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Proceedings Papers

Proceedings Volume Cover
ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
  • Microelectromechanical Systems Division
ISBN:
0-7918-4224-X
Microelectromechanical Systems

Microelectromechanical Systems

BioMEMS

Device Characterization and Metrology

Fabrication and Packaging

General

Materials and Applied Mechanics

Micro/Nano Devices and Systems

Microfluidics and Thermal Sciences

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