
Mechanical properties
,
Probes
,
Single-walled nanotubes
,
Atomic force microscopy
,
Cantilevers
,
Nanotubes
,
Adhesion
,
Buckling
Scalable Methods for Processing Nano-Engineered Materials, Structures, and Devices
Passive Multi-Scale Alignment
IMECE 2011; 747-754https://doi.org/10.1115/IMECE2011-62320
Topics:
Computer simulation
,
Deformation
,
Errors
,
Etching
,
Kinematics
,
Lithography
,
Manufacturing
Flexible Graphene Sensors for Explosive Trace Detection
IMECE 2011; 755-756https://doi.org/10.1115/IMECE2011-64135
Topics:
Explosives
,
Graphene
,
Sensors
,
Glass
,
Containers
,
Electrodes
,
Oxide coatings
,
Silver
,
Sprays
,
Testing
Microsystems Integration
General
A Hybrid Propulsion System for a High-Endurance UAV: Configuration Selection and Aerodynamic Study
IMECE 2011; 767-774https://doi.org/10.1115/IMECE2011-62272
Topics:
Propulsion systems
,
Unmanned aerial vehicles
,
Propellers
,
Batteries
,
Electric motors
,
Electric propulsion
,
Motors
,
Weight (Mass)
,
Combustion chambers
,
Design
Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips
IMECE 2011; 775-784https://doi.org/10.1115/IMECE2011-63974
Topics:
Thermal management
,
Thermoelectric coolers
,
Cooling
,
Heat
,
Power density
,
Transients (Dynamics)
,
Density
,
Electronic packages
,
Flat heat pipes
,
Heating
Symposium on Advanced Packaging, Power Electronics and Photonics
Microchannel Two-Phase Flow Oscillation Control With an Adjustable Inlet Orifice
Brent A. Odom, Mark J. Miner, Carlos A. Ortiz, Jonathan A. Sherbeck, Ravi S. Prasher, Patrick E. Phelan
IMECE 2011; 793-801https://doi.org/10.1115/IMECE2011-62078
Topics:
Microchannels
,
Oscillations
,
Two-phase flow
,
Critical heat flux
,
Design
,
Flow (Dynamics)
,
Heat transfer coefficients
,
Pressure
,
Pressure drop
,
Signals
Investigation of High Performance Heat Sink Characteristics in Forced Convection Cooling of Power Electronic Systems
IMECE 2011; 815-821https://doi.org/10.1115/IMECE2011-64318
Topics:
Cooling
,
Electronic systems
,
Forced convection
,
Heat sinks
,
Temperature
,
Junctions
,
Steady state
,
Computer simulation
,
Computer software
,
Density
Symposium on Manufacturing, Materials and Processes
Effect of Ni-Coated Carbon Nanotubes on the Creep Behavior of Sn-Ag-Cu Solder by Nanoindentation
IMECE 2011; 843-847https://doi.org/10.1115/IMECE2011-63009
Topics:
Carbon nanotubes
,
Creep
,
Nanoindentation
,
Solders
,
Tin
,
Composite materials
,
Manganese (Metal)
,
Alloys
,
Nanocomposites
,
Powder metallurgy
Fast Copper Plating Process for Through Silicon Via (TSV) Filling
IMECE 2011; 855-863https://doi.org/10.1115/IMECE2011-64782
Topics:
Copper
,
Electroplating
,
Plating
,
Silicon
Symposium on Modeling and Simulation in Electronic/Photonic Packaging
Combined Experimental and Numerical Study of a New Configuration of Multiple Microchannel Heat Sink for Heat Removal
IMECE 2011; 865-873https://doi.org/10.1115/IMECE2011-62535
Topics:
Heat
,
Heat sinks
,
Microchannels
,
Design
,
Flow (Dynamics)
,
Bifurcation
,
Boundary-value problems
,
Computer simulation
,
Fluid dynamics
,
Fluids
Failure Mode Clustering is Electronic Assemblies Using Sammon’s Mapping With Supervised Training of Perceptrons
IMECE 2011; 911-925https://doi.org/10.1115/IMECE2011-65833
Topics:
Failure mechanisms
,
Failure
,
Artificial neural networks
,
Damage
,
Fracture (Process)
,
Shock (Mechanics)
,
Solders
,
Vibration
,
Cross section (Physics)
,
Errors
Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels
IMECE 2011; 927-940https://doi.org/10.1115/IMECE2011-65866
Topics:
Cooling
,
Laminar flow
,
Microchannels
,
Flow (Dynamics)
,
Heat sinks
,
Thermal resistance
,
Delays
,
Design
,
Energy dissipation
,
Reliability
Symposium on Quality and Reliability of Electronic/Photonic Packaging
Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique
IMECE 2011; 941-948https://doi.org/10.1115/IMECE2011-63147
Topics:
Ball-Grid-Array packaging
,
Inspection
,
Lasers
,
Lead-free solders
,
Ultrasound
,
Solders
,
X-rays
,
Interferometers
,
Solder joints
,
Transients (Dynamics)
Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe
IMECE 2011; 963-971https://doi.org/10.1115/IMECE2011-64944
Topics:
Fluids
,
Heat flux
,
Heat pipes
,
Microscale devices
,
Packaging
,
Microelectromechanical systems
,
Semiconductor wafers
,
Aluminum
,
Bonding
,
Borosilicate glasses
PHM of Leadfree Electronic Assemblies Using Resistance Spectroscopy With Sequential Importance Resampling
IMECE 2011; 973-986https://doi.org/10.1115/IMECE2011-65832
Topics:
Spectroscopy
,
Damage
,
Failure
,
Service life (Equipment)
,
Algorithms
,
Electronics
,
Filters
,
Particulate matter
,
Reliability
,
Electronic components
Symposium on Reliability/Durability of Defense, Aerospace, and Military Electronics
Accrued Damage and Remaining Life in Field Extracted Assemblies Under Sequential Thermo-Mechanical Loads
IMECE 2011; 989-1004https://doi.org/10.1115/IMECE2011-65834
Topics:
Damage
,
Stress
,
Thermomechanics
,
Failure
,
Errors
,
Service life (Equipment)
,
Electronics
,
Delamination
,
Electronic systems
,
Fracture (Materials)
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