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Proceedings Papers

Transient Thermo-Elasto-Plastic Spherical Contact Analyses Considering Effects of Thermal Softening and Heat Partition

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W. Wayne Chen, Q. Jane Wang
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 605-607, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71206
https://doi.org/10.1115/IJTC2008-71206
View Paper titled, Transient Thermo-Elasto-Plastic Spherical Contact Analyses Considering Effects of Thermal Softening and Heat Partition
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Topics: Heat, Transients (Dynamics), Temperature, Deformation, Failure, Heating, Thermal expansion, Transient heat transfer, Work hardening
Proceedings Papers

Nanoindentation of Silica Nanoparticles Attached to a Silicon Substrate

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Min Zou, Dehua Yang
Proc. ASME. IJTC2006, Part A: Tribomaterials; Lubricants and Additives; Elastohydrodynamic Lubrication; Hydrodynamic Lubrication and Fluid Film Bearings; Rolling Element Bearings; Engine Tribology; Machine Components Tribology; Contact Mechanics, 767-774, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12140
https://doi.org/10.1115/IJTC2006-12140
View Paper titled, Nanoindentation of Silica Nanoparticles Attached to a Silicon Substrate
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Topics: Nanoindentation, Nanoparticles, Silicon, Deformation, Scanning probe microscopy, Annealing, Brittleness, Crystals, Elastic moduli, Mechanical properties
Proceedings Papers

Some Tribological Aspects of Thin Film Copper During CMP

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Subrahmanya R. Mudhivarthi, Veera Raghava Kakireddy, Jayanta Banerjee, Ashok Kumar
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 987-996, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12307
https://doi.org/10.1115/IJTC2006-12307
View Paper titled, Some Tribological Aspects of Thin Film Copper During CMP
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Topics: Copper, Thin films, Tribology, Polishing, Temperature, Friction, Mechanical properties, Slurries, Pressure, Work hardening