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Proceedings Papers

On Polishing and Erosion of Aluminum Substrates by a Jet of Alumina Slurry

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Shreyansh Patel, Sinan Mu¨ftu¨
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 369-371, October 24–26, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2011-61082
https://doi.org/10.1115/IJTC2011-61082
View Paper titled, On Polishing and Erosion of Aluminum Substrates by a Jet of Alumina Slurry
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Topics: Aluminum, Erosion, Polishing, Slurries, Computational fluid dynamics, Surface roughness, Jets, Metal surfaces, Particulate matter, Pressure
Proceedings Papers

A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads

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H. Xu, K. Komvopoulos
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 169-171, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71242
https://doi.org/10.1115/IJTC2008-71242
View Paper titled, A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads
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Topics: Grinding, Magnetic recording, Particulate matter, Polishing, Density, Fluids, Geometry, Manufacturing, Particle size, Plates (structures)
Proceedings Papers

The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load

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Joseph A. Levert, David Haas, Chad S. Korach, Nicholas Lakomcik, Edward Peters
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 731-733, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71217
https://doi.org/10.1115/IJTC2008-71217
View Paper titled, The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load
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Topics: Friction, Stress, Polishing, Slurries, Damage, Deflection, Dielectric materials, Integrated circuits, Manufacturing, Thin films
Proceedings Papers

Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing

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A. Osorno, S. Tereshko, I. Yoon, S. Danyluk
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1081-1082, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44441
https://doi.org/10.1115/IJTC2007-44441
View Paper titled, Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing
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Topics: Dynamics (Mechanics), Polishing, Pressure, Semiconductor wafers, Silicon, Particulate matter, Slurries, Electronics, Integrated circuits, Manufacturing
Proceedings Papers

Application of Nanofluids in Minimum Quantity Lubrication Grinding

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Bin Shen, Albert Shih, Simon Tung
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 725-731, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44160
https://doi.org/10.1115/IJTC2007-44160
View Paper titled, Application of Nanofluids in Minimum Quantity Lubrication Grinding
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Topics: Grinding, Lubrication, Nanofluids, Water, Wear, Wheels, Cast iron, Combustion, Diamonds, Grinding wheels
Proceedings Papers

Effect of the Nature of Nitride Phases on the Micro Abrasion of Plasma Nitrided Sintered Iron

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J. D. B. De Mello, C. Binder, V. B. Deme´trio, A. N. Klein
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 39-41, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44255
https://doi.org/10.1115/IJTC2007-44255
View Paper titled, Effect of the Nature of Nitride Phases on the Micro Abrasion of Plasma Nitrided Sintered Iron
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Topics: Abrasion, Iron, Plasmas (Ionized gases), Nitriding, Slurries, Tribology, Wear testing
Proceedings Papers

Slurry Erosion Behaviors of Pseudoelastic TiNi Alloy

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Renbo Xu, Lishan Cui, Yanjun Zheng, Siwei Zhang
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 23-25, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44169
https://doi.org/10.1115/IJTC2007-44169
View Paper titled, Slurry Erosion Behaviors of Pseudoelastic TiNi Alloy
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Topics: Alloys, Erosion, Slurries, Deformation, Particulate matter, Stainless steel, Surfaces (Materials)
Proceedings Papers

In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process

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Arun Sikder, Norm Gitis, Michael Vinogradov, Antanas Daugela
Proc. ASME. TRIB2004, ASME/STLE 2004 International Joint Tribology Conference, Parts A and B, 55-58, October 24–27, 2004
Publisher: American Society of Mechanical Engineers
Paper No: TRIB2004-64346
https://doi.org/10.1115/TRIB2004-64346
View Paper titled, In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process
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Topics: Tribology, Signals, Acoustic emissions, Adhesion, Copper, Delamination, Friction, Integrated circuits, Semiconductor wafers, Slurries
Proceedings Papers

The “Leaves on the Line” Problem: A Study of Film Formation and Lubricity Under Simulated Railtrack Conditions

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P. M. Cann
Proc. ASME. IJTC2006, Part A: Tribomaterials; Lubricants and Additives; Elastohydrodynamic Lubrication; Hydrodynamic Lubrication and Fluid Film Bearings; Rolling Element Bearings; Engine Tribology; Machine Components Tribology; Contact Mechanics, 169-178, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12267
https://doi.org/10.1115/IJTC2006-12267
View Paper titled, The “Leaves on the Line” Problem: A Study of Film Formation and Lubricity Under Simulated Railtrack Conditions
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Topics: Absorption, Adhesion, Biomass, Chemical reactions, Disks, Friction, Ions, Lubricants, Lubrication, Metals
Proceedings Papers

Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning

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Dedy Ng, Ting-Gang Zhang, Hong Liang
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 929-937, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12141
https://doi.org/10.1115/IJTC2006-12141
View Paper titled, Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning
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Topics: Lubrication, Particulate matter, Adhesion, Atomic force microscopy, Polishing, Theoretical analysis, Drag (Fluid dynamics), Finite element analysis, Fluid films, Fundamental forces (Physics)
Proceedings Papers

A Model for Studying the Hydrodynamic Slurry Behavior in CMP: Discrete and Continuous Phases

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Elon Terrell, C. Fred Higgs, III
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 959-969, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12229
https://doi.org/10.1115/IJTC2006-12229
View Paper titled, A Model for Studying the Hydrodynamic Slurry Behavior in CMP: Discrete and Continuous Phases
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Topics: Slurries, Particulate matter, Polishing, Semiconductor wafers, Fluids, Kinematics, Manufacturing, Pressing, Shear (Mechanics), Simulation
Proceedings Papers

CMP Friction as a Function of Slurry Silica Nanoparticle Concentration and Diameter

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Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 981-986, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12235
https://doi.org/10.1115/IJTC2006-12235
View Paper titled, CMP Friction as a Function of Slurry Silica Nanoparticle Concentration and Diameter
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Topics: Friction, Nanoparticles, Slurries, Particulate matter, Atomic force microscopy, Damage, Dielectric materials, Abrasives, Integrated circuits, Nanoscale phenomena
Proceedings Papers

Some Tribological Aspects of Thin Film Copper During CMP

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Subrahmanya R. Mudhivarthi, Veera Raghava Kakireddy, Jayanta Banerjee, Ashok Kumar
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 987-996, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12307
https://doi.org/10.1115/IJTC2006-12307
View Paper titled, Some Tribological Aspects of Thin Film Copper During CMP
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Topics: Copper, Thin films, Tribology, Polishing, Temperature, Friction, Mechanical properties, Slurries, Pressure, Work hardening