Topics: Microelectromechanical systems , Nanoelectromechanical systems , Self-assembly , Stability , Bonding , Biocompatibility , Biofouling , Biomedical microelectromechanical systems , Chain , Contamination

Mechanical and Electrical Properties of Micro-Lines Fabricated by Laser-Assisted Maskless Microdeposition

Hamidreza Alemohammad, Ehsan Toyserkani

IMECE 2008; 11-16doi:https://doi.org/10.1115/IMECE2008-68085

Abstract

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Topics: Electrical properties , Lasers , Electrical conductivity , Laser beams , Mechanical properties , Silver , Thermal conductivity , Density , Elastic moduli , Manufacturing

An Examination of Flow Regimes Associated With Inkjet-Printed Colloidal Drops

Vadim Bromberg, Sailee Gawande, Ying Sun, Timothy Singler

IMECE 2008; 17-24doi:https://doi.org/10.1115/IMECE2008-68877

Abstract

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Topics: Flow (Dynamics) , Evaporation , Particulate matter , Radial flow , Dynamics (Mechanics) , Internal flow

Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho

IMECE 2008; 25-32doi:https://doi.org/10.1115/IMECE2008-68952

Abstract

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Topics: Deformation , High temperature , Solders , Creep , Temperature , Alloys , Electronics , Stress , Tin , Drilling

Symposium on Multiphysics Issues in Electronic/Photonic Packaging

Single Crystal Quartz a Replacement for Diamond Optical Windows

Jessica Sheehan

IMECE 2008; 33-39doi:https://doi.org/10.1115/IMECE2008-66327

Abstract

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Topics: Crystals , Diamonds , Optical windows , Quartz , Bending strength , Atomic force microscopy , Durability , Interferometers , Lenses (Optics) , Optics

Design and Evaluation of a Modulator Circuit for a Self-Energized Wireless Sensor

Zhaoyan Fan, Robert X. Gao, David O. Kazmer

IMECE 2008; 41-48doi:https://doi.org/10.1115/IMECE2008-67848

Abstract

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Topics: Circuits , Design , Sensors , Pressure , Temperature , Acoustics , Data acquisition , Molding , Piezoelectric ceramics , Pressure measurement

Dye Doped Clad Modified Evanescent Optical Fiber (CMEOF) Sensor Array for the Detection of Aqueous-Ammonia

Abdeq M. Abdi, Sistla S. Shastry, A. G. Agwu Nnanna

IMECE 2008; 49-53doi:https://doi.org/10.1115/IMECE2008-67935

Abstract

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Topics: Optical fiber , Sensors , Sol-gel processing , Wavelength , Fibers , Linear systems , Membranes , Plasma desorption mass spectrometry , Thin films , Water

Investigation of Fiber Optic Sensor for Monitoring of Ammonia

Sistla S. Shastry, Abdeq M. Abdi, A. G. Agwu Nnanna

IMECE 2008; 55-59doi:https://doi.org/10.1115/IMECE2008-67940

Abstract

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Topics: Cables , Cladding systems (Building) , Etching , Fiber optic sensors , Fibers , Glass , Optical fiber , Polymers , Security , Sensors

Engine Simulator for ECMs Diagnosis

N. A. Navarrete, J. I. Huertas

IMECE 2008; 61-65doi:https://doi.org/10.1115/IMECE2008-68175

Abstract

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Topics: Engines , Maintenance , Design , Failure , Safety , Sensors , Signals , Testing , Transducers , Vehicles

Automatic Feature Recognition for Data Interoperability Issues in High-Speed Electronics System Design

Xiaolin Chen, Hui Zhang, Will Miller

IMECE 2008; 67-73doi:https://doi.org/10.1115/IMECE2008-68389

Abstract

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Topics: Design , Electronics , Electronic systems , Signals , Simulation , Circuits , Algorithms , Computer software , Density , Engineers

Strain Fields and Transition Energies in Multilayer InAs/GaAs Quantum Dots

T. R. Lin, M. K. Kuo, K. B. Hong

IMECE 2008; 75-78doi:https://doi.org/10.1115/IMECE2008-68550

Abstract

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Topics: Gallium arsenide , Quantum dots

Symposium on Power Electronics for Extreme Environments

A Measurement Method Using Bi-Metal Fixture for Non-Linear Property of Thin Layer Joint

Masanori Yamagiwa, Qiang Yu, Masato Fujita

IMECE 2008; 79-85doi:https://doi.org/10.1115/IMECE2008-66878

Abstract

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Topics: Metals , Nanoparticles , High temperature , Solders , Displacement , Reliability , Cooling systems , Deformation , Fatigue , Heating

Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules

K. Sinha, A. Dasgupta, R. Beaupre, A. Gowda

IMECE 2008; 87-93doi:https://doi.org/10.1115/IMECE2008-67367

Abstract

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Topics: Copper , Silicon , Strength (Materials) , Stress , Delamination , Risk , Thermomechanics , Adhesion , Degrees of freedom , Failure mechanisms

Liquid Cooling for Thermal Management of Data Centers

Veerendra Mulay, Dereje Agonafer, Roger Schmidt

IMECE 2008; 95-101doi:https://doi.org/10.1115/IMECE2008-68743

Abstract

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Topics: Cooling , Data centers , Thermal management , Stress , Heat , Air conditioners , Computers , Storage

Optimization of Refrigeration Systems for High-Heat-Flux Microelectronics

P. E. Phelan, Y. Gupta, H. Tyagi, R. Prasher, J. Cattano, G. Michna, R. Zhou, J. Wen, M. Jensen, Y. Peles

IMECE 2008; 103-108doi:https://doi.org/10.1115/IMECE2008-69113

Abstract

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Topics: Heat , Microelectronic devices , Optimization , Refrigeration , Design , Vapors , Compression , Cycles , Energy consumption , Compressors

Development of Cryogenic Power Modules for Superconducting Hybrid Power Electronic System

Hua Ye, Pradeep Haldar

IMECE 2008; 109-114doi:https://doi.org/10.1115/IMECE2008-69274

Abstract

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Topics: Design , Electronic systems , Hybrid power systems , MOSFET transistors , Nitrogen , Power density , Power systems (Machinery) , Weight (Mass)

Symposium on Quality and Reliability of Electronic/Photonic Packaging -- I

Analytical Model for Thermal Warpage History of Laminated PBGAs

Lynn Munday, Norman Keller, Abhijit Dasgupta, Bong-Tae Han

IMECE 2008; 115-123doi:https://doi.org/10.1115/IMECE2008-67345

Abstract

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Topics: Warping , Temperature , Modeling , Epoxy adhesives , Epoxy resins , Glass transition , Materials properties , Molding , Analytical methods , Approximation

Impact of Piezoresistive Coefficient Uncertainty on Stress Measurement Using Silicon Multi-Resistor Sensor Rosettes

Richard C. Jaeger, Chun-Hyung Cho, Safina Hussain, Jeffrey C. Suhling

IMECE 2008; 125-136doi:https://doi.org/10.1115/IMECE2008-67538

Abstract

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Topics: Resistors , Sensors , Silicon , Stress , Uncertainty , Errors , Temperature , Electronic packages , Integrated circuits , Optimization

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

Farbod Askari Farahani, Moustafa Al-Bassyiouni, Abhigit Dasgupta, Sheldon Tolchinsky

IMECE 2008; 137-143doi:https://doi.org/10.1115/IMECE2008-67749

Abstract

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Topics: Electronic systems , Modeling , Shock (Mechanics) , Simulation , Design , Failure mechanisms , Transients (Dynamics) , Circuits , Cycles , Dynamic testing (Materials)

Loading Direction Versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample

Feng Gao, Jianping Jing, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu

IMECE 2008; 145-152doi:https://doi.org/10.1115/IMECE2008-68099

Abstract

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Topics: Crack propagation , Solder joints , Solders , Alloys , Failure , Fracture (Materials) , Shear (Mechanics) , Fracture (Process) , Intermetallic compounds

Symposium on Quality and Reliability of Electronic/Photonic Packaging -- II

Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental

H. X. Shang, J. X. Gao, P. I. Nicholson

IMECE 2008; 153-161doi:https://doi.org/10.1115/IMECE2008-66417

Abstract

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Topics: Ball-Grid-Array packages , Solder joints , Thermal stresses , Ball-Grid-Array packaging , Finite element analysis , Temperature , High temperature , Interferometry , Reliability , Resolution (Optics)

Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy

Ken Holdermann, Gayatri Cuddalorepatta, Abhijit Dasgupta

IMECE 2008; 163-169doi:https://doi.org/10.1115/IMECE2008-67671

Abstract

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Topics: Alloys , Lead-free solders , Recrystallization , Solder joints , Solders , Electromagnetic scattering , Anisotropy , Creep , Fatigue testing , Focused ion beams

Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Jianping Jing, Feng Gao, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu

IMECE 2008; 171-176doi:https://doi.org/10.1115/IMECE2008-68891

Abstract

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Topics: Fracture (Materials) , Fracture (Process) , Simulation , Solders , Failure , Brittleness , Damage , Finite element methods , Solder joints

Cu Pillar Bump FCBGA Package Design and Reliability Assessments

Nicholas Kao, Yen-Chang Hu, Yuan-Lin Tseng, Eason Chen, Jeng-Yuan Lai, Yu-Po Wang

IMECE 2008; 177-182doi:https://doi.org/10.1115/IMECE2008-69019

Abstract

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Topics: Columns (Structural) , Design , Reliability , Stress , Solders , Flip-chip , Flip-chip devices , Geometry , Shapes , Stress concentration

Symposium on Quality and Reliability of Electronic/Photonic Packaging -- III

Effect of Hot Solder Dipping on Part Stresses

Stephan Meschter, Stephen McKeown

IMECE 2008; 183-190doi:https://doi.org/10.1115/IMECE2008-66322

Abstract

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Topics: Solders , Stress , Ceramics , Finite element analysis , Temperature , Structural mechanics , Coating processes , Coatings , Construction , Damage

Performance of Laser Microjoints in Rat Brain

Ahsan Mian, Taslema Sultana, Golam Newaz

IMECE 2008; 191-195doi:https://doi.org/10.1115/IMECE2008-66819

Abstract

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Topics: Brain , Lasers , Pressure , Water , Stress , Cerebrospinal fluid , Die cutting , Failure , Glass , High pressure (Physics)

Investigation of Device Interactions Between Two MOSFETs in Si CMOS

T. Hatakeyama, K. Fushinobu, K. Okazaki

IMECE 2008; 197-203doi:https://doi.org/10.1115/IMECE2008-67204

Abstract

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Topics: Complementary metal oxide semiconductors , Leakage , High temperature , Risk , Temperature

A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance

Li Sun, Shawn Cunningham, Art Morris, Changsoo Jang, Bongtae Han

IMECE 2008; 205-211doi:https://doi.org/10.1115/IMECE2008-67452

Abstract

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Topics: Flip-chip , Microelectromechanical systems , Packaging , Finite element analysis , Warping , Capacitance , Computer simulation , Design , Displacement , Interferometry

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-Lead (QFN) Packages

Minshu Zhang, S. W. Ricky Lee

IMECE 2008; 213-218doi:https://doi.org/10.1115/IMECE2008-68120

Abstract

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Topics: Failure mechanisms , Adhesion , Engineering simulation , Failure , Materials properties , Simulation , Ambiguity , Delamination , Finite element analysis , Finite element model

Modeling and Experiments of Underfill Flow in Large Dies With Non-Uniform Bump Patterns

Leo Zheng, Ying Sun, Timothy Singler, Jeremias Libres, Siva Gurrum, Patrick Thompson

IMECE 2008; 219-228doi:https://doi.org/10.1115/IMECE2008-69006

Abstract

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Topics: Flow (Dynamics) , Modeling , Flip-chip , Computer simulation , Flow visualization , Fluids , Momentum , Packaging , Quartz , Rheology

Dielectrophoretic Force-Induced Assembly Technique for the Fabrication of 2D Colloidal Photonic Crystals

R. Asmatulu, S. Kim, F. Papadimitrakopoulos, H. Marcus

IMECE 2008; 229-234doi:https://doi.org/10.1115/IMECE2008-69094

Abstract

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Topics: Crystals , Electrodes , Manufacturing , Particulate matter

Advanced Simulation/Modeling and Reliability of Fine Pitch (130um) Lead-Free Flip-Chip Package

Bahareh Banijamali, Ilyas Mohammed

IMECE 2008; 235-243doi:https://doi.org/10.1115/IMECE2008-69250

Abstract

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Topics: Computer simulation , Flip-chip , Flip-chip packages , Reliability

Symposium on Reliability/Durability of Defense, Aerospace, and Military Electronics

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Pradeep Lall, Aniket Shirgaokar, Jeffrey Suhling

IMECE 2008; 245-261doi:https://doi.org/10.1115/IMECE2008-68274

Abstract

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Topics: Electronics , Military systems , Reliability , Thermomechanics , Tradeoffs , Ball-Grid-Array packages , Alloys , Architecture , Regression models , Ceramics

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