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Proceedings Papers

Influence of Surface Roughness on Traction and Scuffing Performance of Lubricated Contacts for Aerospace and Automotive Gearing

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Sam Shon, Ahmet Kahraman, Kelsen LaBerge, Brian Dykas, David Stringer
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 87-89, October 7–10, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2012-61212
https://doi.org/10.1115/IJTC2012-61212
View Paper titled, Influence of Surface Roughness on Traction and Scuffing Performance of Lubricated Contacts for Aerospace and Automotive Gearing
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Topics: Aerospace industry, Surface roughness, Traction, Gears, Polishing, Steel, Automotive transmissions, Disks, Lubricants, Mirrors
Proceedings Papers

Effect of Surface Microtexturing on Friction at Unidirectional Sliding Depending on Lubricant Viscosity

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Karl-Heinz Zum Gahr, Mario Mann
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 57-59, October 7–10, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2012-61042
https://doi.org/10.1115/IJTC2012-61042
View Paper titled, Effect of Surface Microtexturing on Friction at Unidirectional Sliding Depending on Lubricant Viscosity
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Topics: Friction, Lubricants, Viscosity, Disks, Sapphire, Texture (Materials), Water, Film thickness, Geometry, Laser ablation
Proceedings Papers

Development of the GranOO Discrete Element Platform for Dynamic Problems: Application for Tribological Application

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Ivan Iordanoff, Jean Luc Charles, Damien Andre
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 325-329, October 7–10, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2012-61200
https://doi.org/10.1115/IJTC2012-61200
View Paper titled, Development of the GranOO Discrete Element Platform for Dynamic Problems: Application for Tribological Application
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Topics: Tribology, Particulate matter, Wear, Damage, Differential equations, Electric potential, Engineering simulation, Flow (Dynamics), Licensing, Magnetic moment
Proceedings Papers

On Polishing and Erosion of Aluminum Substrates by a Jet of Alumina Slurry

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Shreyansh Patel, Sinan Mu¨ftu¨
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 369-371, October 24–26, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2011-61082
https://doi.org/10.1115/IJTC2011-61082
View Paper titled, On Polishing and Erosion of Aluminum Substrates by a Jet of Alumina Slurry
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Topics: Aluminum, Erosion, Polishing, Slurries, Computational fluid dynamics, Surface roughness, Jets, Metal surfaces, Particulate matter, Pressure
Proceedings Papers

Effect of Surface Texturing on EHD Lubrication Films Under Transient Speed Condition

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Martin Zimmerman, Ivan Krupka, Martin Hartl, Pavel Houska
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 187-189, October 24–26, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2011-61046
https://doi.org/10.1115/IJTC2011-61046
View Paper titled, Effect of Surface Texturing on EHD Lubrication Films Under Transient Speed Condition
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Topics: Lubrication, Transients (Dynamics), Lubricants, Film thickness, Cams, Damage, Disks, Gears, Glass, Interferometry
Proceedings Papers

Studies on Friction and Transfer Layer Formation When Pure Magnesium Pins Slid at Various Numbers of Cycles on Steel Plates of Different Surface Texture

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Pradeep L. Menezes, Kishore, Satish V. Kailas, Michael R. Lovell
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 263-265, October 17–20, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2010-41284
https://doi.org/10.1115/IJTC2010-41284
View Paper titled, Studies on Friction and Transfer Layer Formation When Pure Magnesium Pins Slid at Various Numbers of Cycles on Steel Plates of Different Surface Texture
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Topics: Cycles, Friction, Magnesium (Metal), Pins (Engineering), Plates (structures), Steel, Surface texture, Texture (Materials), Stick-slip, Lubrication
Proceedings Papers

The Film Formation Mechanism of High Water-Based Emulsions

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Jianbin Luo, Liran Ma
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 439-441, October 17–20, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2010-41283
https://doi.org/10.1115/IJTC2010-41283
View Paper titled, The Film Formation Mechanism of High Water-Based Emulsions
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Topics: Emulsions, Water, Cutting, Lubricants, Metals, Metalworking, Polishing, Steel
Proceedings Papers

Axiomatic Design of a Multi-Directional Motion Pin on Disk Apparatus for Biotribology Study

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Zikai Hua, Jianhua Zhang
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 37-39, October 17–20, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2010-41039
https://doi.org/10.1115/IJTC2010-41039
View Paper titled, Axiomatic Design of a Multi-Directional Motion Pin on Disk Apparatus for Biotribology Study
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Topics: Biotribology, Design, Disks, Wear, Adhesives, Artificial limbs, Control systems, Molecular weight, Pins (Engineering), Polishing
Proceedings Papers

A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers

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Jeremiah N. Mpagazehe, Geo A. Thukalil, C. Fred Higgs, III
Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 27-29, October 19–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2009-15205
https://doi.org/10.1115/IJTC2009-15205
View Paper titled, A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers
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Topics: Erosion, Physics, Semiconductor wafers, Electrical properties, Integrated circuits, Lubrication, Particulate matter, Polishing
Proceedings Papers

The Effect of Micro Dent Arrays Fabricated by Laser Shock Peening on Tribology

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R. Caslaru, Y. B. Guo
Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 451-453, October 19–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2009-15113
https://doi.org/10.1115/IJTC2009-15113
View Paper titled, The Effect of Micro Dent Arrays Fabricated by Laser Shock Peening on Tribology
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Topics: Laser hardening, Tribology, Friction, Density, Fracture (Materials), Lubricants, Microhardness, Micromachining, Polishing, Reservoirs
Proceedings Papers

A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads

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H. Xu, K. Komvopoulos
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 169-171, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71242
https://doi.org/10.1115/IJTC2008-71242
View Paper titled, A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads
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Topics: Grinding, Magnetic recording, Particulate matter, Polishing, Density, Fluids, Geometry, Manufacturing, Particle size, Plates (structures)
Proceedings Papers

Post-CMP Cleaning Applications

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V. Khosla, M. Vinogradov, N. V. Gitis, R. K. Singh, D. W. Stockbower, C. R. Wargo
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 719-720, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71017
https://doi.org/10.1115/IJTC2008-71017
View Paper titled, Post-CMP Cleaning Applications
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Topics: Adhesion, Contamination, Ethanol, Particulate matter, Polishing, Semiconductor wafers, Stability, Surface roughness
Proceedings Papers

Derivation of Reynolds Equation in Cylindrical Coordinates Applicable to Pin-on-Disk and CMP

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K. E. Beschorner, C. F. Higgs, III, M. R. Lovell
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 399-401, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71245
https://doi.org/10.1115/IJTC2008-71245
View Paper titled, Derivation of Reynolds Equation in Cylindrical Coordinates Applicable to Pin-on-Disk and CMP
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Topics: Disks, Pressure, Navier-Stokes equations, Polishing, Shapes, Tribology
Proceedings Papers

The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load

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Joseph A. Levert, David Haas, Chad S. Korach, Nicholas Lakomcik, Edward Peters
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 731-733, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71217
https://doi.org/10.1115/IJTC2008-71217
View Paper titled, The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load
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Topics: Friction, Stress, Polishing, Slurries, Damage, Deflection, Dielectric materials, Integrated circuits, Manufacturing, Thin films
Proceedings Papers

On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP

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Dinc¸er Bozkaya, Sinan Mu¨ftu¨
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 557-559, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71122
https://doi.org/10.1115/IJTC2008-71122
View Paper titled, On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP
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Topics: Dielectric materials, Fracture (Materials), Fracture (Process), Particulate matter, Polishing, Pressure, Semiconductor wafers
Proceedings Papers

A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration

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Dinc¸er Bozkaya, Sinan Mu¨ftu¨
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 569-571, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71129
https://doi.org/10.1115/IJTC2008-71129
View Paper titled, A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration
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Topics: Porosity, Pressure, Polishing, Dielectric materials, Semiconductor wafers
Proceedings Papers

Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing

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A. Osorno, S. Tereshko, I. Yoon, S. Danyluk
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1081-1082, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44441
https://doi.org/10.1115/IJTC2007-44441
View Paper titled, Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing
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Topics: Dynamics (Mechanics), Polishing, Pressure, Semiconductor wafers, Silicon, Particulate matter, Slurries, Electronics, Integrated circuits, Manufacturing
Proceedings Papers

Frictional Characteristics of Mesoporous SiO 2 Thin Film Formed by Sol-Gel and Self-Assembly Method

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Yun-Ha Shin, Hong-Gyu Jeon, Jeong-Kuk Son, Ji-Man Kim, Tae-Sung Kim, Young Ze Lee
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 9-10, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44046
https://doi.org/10.1115/IJTC2007-44046
View Paper titled, Frictional Characteristics of Mesoporous SiO 2 Thin Film Formed by Sol-Gel and Self-Assembly Method
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Topics: Self-assembly, Sol-gel processing, Thin films, Friction, Disks, Glass, Lubricants, Particulate matter, Plasma etching, Polishing
Proceedings Papers

A Multi-Physics Particle-Augmented Mixed Lubrication Modeling Approach for Studying CMP

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Elon Terrell, C. Fred Higgs, III
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1017-1018, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44487
https://doi.org/10.1115/IJTC2007-44487
View Paper titled, A Multi-Physics Particle-Augmented Mixed Lubrication Modeling Approach for Studying CMP
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Topics: Lubrication, Modeling, Particulate matter, Physics, Algorithms, Contact mechanics, Fluid mechanics, Particle dynamics, Polishing, Wear
Proceedings Papers

The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals

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Joseph Bonivel, Sarah Biltz, Elon Terrell, Burak Ozdoganlar, C. Fred Higgs, III
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1019-1020, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44488
https://doi.org/10.1115/IJTC2007-44488
View Paper titled, The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals
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Topics: Metals, Polishing, Thin films, Semiconductor wafers, Copper, Data storage systems, Integrated circuits, Manufacturing, Mechanical properties, Nanoindentation