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Proceedings Papers

Proceedings Volume Cover
ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
  • ASME
ISBN:
0-7918-4299-1
Volume 5: Electronics and Photonics

Electronics and Photonics

EPPD Student Papers

Experimental Verification of Water Ingress in a Void by Quick Diffusion at High Reflow Temperature
Seungbae Park, Haojun Zhang, Changsoo Jang
IMECE 2007; 1-8https://doi.org/10.1115/IMECE2007-42079
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Topics: Diffusion (Physics) , Electronic packages , Temperature , Water , Vapor pressure , Cavities , Failure , High temperature , Pressure sensors , Computer simulation
Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages
Zhenming Tang, Seungbae Park, H. C. John Lee, Soonwan Chung
IMECE 2007; 9-14https://doi.org/10.1115/IMECE2007-43159
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Topics: Adhesion , Ball-Grid-Array packages , Flip-chip , Lead-free solders , Fatigue life , Solders , Cycles , Cavities , Delamination , Failure
Mixing Enhancement in Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects
Siddharth Bhopte, Bahgat Sammakia, Bruce Murray
IMECE 2007; 15-21https://doi.org/10.1115/IMECE2007-43387
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Topics: Flow (Dynamics) , Microchannel flow , Microchannels , Cavities , Computational fluid dynamics , Geometry , Microelectromechanical systems , Microfluidics , Modeling , Reynolds number
Opto Mechanical Package Development
Graham Kryger, Anika McCarter
IMECE 2007; 23-28https://doi.org/10.1115/IMECE2007-43600
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Topics: Computer software , Design , Engineering design processes , Heat , Lasers , Manufacturing , Photonics , Shapes , Students , Temperature

MEMS/NEMS Packaging Symposium

Reproducible Reliable AuSi Eutectic Wafer Bond Process With High Yield
R. Schwerdtner, M. Wiemer, J. Froemel, Th. Gessner
IMECE 2007; 29-32https://doi.org/10.1115/IMECE2007-41386
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Topics: Semiconductor wafers , Bonding , Actuators , Alloys , Flow (Dynamics) , Heat , Low temperature , Microelectromechanical systems , Nanoelectromechanical systems , Packaging
A Thermal Model for Ultrasonic Welding of Thermoplastics
S.-F. Ling, X. Li, Z. Sun
IMECE 2007; 33-38https://doi.org/10.1115/IMECE2007-41730
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Topics: Ultrasonic welding , Temperature distribution , Welding , Finite element model , Temperature , Adiabatic processes (Thermodynamics) , Circuits , Finite element methods , Heat , Heat transfer
Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder
S. M. L. Nai, J. Wei, M. Gupta
IMECE 2007; 39-42https://doi.org/10.1115/IMECE2007-41762
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Topics: Composite materials , Electrical resistivity , Solders , Tin , Multi-walled carbon nanotubes , Compacting , Extruding , Flip-chip assemblies , Microelectromechanical systems , Microelectronic devices
Growth of Carbon Nanotubes on Metal Containing Amorphous Carbon (A-C:M) Films
K. P. Yung, J. Wei, B. K. Tay
IMECE 2007; 43-46https://doi.org/10.1115/IMECE2007-41768
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Topics: Carbon , Carbon nanotubes , Metals , Atomic force microscopy , Catalysts , Nanotubes , Grain size , Particulate matter , Scanning electron microscopy , Sputtering (Irradiation)
Design and Fabrication of MEMS Based Microphone Module by Using 3D Chip-on-Chip Package
Jeffery C. C. Lo, S. W. Ricky Lee
IMECE 2007; 47-54https://doi.org/10.1115/IMECE2007-42561
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Topics: Design , Manufacturing , Microelectromechanical systems , Microphones , Packaging , Flip-chip , Flip-chip devices , Flow (Dynamics) , Wire , Diaphragms (Mechanical devices)
Aligned Carbon Nanotube Polymer Composites
Yayong Liu, Narayan C. Das, Howard Wang, Guangneng Zhang, Junghyun Cho, Kunlun Hong, Gyula Eres, David Uhrig
IMECE 2007; 55-58https://doi.org/10.1115/IMECE2007-43776
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Topics: Carbon nanotubes , Polymer composites , Composite materials , Polymer nanocomposites , Density , Dielectric relaxation , Elastic moduli , Mechanical behavior , Nanoindentation , Neutron diffraction

Modeling and Characterization of Electronic Packages

Thermal Proximity Effects of Packaged RF High Power Amplifier Discretes
Brian Comber, Michael J. Rightley, Amy Fleischer
IMECE 2007; 59-66https://doi.org/10.1115/IMECE2007-41221
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Topics: Design , Dimensions , Electrical conductivity , Flat heat pipes , Operating temperature , Packaging density (Electronics) , Power density , Thermal conductivity
A Study of Transient Thermal Spreading of VLSI Packaging With Multi Level Scaling
Kazuaki Yazawa, Tenko Yamashita, Hideaki Kuroda
IMECE 2007; 67-73https://doi.org/10.1115/IMECE2007-41658
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Topics: Packaging , Transients (Dynamics) , Energy consumption , Cascades (Fluid dynamics) , Clocks , Dimensions , Heat , Heat flux , Heat sinks , Modeling
Package Tilt Prediction Using Surface Evolver
Benjie B. Hornales, Erwin Ian V. Almagro
IMECE 2007; 75-78https://doi.org/10.1115/IMECE2007-41742
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Topics: Ball-Grid-Array packaging , Computer programming , Encryption , Engineers , Geometry , Shapes , Simulation models , Solder joints , Solders , User interfaces
Multi-Objective Parameterization of Graphite Heat Spreader for Portable Systems Applications
Arijit Banerjee, Nikhil Lakhkar, Shahi Riaz, Gamal Refai-Ahmed, Dereje Agonafer
IMECE 2007; 79-85https://doi.org/10.1115/IMECE2007-42927
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Topics: Flat heat pipes , Graphite , Cooling , Copper , Electronic systems , Laptop computers , Temperature , Thermal conductivity , Weight (Mass) , Density
Computational Modeling for a Microchannel Electronics Cooler
Joseph Dix, Amir Jokar, Robert Martinsen
IMECE 2007; 87-94https://doi.org/10.1115/IMECE2007-42971
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Topics: Computational fluid dynamics , Computer simulation , Electronics , Microchannels

Novel Thermal Management Solutions for Electronics Cooling

Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids
Tao Tong, Je-Young Chang, Shankar Devasenathipathy, John Dirner, Suzana Prstic, Ravi Prasher
IMECE 2007; 95-110https://doi.org/10.1115/IMECE2007-42027
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Topics: Flow (Dynamics) , Fluids , Plates (structures) , Silicon , Water , Boiling , Design , Microchannels , Pressure , Visualization
High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids
Tao Tong, Je-Young Chang, Shankar Devasenathipathy, John Dirner, Suzana Prstic, Ravi Prasher
IMECE 2007; 111-120https://doi.org/10.1115/IMECE2007-42028
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Topics: Fluids , Microchannels , Silicon , Visualization , Water , Flow (Dynamics) , Evaporation , Heat flux , Boiling , Density
Characterization of Microfabricated Cantilever-to-Plane Electrostatic Fluid Accelerators for Cooling in Electronics
C. P. Hsu, C. Sticht, N. E. Jewell-Larsen, Michael Fox, I. A. Krichtafovitch, A. V. Mamishev
IMECE 2007; 121-127https://doi.org/10.1115/IMECE2007-42104
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Topics: Cantilevers , Cooling , Electronics , Fluids , Silicon , Electrodes , Separation (Technology) , Thermal management , Density , Electrohydrodynamics
Comparison of Analytical, Numerical, and Experimental Results for a Simplified CPU/Heatsink Model
Russell Robinson, Mike Genova, Daniel P. Cook
IMECE 2007; 129-133https://doi.org/10.1115/IMECE2007-42181
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Topics: Computer software , Convection , Flat plates , Laminar flow , Modeling , Steady state , Temperature
Passive Wireless Sensing of Temperature Using RF Technology
Miaogeng Zhang, Luis Gonzalez-Argueta, V. Sundararajan
IMECE 2007; 135-141https://doi.org/10.1115/IMECE2007-43725
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Topics: Temperature , Signals , Sensors , Design , Generators , Sensor networks , Batteries , Circuits , Energy resources , Filters

Symposium on Eco-Electronics

PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux
Shantanu Mukherjee, Manuel Castro, Pei-Fang Jennifer Tsai, Krishnaswami Srihari, Van D. Nguyen
IMECE 2007; 143-147https://doi.org/10.1115/IMECE2007-42930
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Topics: Printed circuit boards , Wave soldering , Waves , Alloys , Capillarity , Conveyor systems , Finishes , Inspection , Lead-free solders , Liquid alloys
Modeling and Experimental Verification of the Contact Resistance of a Novel Anisotropic Conductive Adhesive
S. Manian Ramkumar, Krishnaswami Srihari
IMECE 2007; 149-157https://doi.org/10.1115/IMECE2007-42931
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Topics: Adhesives , Anisotropy , Contact resistance , Manufacturing , Modeling
Viscoplastic Behavior of Hypo-Eutectic Sn3.0Ag0.5Cu Pb-Free Alloy Under Creep Loading Conditions
Gayatri Cuddalorepatta, Abhijit Dasgupta
IMECE 2007; 159-167https://doi.org/10.1115/IMECE2007-43497
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Topics: Alloys , Creep , Shear (Mechanics) , Stress , Temperature , Finite element model , High temperature , Microscale devices , Relaxation (Physics) , Solder joints
To Study the High Temperature Effects on Ball Bonds Using Low K Material in Wire Bond Devices
S. A. Kudtarkar, R. Murcko, K. Srihari, S. Saiyed
IMECE 2007; 169-175https://doi.org/10.1115/IMECE2007-43765
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Topics: High temperature , Wire , Reliability , Stress , Wire bonding , Aluminum , Copper , Delays , Heat , Materials properties
Static Power Consumption: Silicon on Insulator Metal Oxide Semiconductor Field Effect Transistor
Uthaman Raju, Praveen Pandojirao-S., Niraja Sivakumar, Dereje Agonafer
IMECE 2007; 177-182https://doi.org/10.1115/IMECE2007-44059
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Topics: Energy consumption , MOSFET transistors , Silicon-on-insulator , Leakage , Silicon , Gates (Closures) , Design , Dimensions , Energy dissipation , Engineering simulation
Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes
D. Bhate, D. Chan, G. Subbarayan, T. C. Chiu, V. Gupta, D. Edwards
IMECE 2007; 183-196https://doi.org/10.1115/IMECE2007-44151
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Topics: Alloys , Creep , Solders , Constitutive equations , Lead-free solders , Stress , Modeling , Temperature , Deformation , Errors

Symposium on Materials in Advanced Packaging

High Reliability and Thermal Performance FCBGA Package
Gino Hung, Ho-Yi Tsai, Chun An Huang, Steve Chiu, C. S. Hsiao
IMECE 2007; 197-200https://doi.org/10.1115/IMECE2007-41794
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Topics: Flip-chip , Flip-chip devices , Molding , Reliability
Constitutive Relations of High Temperature Solders
Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
IMECE 2007; 201-208https://doi.org/10.1115/IMECE2007-42215
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Topics: Constitutive equations , High temperature , Solders , Wire , Nanoindentation , Creep , Failure , Finite element analysis , Mechanical properties , Temperature
Protection From Oxygen and Moisture Via Thin Oxide Barrier Coating for Organic Electronics
Hyungsuk Lee, Guangneng Zhang, Junghyun Cho
IMECE 2007; 209-214https://doi.org/10.1115/IMECE2007-42509
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Topics: Coatings , Electronics , Oxygen , Atomic force microscopy , Biomimetics , Failure , Functional materials , High temperature , Interface structure , Light-emitting diodes

Symposium on Multiphysics Issues in Electronic/Photonic Packaging

Flame Suppression Technique in Arc Tracking of Circuit Boards
Frank K. Lu, Linda Phonharath, Richard R. Mitchell, Behzad Bigdeli
IMECE 2007; 215-222https://doi.org/10.1115/IMECE2007-41051
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Topics: Flames , Printed circuit boards , Electrodes , Combustion , Contamination , Damage , Lumber , Metals , Water
Analysis on the Effect of Input Impact Profiles in Drop Test
Jiang Zhou, Ratna P. Niraula, Kendrick Aung
IMECE 2007; 223-231https://doi.org/10.1115/IMECE2007-41138
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Topics: Design , Dynamic response , Engineers , Finite element analysis , Reliability , Shock (Mechanics) , Stress , Structural elements (Construction)
On Thermomechanical Durability Analysis Combined With Computational Fluid Dynamics Thermal Analysis
Jonas Johansson, Peter Leisner, JungChuan Lee, David W. Twigg, Mostafa Rassaian
IMECE 2007; 233-240https://doi.org/10.1115/IMECE2007-41254
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Topics: Computational fluid dynamics , Durability , Thermal analysis , Thermomechanics , Transients (Dynamics) , Vibration
Thermal-Mechanical Coupling Analysis of Board-Level Chip-Scale Packages Subjected to Power Cycling of Different Powering Durations
Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Kuo-Yuan Lee
IMECE 2007; 241-246https://doi.org/10.1115/IMECE2007-41363
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Topics: Ball-Grid-Array packaging , Computer simulation , Deformation , Fatigue , Reliability , Solder joints , Steady state , Temperature , Thermomechanics , Transients (Dynamics)
Thermal Analysis and Modeling of LED Arrays for Automotive Headlamp
Sun Ho Jang, Moo Whan Shin
IMECE 2007; 247-250https://doi.org/10.1115/IMECE2007-41756
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Topics: Modeling , Thermal analysis , Cooling systems , Temperature , Computational fluid dynamics , Junctions , Design , Fins , Fluids , Heat
Thermal and Mechanical Analysis of High Power LEDs With Ceramic Packages
Jianzheng Hu, Lianqiao Yang, Moo Whan Shin
IMECE 2007; 251-255https://doi.org/10.1115/IMECE2007-41759
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Topics: Ceramics , Light-emitting diodes , Thermomechanics , Engineering simulation , Junctions , Mechanical properties , Simulation , Stress , Thermal expansion , Transients (Dynamics)
Warpage Prediction of Ball Grid Array Packaging
Yeong K. Kim, Russell Peak, Dirk Zwemer
IMECE 2007; 257-261https://doi.org/10.1115/IMECE2007-41966
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Topics: Ball-Grid-Array packaging , Warping
Effect of Thermal Processing on the Dissolution of Micro/Nano-Size Metal Particles in Lead-Free Composite Solders
Mohammad Faizan, Guo-Xiang Wang
IMECE 2007; 263-268https://doi.org/10.1115/IMECE2007-42102
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Topics: Composite materials , Intermetallic compounds , Metals , Particulate matter , Solders
Experimental Study of Solder Joint Reliability for External Heat Sink Installation on FCBGA
Nicholas Kao, Jeng Yuan Lai, Yu Po Wang, C. S. Hsiao
IMECE 2007; 269-274https://doi.org/10.1115/IMECE2007-42743
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Topics: Heat sinks , Reliability , Solder joints , Solders , Creep , Energy consumption , Environmental health and safety , Risk , Temperature , Ball-Grid-Array packaging
Study of Time and Temperature Dependency of Bulk Modulus for Molding Compound by Transient Bulk Creep Experiments
M. D. Patel, K. M. B. Jansen, L. J. Ernst, J. Zhou, C. Bohm
IMECE 2007; 275-279https://doi.org/10.1115/IMECE2007-42852
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Topics: Bulk modulus , Creep , Molding , Temperature , Transients (Dynamics) , Pressure , Compression , Epoxy adhesives , Epoxy resins , Relaxation (Physics)
Investigation of Hygroscopic Swelling of Polymers in Freezing Temperature
Seungbae Park, Haojun Zhang
IMECE 2007; 281-285https://doi.org/10.1115/IMECE2007-43890
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Topics: Freezing , Polymers , Temperature , Composite materials , Glass transition , Thermal expansion
Packaging and Performance of a Piezo-Optic Voltage Sensor
Charles E. Seeley, Glen Koste, Ben Tran, Tom Dermis
IMECE 2007; 287-296https://doi.org/10.1115/IMECE2007-44087
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Topics: Packaging , Sensors , Fibers , Waveguides , Creep , Design , Electrodes , Electromagnetic interference , Electronics , Fiber Bragg gratings

Symposium on Quality and Reliability of Electronic/Photonic Packaging

Experimental Study on Thermal Performance of a Forced Air Cooled PBGA Package in the Compact Thin Casing: Effect of Obstacles Placed Inside the Casing
Masaru Ishizuka, Shinji Nakagawa, Katsuhiro Koizumi
IMECE 2007; 297-304https://doi.org/10.1115/IMECE2007-41112
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Topics: Computational fluid dynamics , Design , Dynamic light scattering , Engineering simulation , Flow (Dynamics) , Heat , Laptop computers , Printed circuit boards , Simulation , Temperature
Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped With Nickel or Germanium
Yi-Shao Lai, Jenn-Ming Song, Hsiao-Chuan Chang, Ying-Ta Chiu
IMECE 2007; 305-311https://doi.org/10.1115/IMECE2007-41232
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Topics: Copper , Germanium , Nickel , Silver , Solder joints , Tin , Brittleness , Die cutting , Finishes , Fracture (Process)
Integrated Hierarchical Durability Design Tool for Electronic Packaging
Jung-Chuan Lee, David W. Twigg, Mostafa Rassaian
IMECE 2007; 313-317https://doi.org/10.1115/IMECE2007-41253
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Topics: Design , Durability , Electronic packaging , Solder joints , Fatigue analysis , Vibration , Acoustics , Construction , Electrical wires , Fatigue failure
Delamination Evaluation Approach for Bimaterial Structure Considering Interfacial Layer
Qiang Yu, Tadahiro Shibutani, Masaki Shiratori, Tomio Matsuzaki, Tsubasa Matsumoto
IMECE 2007; 319-324https://doi.org/10.1115/IMECE2007-41715
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Topics: Delamination , Fracture (Materials) , Fracture (Process) , Resins , Bonding , Finite element analysis , Interface structure , Reliability , Die cutting , Electronic components
A Study on Evaluation Technique for the Fatigue Life Scatter of Lead-Free Solder Joints
Hiroki Miyauchi, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
IMECE 2007; 325-332https://doi.org/10.1115/IMECE2007-41760
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Topics: Electromagnetic scattering , Fatigue life , Lead-free solders , Solder joints , Design , Fatigue , Reliability , Capacitors , Ceramics , Circuits
Use Direct Cyclic and Sub-Modeling Approach to Analyze Solder Joint Fatigue Reliability
Tieyu Zheng, Zhen-Zhong Du
IMECE 2007; 333-338https://doi.org/10.1115/IMECE2007-42366
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Topics: Fatigue , Modeling , Reliability , Solder joints , Ball-Grid-Array packaging , Crack propagation , Electronic products , Fatigue life , Low cycle fatigue , Packaging
Time-Frequency Analysis and Built-In Reliability Test for Health Monitoring of Electronics Under Shock Loads
Pradeep Lall, Prakriti Choudhary, Sameep Gupte, Prashant Gupta, Jeff Suhling, James Hofmeister
IMECE 2007; 339-357https://doi.org/10.1115/IMECE2007-42546
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Topics: Electronics , Feature extraction , Reliability , Shock (Mechanics) , Stress , Time-frequency analysis
Methodologies for System-State Interrogation for Prognostication of Electronics Under Thermo-Mechanical Loads
Pradeep Lall, Madhura Hande, Chandan Bhat, Jeff Suhling
IMECE 2007; 359-374https://doi.org/10.1115/IMECE2007-42560
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Topics: Electronics , Packaging , Reliability , Stress , Thermomechanics , Failure , Damage , Algorithms , Architecture , Automotive safety
Defect Detection of Flip Chip Solder Bumps Through Local Temporal Coherence Analysis of Laser Ultrasound Signals
Jin Yang, Charles Ume
IMECE 2007; 375-384https://doi.org/10.1115/IMECE2007-42571
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Topics: Flaw detection , Flip-chip devices , Lasers , Signals , Solders , Ultrasound , Inspection , Ball-Grid-Array packaging , Interferometry , Printed circuit boards
Numerical Investigation on Cooling of Small Form Factor Computer Cases
O¨mer Emre Orhan, I˙lker Tarı
IMECE 2007; 385-390https://doi.org/10.1115/IMECE2007-43178
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Topics: Computers , Cooling , Computational fluid dynamics , Computer simulation , Computer software , Simulation results , Temperature measurement , Turbulence
Relaxation Investigation for Terminals of Electronic Connectors Under Thermal Shock Test
K.-C. Liao, K.-H. Lin
IMECE 2007; 391-395https://doi.org/10.1115/IMECE2007-43340
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Topics: Relaxation (Physics) , Thermal shock , Electrical resistance , Creep , Cycles , Temperature , Bronze , Finite element analysis , Numerical analysis , Phosphors
Analytical Homogenization for Microelectronic Substrates
Mitul Modi, Deepak Kulkarni, Andy Bao, Ibrahim Bekar, Steve Cho
IMECE 2007; 397-406https://doi.org/10.1115/IMECE2007-43460
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Topics: Anisotropy , Copper , Density , Design , Materials properties , Mechanical properties , Micromechanics (Engineering) , Modeling , Reliability , Temperature
An Analytic Model for PTH/PWB Stress Due to Three-Dimensional Forces Generated by Symmetric Compliant-Pins
S. Roettele, A. Dasgupta
IMECE 2007; 407-411https://doi.org/10.1115/IMECE2007-43491
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Topics: Pins (Engineering) , Printed circuit boards , Stress , Design , Geometry , Construction , Deformation , Fourier series , Friction , Materials properties
Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
Yuxun Zhou, Abhijit Dasgupta
IMECE 2007; 413-420https://doi.org/10.1115/IMECE2007-43493
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Topics: Durability , Excitation , Solders , Vibration , Fatigue , Failure , Printed circuit boards , Bending (Stress) , Finite element analysis , Solder joints
Effect of Size and Spatial Distribution of Titania Pigments in Injection Molded Parts on Surface Reflectance
B. R. Dantal, A. Saigal, M. A. Zimmerman
IMECE 2007; 421-426https://doi.org/10.1115/IMECE2007-43516
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Topics: Reflectance , Particulate matter , Molding , Computer software , Deformation , Electromagnetic scattering , Gates (Closures) , Image processing , Light-emitting diodes , Liquid crystals
Warpage Measurement Using Projection Moire´ System and Two Automatic Image Segmentation Algorithms
Wei Tan, I. Charles Ume
IMECE 2007; 427-434https://doi.org/10.1115/IMECE2007-43650
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Topics: Algorithms , Image segmentation , Warping , Printed circuit boards , Displacement , Electronic packages , Reliability , Composite materials , Electronic packaging , Manufacturing
Curvature Based Metrics for Interpreting Warpage and Predicting Reliability in Second Level Interconnects
Karumbu Nathan Meyyappan, Steve Cho
IMECE 2007; 435-441https://doi.org/10.1115/IMECE2007-43690
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Topics: Bending (Stress) , Fittings , Noise (Sound) , Reliability , Shapes , Solder joints , Stress , Warping
Development of an Analytical Model to a Temperature Distribution of First Level Package With a Non-Uniformly Powered Die
Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
IMECE 2007; 443-449https://doi.org/10.1115/IMECE2007-43736
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Topics: Temperature distribution , Heat flux , Computer simulation , Design , Flat heat pipes , Heat , Heat sinks , Junctions , Numerical analysis , Optimization
Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending
D. Farley, Y. Zhou, A. Dasgupta, J. F. J. Caers, J. W. C. de Vries
IMECE 2007; 451-458https://doi.org/10.1115/IMECE2007-43898
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Topics: Bending (Stress) , Design , Engineering simulation , Epoxy adhesives , Epoxy resins , Failure , Failure analysis , Failure mechanisms , Fatigue , Flip-chip
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