Topics: Failure analysis , Finite element analysis , MEMS packaging , Reliability , Failure , Microelectromechanical systems , Failure mechanisms , Brittleness , MEMS packages , Microcracks

Thermal Warpage and Pressure Nonlinearity Analyses for Monolithic Piezoresistive Sensing Elements

J. Albert Chiou

IMECE 2002; 9-14doi:https://doi.org/10.1115/IMECE2002-39264

Abstract

View Articletitled, Thermal Warpage and Pressure Nonlinearity Analyses for Monolithic Piezoresistive Sensing Elements

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Topics: Pressure , Warping , Design , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Stress , Anisotropy , Circuits , Complementary metal oxide semiconductors , Deformation

RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages

Lei L. Mercado, Tien-Yu Tom Lee, Shun-Meen Kuo, Vern Hause, Craig Amrine

IMECE 2002; 15-24doi:https://doi.org/10.1115/IMECE2002-39265

Abstract

View Articletitled, RF MEMS Switch Heat Dissipation in Discrete and Wafer-Level MEMS Packages

PDF

Topics: Energy dissipation , Heat , MEMS packages , Microelectromechanical systems , Semiconductor wafers , Switches

Process-Induced Thermal Effect on Packaging Yield of RF MEMS Switches

Lei L. Mercado, Shun-Meen Kuo, Tien-Yu Tom Lee, Russ Lee

IMECE 2002; 25-32doi:https://doi.org/10.1115/IMECE2002-39266

Abstract

View Articletitled, Process-Induced Thermal Effect on Packaging Yield of RF MEMS Switches

PDF

Topics: Microelectromechanical systems , Packaging , Switches , Temperature effects , Failure mechanisms , Cantilevers , Contact resistance , Design , Electrodes , Engineering simulation

Locally Heated Low Temperature Wafer Level MEMS Packaging With Closed-Loop AuSn Solder-Lines

Young Ho Seo, Tae Goo Kang, Young-Ho Cho, Seong-A. Kim, Geun Ho Kim, Jong Uk Bu

IMECE 2002; 33-37doi:https://doi.org/10.1115/IMECE2002-39267

Abstract

View Articletitled, Locally Heated Low Temperature Wafer Level MEMS Packaging With Closed-Loop AuSn Solder-Lines

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Topics: Low temperature , MEMS packaging , Semiconductor wafers , Solders , Bonding , Pressure , Fracture (Materials) , Fracture (Process) , Leakage , X-rays

A Wafer-Level Vacuum Packaging Technology Utilizing Electroplated Nickel

Brian H. Stark, Khalil Najafi

IMECE 2002; 39-44doi:https://doi.org/10.1115/IMECE2002-39268

Abstract

View Articletitled, A Wafer-Level Vacuum Packaging Technology Utilizing Electroplated Nickel

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Topics: Nickel , Packaging , Semiconductor wafers , Vacuum , Microelectromechanical systems , Sealing (Process) , Filters , Low temperature , Micromechanical resonators , Pressure

Residual Stress Analysis of Silicon-Aluminum-Glass Bonding Processes

Delney Bystrom, Liwei Lin

IMECE 2002; 45-50doi:https://doi.org/10.1115/IMECE2002-39269

Abstract

View Articletitled, Residual Stress Analysis of Silicon-Aluminum-Glass Bonding Processes

PDF

Topics: Aluminum , Bonding , Glass , Silicon , Stress analysis (Engineering) , Quartz , Borosilicate glasses , Fracture (Materials) , Fracture toughness , Stress

An Integrated Wafer-Scale Packaging Process for MEMS

Thomas W. Kenny, Rob N. Candler, Huimou J. Li, Woo-Tae Park, Junghwa Cho, Holden Li, Aaron Partridge, Gary Yama, Marcus Lutz

IMECE 2002; 51-54doi:https://doi.org/10.1115/IMECE2002-39270

Abstract

View Articletitled, An Integrated Wafer-Scale Packaging Process for MEMS

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Topics: Microelectromechanical systems , Packaging , Semiconductor wafers , Electronics , High pressure (Physics) , Injection molding , Manufacturing , Polysilicon

Laser Bonding and Modeling for Wafer-Level and Chip-Scale Packaging of Micro-Electro-Mechanical Systems

Yi Tao, Ajay P. Malshe, W. D. Brown

IMECE 2002; 55-60doi:https://doi.org/10.1115/IMECE2002-39271

Abstract

View Articletitled, Laser Bonding and Modeling for Wafer-Level and Chip-Scale Packaging of Micro-Electro-Mechanical Systems

PDF

Topics: Bonding , Lasers , MEMS packaging , Microelectromechanical systems , Modeling , Semiconductor wafers , Vacuum

Low Temperature Anodic Bonding for MEMS Applications

J. Wei, Z. P. Wang, L. Wang, G. Y. Li, Z. Q. Mo

IMECE 2002; 61-66doi:https://doi.org/10.1115/IMECE2002-39272

Abstract

View Articletitled, Low Temperature Anodic Bonding for MEMS Applications

PDF

Topics: Bonding , Low temperature , Microelectromechanical systems , Taguchi methods

Linear Programming Performance Bounds for Markov Chains With Polyhedrally Translation Invariant Probabilities and Applications to Unreliable Manufacturing Systems and Enhanced Wafer Fab Models

James R. Morrison, P. R. Kumar

IMECE 2002; 69-78doi:https://doi.org/10.1115/IMECE2002-39274

Abstract

View Articletitled, Linear Programming Performance Bounds for Markov Chains With Polyhedrally Translation Invariant Probabilities and Applications to Unreliable Manufacturing Systems and Enhanced Wafer Fab Models

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Topics: Chain , Linear programming , Manufacturing systems , Probability , Semiconductor wafers

A Statistical Approach to Improve Wafer Fabrication Yield

Nael Barakat, Hesham Enshasy

IMECE 2002; 79-84doi:https://doi.org/10.1115/IMECE2002-39275

Abstract

View Articletitled, A Statistical Approach to Improve Wafer Fabrication Yield

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Topics: Manufacturing , Semiconductor wafers , Statistical process control

An Analytical Dishing and Step Height Reduction Model for Chemical Mechanical Planarization (CMP)

Guanghui Fu, Abhijit Chandra

IMECE 2002; 85-88doi:https://doi.org/10.1115/IMECE2002-39276

Abstract

View Articletitled, An Analytical Dishing and Step Height Reduction Model for Chemical Mechanical Planarization (CMP)

PDF

Topics: Copper , Density , Design , Geometry , Polishing , Pressure , Semiconductor wafers , Slurries , Spectral linewidth , Stiffness

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu

IMECE 2002; 89-98doi:https://doi.org/10.1115/IMECE2002-39277

Abstract

View Articletitled, Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

PDF

Topics: Finite element analysis , Grinding , Semiconductor wafers , Semiconductors (Materials) , Wire

Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys

Qian Zhang, Abhijit Dasgupta, Peter Haswell

IMECE 2002; 99-104doi:https://doi.org/10.1115/IMECE2002-39250

Abstract

View Articletitled, Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys

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Topics: Alloys , Durability , Lead-free solders , Tin

Lead-Free Flip Chip Assembly

Sunil Gopakumar, Vinodh Poyyapakkam, Dan Blass, Peter Borgesen, K. Srihari

IMECE 2002; 105-109doi:https://doi.org/10.1115/IMECE2002-39251

Abstract

View Articletitled, Lead-Free Flip Chip Assembly

PDF

Topics: Alloys , Collapse , Copper , Flip-chip , Flip-chip assemblies , Flip-chip devices , Flux (Metallurgy) , Manufacturing , Soldering , Solders

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

Muthiah Venkateswaran, Peter Borgesen, K. Srihari

IMECE 2002; 111-115doi:https://doi.org/10.1115/IMECE2002-39252

Abstract

View Articletitled, Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

PDF

Topics: Adhesives , Flip-chip assemblies

Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

Mohammad Yunus, Muthiah Venkateswaran, Peter Borgesen

IMECE 2002; 117-123doi:https://doi.org/10.1115/IMECE2002-39253

Abstract

View Articletitled, Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

PDF

Topics: Alloys , Flip-chip , Flip-chip devices , Lead-free solders , Tin , Solders , Alpha particles , Ceramics , Copper alloys , Electronic products

Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles

Pradeep Sharma, Abhijit Dasgupta, Surya Ganti, James Loman

IMECE 2002; 125-134doi:https://doi.org/10.1115/IMECE2002-39254

Abstract

View Articletitled, Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles

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Topics: Lead-free solders , Particulate matter , Alloys , Calibration , Design , Grain size , Micromechanics (Engineering) , Particle size , Physics

Interface Strength Between Sub-Micron Thin Films in Opening and Sliding Delamination Modes

Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu, Masaki Shiratori

IMECE 2002; 135-139doi:https://doi.org/10.1115/IMECE2002-39631

Abstract

View Articletitled, Interface Strength Between Sub-Micron Thin Films in Opening and Sliding Delamination Modes

PDF

Topics: Delamination , Thin films , Fracture toughness , Evaluation methods , Fracture (Materials) , Fracture mechanics , Stress singularity

Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

Cemal Basaran, Jianbin Jiang

IMECE 2002; 141-150doi:https://doi.org/10.1115/IMECE2002-39632

Abstract

View Articletitled, Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

PDF

Topics: Elastic moduli , Microelectronic devices , Solder joints , Tin , Alloys , Solders , Crystals , Deformation , Elasticity , Grain size

Deterministic and Statistical Reliability of Surface Mount Components

Zhengfang Qian, Xiaohua Wu, Joe Tomase

IMECE 2002; 151-158doi:https://doi.org/10.1115/IMECE2002-39633

Abstract

View Articletitled, Deterministic and Statistical Reliability of Surface Mount Components

PDF

Topics: Reliability , Surface mount components , Failure , Fatigue life , Solder joints , Crack propagation , Fracture (Materials) , Geometry , Manufacturing , Solders

Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations

Pradeep Sharma, James Loman

IMECE 2002; 159-164doi:https://doi.org/10.1115/IMECE2002-39634

Abstract

View Articletitled, Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations

PDF

Topics: Durability , Surface mount packaging , Calibration , Deformation , Finite element analysis , Physics , Resistors , Solder joints

Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along Its Edge in a Photonic Device

John H. Lau, Steve Erasmus, Yida Zou

IMECE 2002; 165-172doi:https://doi.org/10.1115/IMECE2002-39491

Abstract

View Articletitled, Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along Its Edge in a Photonic Device

PDF

Topics: Deflection , Glass , Photonic equipment , Stress , Elastic constants , Geometry , Pressure , Temperature , Design , Double refraction

Optimization of Optical Methodology for High-Digital Resolution Quantitative Evaluation of Reliability of Microelectronics and Packaging

Cosme Furlong, Ryszard J. Pryputniewicz, Jeffrey S. Yokum

IMECE 2002; 173-179doi:https://doi.org/10.1115/IMECE2002-39492

Abstract

View Articletitled, Optimization of Optical Methodology for High-Digital Resolution Quantitative Evaluation of Reliability of Microelectronics and Packaging

PDF

Topics: Computer-aided design , Electronic packaging , Microelectromechanical systems , Microelectronic devices , Optimization , Packaging , Reliability , Resolution (Optics)

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly Under Mechanical Drop Test

Shi-Wei Ricky Lee, Yin-Lai Tracy Li, Hoi-Wai Ben Lui

IMECE 2002; 181-185doi:https://doi.org/10.1115/IMECE2002-39493

Abstract

View Articletitled, Experimental Evaluation on Solder Joint Reliability of PBGA Assembly Under Mechanical Drop Test

PDF

Topics: Manufacturing , Reliability , Solder joints

Analytic Characterization of Area Array Interconnect Shear Force Behavior

Donald B. Barker, Brent M. Mager, Michael D. Osterman

IMECE 2002; 187-194doi:https://doi.org/10.1115/IMECE2002-39494

Abstract

View Articletitled, Analytic Characterization of Area Array Interconnect Shear Force Behavior

PDF

Topics: Shear (Mechanics) , Failure , Printed circuit boards , Modeling , Strength (Materials) , Stress , Thermal expansion

Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies

John Lau, Yida Zou, Sergio Camerlo

IMECE 2002; 195-202doi:https://doi.org/10.1115/IMECE2002-39495

Abstract

View Articletitled, Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies

PDF

Topics: Fracture (Materials) , Reliability , Semiconductor wafers , Solder joints , Creep , Fracture mechanics , Manufacturing , Printed circuit boards , Solders , Temperature

The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries

Anthony J. Rafanelli

IMECE 2002; 203-213doi:https://doi.org/10.1115/IMECE2002-39497

Abstract

View Articletitled, The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries

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Topics: Aerospace industry , Defense industry , Performance characterization , Solders , Adhesives , Bearings , Electronics , Military systems , Reliability , Surface mount technology

Evaluating the Assembly of Mirrored Large High-Density BGA Packages

Joe Chu, Maosen Chen, Wyeman Chen

IMECE 2002; 215-225doi:https://doi.org/10.1115/IMECE2002-39499

Abstract

View Articletitled, Evaluating the Assembly of Mirrored Large High-Density BGA Packages

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Topics: Ball-Grid-Array packages , Density , Manufacturing , Design , Design for Manufacturing , Electronics

Optimization of Multiple Head SMT Placement Machine: Model and Approaches

Youjiao Zeng, Junqi Yan, Ye Jin, Tao Jiang

IMECE 2002; 227-232doi:https://doi.org/10.1115/IMECE2002-39500

Abstract

View Articletitled, Optimization of Multiple Head SMT Placement Machine: Model and Approaches

PDF

Topics: Machinery , Optimization , Printed circuit boards , Weight (Mass) , Algorithms , Computer software , Cycles

Optimization of Contact Dynamics for an RF MEMS Switch

Ryszard J. Pryputniewicz, Cosme Furlong, Emily J. Pryputniewicz

IMECE 2002; 233-239doi:https://doi.org/10.1115/IMECE2002-39504

Abstract

View Articletitled, Optimization of Contact Dynamics for an RF MEMS Switch

PDF

Topics: Contact dynamics , Microelectromechanical systems , Optimization , Switches , Dimensions , Cantilevers , Uncertainty , Boundary-value problems , Dynamics (Mechanics) , Experimental characterization

Determination of Glass Transition Temperature (T_g) of Adhesive-Based Optical Fiber Components by In-Situ Bragg Grating Strain Sensing

Keita Broadwater, Donald Barker, Yubing Yang

IMECE 2002; 241-247doi:https://doi.org/10.1115/IMECE2002-39506

Abstract

View Articletitled, Determination of Glass Transition Temperature (Tg) of Adhesive-Based Optical Fiber Components by In-Situ Bragg Grating Strain Sensing

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Topics: Adhesives , Fiber Bragg gratings , Glass transition , Optical fiber , Epoxy adhesives , Cycles , Fibers , Hardening (Curing) , Sensors , Strain sensors

Advanced OEH Methodology for Evaluation of Microelectronics and Packaging

Cosme Furlong, Ryszard J. Pryputniewicz

IMECE 2002; 249-254doi:https://doi.org/10.1115/IMECE2002-39508

Abstract

View Articletitled, Advanced OEH Methodology for Evaluation of Microelectronics and Packaging

PDF

Topics: Holography , Microelectronic devices , Nondestructive evaluation , Packaging , Electronic packages , Electronic packaging , Metrology , Reliability , Testing

Thermal Stress Induced Void Formation in Semiconductor Interconnect

Xiaoling He, Clemens Burda

IMECE 2002; 255-258doi:https://doi.org/10.1115/IMECE2002-39513

Abstract

View Articletitled, Thermal Stress Induced Void Formation in Semiconductor Interconnect

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Topics: Semiconductors (Materials) , Simulation , Stress , Thermal stresses , Delamination , Stress concentration , Cycles , Deformation , Failure , Metals

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

S. W. Ricky Lee, Yat-Kit Tsui, Xingjia Hunag, Eric C. C. Yan

IMECE 2002; 259-262doi:https://doi.org/10.1115/IMECE2002-39514

Abstract

View Articletitled, Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

PDF

Topics: Shear strength , Solders , Storage , Temperature

Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation

Zhaohui Shan, Suresh K. Sitaraman

IMECE 2002; 263-267doi:https://doi.org/10.1115/IMECE2002-39668

Abstract

View Articletitled, Characterization of Mechanical Properties of Thin Films by Nanoindentation Technique and Finite Element Simulation

PDF

Topics: Finite element analysis , Mechanical properties , Nanoindentation , Simulation , Thin films

On the Dynamic Short-Time Scale Wave Propagation and the Characterization of Optimal Packaging Material for High Performance Electronic Packages

Yoonchan Oh, C. Steve Suh, H.-J. Sue

IMECE 2002; 269-276doi:https://doi.org/10.1115/IMECE2002-39669

Abstract

View Articletitled, On the Dynamic Short-Time Scale Wave Propagation and the Characterization of Optimal Packaging Material for High Performance Electronic Packages

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Topics: Electronic packages , Packaging , Wave propagation , Transients (Dynamics) , Reliability , Waves , Clocks , Cracking (Materials) , Delamination , Density

Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications

Mitul B. Modi, Suresh K. Sitaraman

IMECE 2002; 277-282doi:https://doi.org/10.1115/IMECE2002-39670

Abstract

View Articletitled, Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications

PDF

Topics: Fracture (Materials) , Fracture toughness , Microelectromechanical systems , Microelectronic devices , Thin films

Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials

Shashikant Hegde, Raghuram V. Pucha, Suresh K. Sitaraman

IMECE 2002; 283-290doi:https://doi.org/10.1115/IMECE2002-39671

Abstract

View Articletitled, Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials

PDF

Topics: Cracking (Materials) , Density , Dielectric materials , Electrical wires , Fracture (Process) , Reliability , Thermomechanics , Warping

High Cycle Vibration Testing of BGA Packages

Valmiki K. Sooklal, Michael C. Larson, Xia Liu

IMECE 2002; 291-296doi:https://doi.org/10.1115/IMECE2002-39672

Abstract

View Articletitled, High Cycle Vibration Testing of BGA Packages

PDF

Topics: Ball-Grid-Array packages , Cycles , Testing , Vibration , Ball-Grid-Array packaging , Crack propagation , Failure , Finite element analysis , Fracture (Materials) , Interferometry

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks

Roger Schmidt, Ethan Cruz

IMECE 2002; 297-309doi:https://doi.org/10.1115/IMECE2002-39652

Abstract

View Articletitled, Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks

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Topics: Computers , Data centers , Temperature , Computational fluid dynamics , Flow (Dynamics) , Tiles , Computer simulation , Design , Electronic equipment , Temperature distribution

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

S. M. Hsu, J. C. Lin, K. N. Chiang

IMECE 2002; 311-318doi:https://doi.org/10.1115/IMECE2002-39674

Abstract

View Articletitled, A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

PDF

Topics: Finite element analysis , Flip-chip , Flip-chip devices , Flip-chip packages , Reliability , Finite element model , Design , Computation , Ball-Grid-Array packages , Ceramics

Failure Prediction of Flip Chip Packages Using Finite Element Technique

Abm Hasan, H. Mahfuz, M. Saha, S. Jeelani

IMECE 2002; 319-328doi:https://doi.org/10.1115/IMECE2002-39675

Abstract

View Articletitled, Failure Prediction of Flip Chip Packages Using Finite Element Technique

PDF

Topics: Failure , Finite element analysis , Flip-chip packages

Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

Krishna Tunga, James Pyland, Raghuram V. Pucha, Suresh K. Sitaraman

IMECE 2002; 329-335doi:https://doi.org/10.1115/IMECE2002-39676

Abstract

View Articletitled, Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

PDF

Topics: Constitutive equations , Fatigue , Solder joints , Solders , Fatigue life , Ball-Grid-Array packaging , Damage

Failure Simulation of Angled Polycrystalline Lines Covered With Passivation Layer

Masataka Hasegawa, Kazuhiko Sasagawa, Masumi Saka, Hiroyuki Abe´

IMECE 2002; 337-343doi:https://doi.org/10.1115/IMECE2002-39677

Abstract

View Articletitled, Failure Simulation of Angled Polycrystalline Lines Covered With Passivation Layer

PDF

Topics: Failure , Simulation , Electrodiffusion , Damage , Computer simulation , Corners (Structural elements) , Density , Integrated circuits , Shapes

Effective Thermal-Mechanical Modeling of Solder Joints

Hsien-Chie Cheng, Chin-Yin Yu, Wen-Hwa Chen

IMECE 2002; 345-352doi:https://doi.org/10.1115/IMECE2002-39678

Abstract

View Articletitled, Effective Thermal-Mechanical Modeling of Solder Joints

PDF

Topics: Modeling , Solder joints , Finite element model , Temperature , Constitutive equations , Elastoplasticity , Finite element analysis , Solders , Viscoelasticity

A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman

IMECE 2002; 353-359doi:https://doi.org/10.1115/IMECE2002-39679

Abstract

View Articletitled, A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect

PDF

Topics: Lithography , Semiconductor wafers , Packaging , Design , Manufacturing , Diluents , Displacement , Electronic packaging , Geometry , Integrated circuit fabrication

Prediction of Equilibrium and Stability of Molten Solder Profiles by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi, Hiroshi Sakuta

IMECE 2002; 361-368doi:https://doi.org/10.1115/IMECE2002-39680

Abstract

View Articletitled, Prediction of Equilibrium and Stability of Molten Solder Profiles by Finite Element Analysis

PDF

Topics: Equilibrium (Physics) , Finite element analysis , Solders , Stability , Shapes , Solder joints , Stress , Surface tension , Ball-Grid-Array packaging , Finite element methods

Process-Induced Stress Effect on Reliability of ChipSeal^® Passivation Technology

Yeong K. Kim, Rudolf Krondorfer, Suresh K. Sitaraman

IMECE 2002; 369-377doi:https://doi.org/10.1115/IMECE2002-39681

Abstract

View Articletitled, Process-Induced Stress Effect on Reliability of ChipSeal® Passivation Technology

PDF

Topics: Reliability , Stress , Metals , Design , Errors , Integrated circuits , Microelectronic devices , Modeling , Numerical analysis , Response surface methodology

Reliability Evaluation of CSP Using New Flip-Chip Bonding Technology: Both-Sided CSP and Single-Sided CSP

Hideo Koguchi, Nipon Taweejun, Kazuto Nishida, Chie Sasaki

IMECE 2002; 379-385doi:https://doi.org/10.1115/IMECE2002-39682

Abstract

View Articletitled, Reliability Evaluation of CSP Using New Flip-Chip Bonding Technology: Both-Sided CSP and Single-Sided CSP

PDF

Topics: Bonding , Finite element methods , Flip-chip , Reliability , Stress , Deformation , Diluents , Packaging , Resins , Shear stress

Mechanical and Electrical Study of Linear Spring and J-Spring

Lunyu Ma, Qi Zhu, Suresh K. Sitaraman

IMECE 2002; 387-394doi:https://doi.org/10.1115/IMECE2002-39683

Abstract

View Articletitled, Mechanical and Electrical Study of Linear Spring and J-Spring

PDF

Topics: Springs , Semiconductor wafers , Semiconductors (Materials) , Computer simulation , Geometry , Manufacturing , Stress , Density , Dimensions , Displacement

Experimental Estimation of the Phase Front Under Local Thermal Non-Equilibrium Condition: Phase Change Phenomena in Porous Media

A. G. Agwu Nnanna, A. Haji-Sheikh, Kendall T. Harris

IMECE 2002; 395-423doi:https://doi.org/10.1115/IMECE2002-39705

Abstract

View Articletitled, Experimental Estimation of the Phase Front Under Local Thermal Non-Equilibrium Condition: Phase Change Phenomena in Porous Media

PDF

Topics: Equilibrium (Physics) , Porous materials , Thermal equilibrium , Cooling systems , Cryonics , Freezing , Phase change materials , Thawing

Deformation of Conductive Particles and Reliability of Electronic Devices Using COG

Takashi Akiguchi, Hideo Koguchi, M. Yamaguchi, A. Takayasu

IMECE 2002; 425-430doi:https://doi.org/10.1115/IMECE2002-39684

Abstract

View Articletitled, Deformation of Conductive Particles and Reliability of Electronic Devices Using COG

PDF

Topics: Deformation , Particulate matter , Reliability , Electrodes , Materials properties , Anisotropy , Bonding , Diluents , Glass , Thin film transistors

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

J. Wei, Z. P. Wang, Y. M. Tan

IMECE 2002; 431-436doi:https://doi.org/10.1115/IMECE2002-39685

Abstract

View Articletitled, Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

PDF

Topics: Bonding , Ceramics , Flip-chip , Flip-chip devices , Shear (Mechanics)

Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints

Qiang Yu, Doseop Kim, Jaechul Jin, Yasuhiro Takahashi, Masaki Shiratori

IMECE 2002; 437-443doi:https://doi.org/10.1115/IMECE2002-39686

Abstract

View Articletitled, Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints

PDF

Topics: Fatigue strength , Lead-free solders , Tin , Solders , Solder joints , Corners (Structural elements) , Fatigue life , Finite element methods , Fracture (Materials) , Intermetallic compounds

High-Lead Solder Ball Characteristics in BGA Package

Nicholas Kao, Y. P. Wang, C. S. Hsiao

IMECE 2002; 445-450doi:https://doi.org/10.1115/IMECE2002-39687

Abstract

View Articletitled, High-Lead Solder Ball Characteristics in BGA Package

PDF

Topics: Ball-Grid-Array packages , Shear strength , Solder joints , Solders , Shear (Mechanics) , Alloys , Elongation , Lead alloys , Melting , Reliability

Photonics

Transient Reflectance Response to Hot Electron Relaxation in InP Based Films

J. Michael Klopf, John L. Hostetler, Pamela M. Norris

IMECE 2002; 453-457doi:https://doi.org/10.1115/IMECE2002-39625

Abstract

View Articletitled, Transient Reflectance Response to Hot Electron Relaxation in InP Based Films

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Topics: Electrons , Reflectance , Relaxation (Physics) , Transients (Dynamics) , Absorption , Probes , Pumps , Thin films , Ultrashort laser pulses , Delays

Simulations and Statistical Analyses of the Alignment of Patterned Optical Waveguides

Min-Yi Shih, Matt Nielsen, Ernie Balch, Leonard Douglas

IMECE 2002; 459-463doi:https://doi.org/10.1115/IMECE2002-39207

Abstract

View Articletitled, Simulations and Statistical Analyses of the Alignment of Patterned Optical Waveguides

PDF

Topics: Engineering simulation , Simulation , Statistical analysis , Waveguides

Passive Optoelectronics Component Manufacturing: A Case Study

Laurence A. Harvilchuck, Peter Borgesen, Pericles Kondos, Sunil Gopakumar, K. Srihari

IMECE 2002; 465-469doi:https://doi.org/10.1115/IMECE2002-39208

Abstract

View Articletitled, Passive Optoelectronics Component Manufacturing: A Case Study

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Topics: Manufacturing , Optoelectronic devices

Packaging of Single Mode Laser Diodes

Peter Bo̸rgesen, Pericles A. Kondos, Vinu Yamunan

IMECE 2002; 471-475doi:https://doi.org/10.1115/IMECE2002-39209

Abstract

View Articletitled, Packaging of Single Mode Laser Diodes

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Topics: Lasers , Manufacturing , Optoelectronic devices , Packaging

Electrical Systems Design

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Hua Ye, Cemal Basaran, Douglas Hopkins

IMECE 2002; 477-483doi:https://doi.org/10.1115/IMECE2002-33650

Abstract

View Articletitled, Mechanical Implications of High Current Densities in Flip Chip Solder Joints

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Topics: Flip-chip , Flip-chip devices , Solder joints , Electrodiffusion , Temperature , Solders , Anodes , Current density , Damage , Nanoindentation

Analytical Expressions for Shear and Axial Joint Deformations in Area-Array Assemblies Due to Global CTE Mismatch

S. M. Heinrich, S. Shakya, P. S. Lee, J. Liang

IMECE 2002; 485-497doi:https://doi.org/10.1115/IMECE2002-39636

Abstract

View Articletitled, Analytical Expressions for Shear and Axial Joint Deformations in Area-Array Assemblies Due to Global CTE Mismatch

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Topics: Deformation , Shear (Mechanics) , Manufacturing , Corners (Structural elements) , Dimensions , Materials properties , Shear deformation , Compression , Warping , Design

Accelerated Reliability Methodologies for Electronic Components: A Case Study

Nick Strifas, John Fraysse, Massimo Ruzzene

IMECE 2002; 499-503doi:https://doi.org/10.1115/IMECE2002-39637

Abstract

View Articletitled, Accelerated Reliability Methodologies for Electronic Components: A Case Study

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Topics: Electronic components , Reliability , Failure , Computer software , Density , Fiber optic sensors , Life testing , Probability , Sensors , Stress

Nanotechnology

Thermal Finite Difference Analysis of Threshold Heating for Nanoscale Machining

Chris A. Trinkle, Phil Smith, R. Ryan Vallance, Basil T. Wong, M. Pinar Mengu¨c¸

IMECE 2002; 507-513doi:https://doi.org/10.1115/IMECE2002-39377

Abstract

View Articletitled, Thermal Finite Difference Analysis of Threshold Heating for Nanoscale Machining

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Topics: Heating , Machining , Nanoscale phenomena , Absorption , Atoms , Electron emission , Electrons , Heat , Heat conduction , Laser beams

Ultrasonic Rapid Manufacturing: Implementation and Thermo-Mechanical Analysis

Shailendra Yadav, Charalabos Doumanidis

IMECE 2002; 515-521doi:https://doi.org/10.1115/IMECE2002-39378

Abstract

View Articletitled, Ultrasonic Rapid Manufacturing: Implementation and Thermo-Mechanical Analysis

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Topics: Manufacturing , Thermomechanics , Metals , Ultrasonic welding , Composite materials , Cycles , Heat , Temperature effects , Welding

Analysis of the Possibility to Simulate a 3D Single-Roll Burnishing Process Using FEA

Sorin Neagu-Ventzel, Liviu C. Luca, Sorin Cioc, Ioan Marinescu

IMECE 2002; 523-528doi:https://doi.org/10.1115/IMECE2002-39380

Abstract

View Articletitled, Analysis of the Possibility to Simulate a 3D Single-Roll Burnishing Process Using FEA

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Topics: Computer software , Finite element analysis , Finite element methods , Finite element model , Shapes , Simulation , Stress

Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing

Chad B. O’Neil, Ajay P. Malshe, Kumar Virwani, William F. Schmidt

IMECE 2002; 529-534doi:https://doi.org/10.1115/IMECE2002-39381

Abstract

View Articletitled, Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of MEMS-Based Mechanical System-on-a-Chip (SOAC) for Nanomanufacturing

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Topics: Design , Microelectromechanical systems , Modeling , Nanomanufacturing , Tolerance analysis

Enhanced Industrial Applicability of Aluminum Alloy by Coating Technique With Titanium/Carbon Compositionally Gradient Film Using Magnetron Co-Sputtering

T. Sonoda, A. Watazu, J. Zhu, W. Shi, A. Kamiya, K. Kato, T. Asahina

IMECE 2002; 535-537doi:https://doi.org/10.1115/IMECE2002-39382

Abstract

View Articletitled, Enhanced Industrial Applicability of Aluminum Alloy by Coating Technique With Titanium/Carbon Compositionally Gradient Film Using Magnetron Co-Sputtering

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Topics: Aluminum alloys , Carbon , Coatings , Sputtering (Irradiation) , Titanium , Alloys , Abrasion , Adhesion , Adhesives , Ceramic coatings

A Unified Model for Shear Driven Gas Micro Flows

P. Bahukudumbi, Ali Beskok

IMECE 2002; 541-549doi:https://doi.org/10.1115/IMECE2002-33699

Abstract

View Articletitled, A Unified Model for Shear Driven Gas Micro Flows

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Topics: Flow (Dynamics) , Shear (Mechanics) , Microelectromechanical systems , Shear stress , Compressible flow , Modeling , Rarefied fluid dynamics , Simulation

Examination of the Slip Boundary Condition by µ-PIV and Lattice Boltzmann Simulations

Derek C. Tretheway, Luoding Zhu, Linda Petzold, Carl D. Meinhart

IMECE 2002; 551-556doi:https://doi.org/10.1115/IMECE2002-33704

Abstract

View Articletitled, Examination of the Slip Boundary Condition by µ-PIV and Lattice Boltzmann Simulations

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Topics: Boundary-value problems , Engineering simulation , Lattice Boltzmann methods , Simulation , Probability , Channel flow , Shear rate , Computer simulation , Flow (Dynamics) , Fluids

To Slip or Not to Slip: Water Flows in Hydrophilic and Hydrophobic Microchannels

Chang-Hwan Choi, K. Johan A. Westin, Kenneth S. Breuer

IMECE 2002; 557-564doi:https://doi.org/10.1115/IMECE2002-33707

Abstract

View Articletitled, To Slip or Not to Slip: Water Flows in Hydrophilic and Hydrophobic Microchannels

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Topics: Flow (Dynamics) , Microchannels , Water , Shear rate , Borosilicate glasses , Coating processes , Coatings , Manufacturing , Pressure , Self-assembly