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Proceedings Papers

A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers

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Jeremiah N. Mpagazehe, Geo A. Thukalil, C. Fred Higgs, III
Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 27-29, October 19–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2009-15205
https://doi.org/10.1115/IJTC2009-15205
View Paper titled, A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers
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Topics: Erosion, Physics, Semiconductor wafers, Electrical properties, Integrated circuits, Lubrication, Particulate matter, Polishing
Proceedings Papers

Post-CMP Cleaning Applications

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V. Khosla, M. Vinogradov, N. V. Gitis, R. K. Singh, D. W. Stockbower, C. R. Wargo
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 719-720, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71017
https://doi.org/10.1115/IJTC2008-71017
View Paper titled, Post-CMP Cleaning Applications
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Topics: Adhesion, Contamination, Ethanol, Particulate matter, Polishing, Semiconductor wafers, Stability, Surface roughness
Proceedings Papers

Nano-Scale Tribological Properties of Silicon Pillars With the Variation in Pitch

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Duc-Cuong Pham, R. Arvind Singh, Jinseok Kim, Sungwook Yang, Eui-Sung Yoon
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 115-117, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71289
https://doi.org/10.1115/IJTC2008-71289
View Paper titled, Nano-Scale Tribological Properties of Silicon Pillars With the Variation in Pitch
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Topics: Columns (Structural), Nanoscale phenomena, Silicon, Tribology, Adhesion, Friction, Microelectromechanical systems, Nanostructures , Semiconductor wafers
Proceedings Papers

Optimum Roughness for Minimum Adhesion

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D.-L. Liu, J. Martin, N. A. Burnham
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 593-595, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71192
https://doi.org/10.1115/IJTC2008-71192
View Paper titled, Optimum Roughness for Minimum Adhesion
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Topics: Adhesion, Surface roughness, Adhesives, Atomic force microscopy, Fractals, Cantilevers, Computer software, Contact mechanics, Microelectromechanical systems, Nanoscale phenomena
Proceedings Papers

On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP

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Dinc¸er Bozkaya, Sinan Mu¨ftu¨
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 557-559, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71122
https://doi.org/10.1115/IJTC2008-71122
View Paper titled, On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP
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Topics: Dielectric materials, Fracture (Materials), Fracture (Process), Particulate matter, Polishing, Pressure, Semiconductor wafers
Proceedings Papers

Anisotropic Frictional Behavior of Nanotextured Surfaces

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H.-S. Zhang, K. Komvopoulos
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 749-751, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71146
https://doi.org/10.1115/IJTC2008-71146
View Paper titled, Anisotropic Frictional Behavior of Nanotextured Surfaces
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Topics: Anisotropy, Friction, Atomic force microscopy, Stress, Adhesion, Diamonds, Imaging, Nanoscale phenomena, Semiconductor wafers
Proceedings Papers

Planar Flat Product Transport Using Viscous Traction

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Jeroen van Rij, Jasper Wesselingh, Ron A. J. van Ostayen, Jo W. Spronck, Robert H. Munnig Schmidt, Jan van Eijk
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 355-357, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71153
https://doi.org/10.1115/IJTC2008-71153
View Paper titled, Planar Flat Product Transport Using Viscous Traction
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Topics: Traction, Actuators, Glass, Bearings, Computation, Geometry, Inflow, Outflow, Semiconductor wafers, Stiffness
Proceedings Papers

A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration

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Dinc¸er Bozkaya, Sinan Mu¨ftu¨
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 569-571, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71129
https://doi.org/10.1115/IJTC2008-71129
View Paper titled, A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration
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Topics: Porosity, Pressure, Polishing, Dielectric materials, Semiconductor wafers
Proceedings Papers

Shear Strength and Durability of Self Assembled Monolayer

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Masabumi Masuko, Hiroya Miyamoto, Akihito Suzuki
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 97-99, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44221
https://doi.org/10.1115/IJTC2007-44221
View Paper titled, Shear Strength and Durability of Self Assembled Monolayer
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Topics: Durability, Self-assembly, Shear strength, Glass, Disks, Semiconductor wafers, Steel, Surface roughness, Tribology
Proceedings Papers

Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing

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A. Osorno, S. Tereshko, I. Yoon, S. Danyluk
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1081-1082, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44441
https://doi.org/10.1115/IJTC2007-44441
View Paper titled, Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing
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Topics: Dynamics (Mechanics), Polishing, Pressure, Semiconductor wafers, Silicon, Particulate matter, Slurries, Electronics, Integrated circuits, Manufacturing
Proceedings Papers

The Effect of Channelling a Polymeric Surface on Its Adhesion and Friction Characteristics

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Duc-Cuong Pham, R. Arvind Singh, Hoon Eui Jeong, Kahp Y. Suh, Eui-Sung Yoon
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 791-793, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44137
https://doi.org/10.1115/IJTC2007-44137
View Paper titled, The Effect of Channelling a Polymeric Surface on Its Adhesion and Friction Characteristics
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Topics: Adhesion, Friction, Tribology, Lithography, Manufacturing, Microelectromechanical systems, Microscale devices, Nanoelectromechanical systems, Nanoscale phenomena, Polymer films
Proceedings Papers

Effect of Adhesion on Wafer Separation Due to Trapped Particles

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Andy Pamp, George G. Adams
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 809-811, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44157
https://doi.org/10.1115/IJTC2007-44157
View Paper titled, Effect of Adhesion on Wafer Separation Due to Trapped Particles
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Topics: Adhesion, Particulate matter, Semiconductor wafers, Separation (Technology), Bonding, Nanomanufacturing, Contamination, Elastic plates, Nanoscale devices, Pressure
Proceedings Papers

The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals

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Joseph Bonivel, Sarah Biltz, Elon Terrell, Burak Ozdoganlar, C. Fred Higgs, III
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1019-1020, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44488
https://doi.org/10.1115/IJTC2007-44488
View Paper titled, The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals
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Topics: Metals, Polishing, Thin films, Semiconductor wafers, Copper, Data storage systems, Integrated circuits, Manufacturing, Mechanical properties, Nanoindentation
Proceedings Papers

Characterization of Titanium and Niobium Doped DLC Films Grown by Pulsed DC PVD: Closed Field Unbalanced Magnetron Sputtering (CFUBMS) Method

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Deniz Ugur, Ihsan Efeoglu, Sabri Altintas
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 917-919, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44257
https://doi.org/10.1115/IJTC2007-44257
View Paper titled, Characterization of Titanium and Niobium Doped DLC Films Grown by Pulsed DC PVD: Closed Field Unbalanced Magnetron Sputtering (CFUBMS) Method
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Topics: Diamond films, Sputtering (Irradiation), Titanium, Coatings, Tribology, Adhesion, Carbon, Diamonds, Disks, Glass
Proceedings Papers

Nano Wear of Noble Metals Against Silicon

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Luohan Peng, Hong Liang
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 841-843, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44227
https://doi.org/10.1115/IJTC2007-44227
View Paper titled, Nano Wear of Noble Metals Against Silicon
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Topics: Metals, Silicon, Wear, Atomic force microscopy, Adhesives, Atoms, Crystals, Eutectic alloys, Nanoscale phenomena, Oxidation
Proceedings Papers

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

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Joo Hoon Choi, Yangro Lee, Louis E. DeMarco, Richard T. Leveille, Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 749-751, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44383
https://doi.org/10.1115/IJTC2007-44383
View Paper titled, Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips
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Topics: Atomic force microscopy, Friction, Polishing, Particulate matter, Scanning probe microscopy, Circuits, Damage, Delamination, Glass, Integrated circuit fabrication
Proceedings Papers

In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process

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Arun Sikder, Norm Gitis, Michael Vinogradov, Antanas Daugela
Proc. ASME. TRIB2004, ASME/STLE 2004 International Joint Tribology Conference, Parts A and B, 55-58, October 24–27, 2004
Publisher: American Society of Mechanical Engineers
Paper No: TRIB2004-64346
https://doi.org/10.1115/TRIB2004-64346
View Paper titled, In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process
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Topics: Tribology, Signals, Acoustic emissions, Adhesion, Copper, Delamination, Friction, Integrated circuits, Semiconductor wafers, Slurries
Proceedings Papers

Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning

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Dedy Ng, Ting-Gang Zhang, Hong Liang
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 929-937, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12141
https://doi.org/10.1115/IJTC2006-12141
View Paper titled, Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning
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Topics: Lubrication, Particulate matter, Adhesion, Atomic force microscopy, Polishing, Theoretical analysis, Drag (Fluid dynamics), Finite element analysis, Fluid films, Fundamental forces (Physics)
Proceedings Papers

Deformation of Bowed Silicon Wafers Due to Applied Pressure and Adhesion

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Andy Pamp, George G. Adams
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 1407-1414, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12279
https://doi.org/10.1115/IJTC2006-12279
View Paper titled, Deformation of Bowed Silicon Wafers Due to Applied Pressure and Adhesion
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Topics: Adhesion, Deformation, Pressure, Semiconductor wafers, Separation (Technology), Surface energy, Bonding, Elastic plates, Nanomanufacturing, Nanoscale phenomena
Proceedings Papers

A Model for Studying the Hydrodynamic Slurry Behavior in CMP: Discrete and Continuous Phases

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Elon Terrell, C. Fred Higgs, III
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 959-969, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12229
https://doi.org/10.1115/IJTC2006-12229
View Paper titled, A Model for Studying the Hydrodynamic Slurry Behavior in CMP: Discrete and Continuous Phases
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Topics: Slurries, Particulate matter, Polishing, Semiconductor wafers, Fluids, Kinematics, Manufacturing, Pressing, Shear (Mechanics), Simulation