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Proceedings Papers

Molecular Dynamics Simulation of a Rigid Sphere Indenting a Copper Substrate

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Ding Jia, Longqiu Li, Andrey Ovcharenko, Wenping Song, Guangyu Zhang
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 293-295, October 7–10, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2012-61079
https://doi.org/10.1115/IJTC2012-61079
View Paper titled, Molecular Dynamics Simulation of a Rigid Sphere Indenting a Copper Substrate
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Topics: Copper, Molecular dynamics simulation, Displacement, Simulation, Deformation, Diamonds, Molecular dynamics
Proceedings Papers

On Cohesion of Micron Scale Metal Particles in High Velocity Impact With a Metal Substrate

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Baran Yildirim, Sinan Mu¨ftu¨, Andrew Gouldstone
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 373-375, October 24–26, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2011-61084
https://doi.org/10.1115/IJTC2011-61084
View Paper titled, On Cohesion of Micron Scale Metal Particles in High Velocity Impact With a Metal Substrate
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Topics: Cohesion, Metals, Particulate matter, Deformation, Copper, Failure, Finite element methods, Plasticity, Sprays, Temperature
Proceedings Papers

Molecular Dynamics and Multiscale Simulations of Nanoindentation and Nanoscratch

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Peng-zhe Zhu, Hui Wang, Yuan-zhong Hu
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 1-3, October 17–20, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2010-41042
https://doi.org/10.1115/IJTC2010-41042
View Paper titled, Molecular Dynamics and Multiscale Simulations of Nanoindentation and Nanoscratch
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Topics: Engineering simulation, Molecular dynamics, Nanoindentation, Simulation, Deformation, Molecular dynamics simulation, Copper, Finite element methods, Stress, Crystals
Proceedings Papers

Tribo-Electric Behaviors of Copper Under Dry Sliding Against Cu-Cr Alloys

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Bao Shangguan, Yongzhen Zhang, Jiandong Xing
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 443-445, October 17–20, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2010-41292
https://doi.org/10.1115/IJTC2010-41292
View Paper titled, Tribo-Electric Behaviors of Copper Under Dry Sliding Against Cu-Cr Alloys
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Topics: Alloys, Copper
Proceedings Papers

Very Early Stage of Elastic-Plastic Spherical Contact Fretting

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Andrey Ovcharenko, Izhak Etsion
Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 281-283, October 19–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2009-15031
https://doi.org/10.1115/IJTC2009-15031
View Paper titled, Very Early Stage of Elastic-Plastic Spherical Contact Fretting
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Topics: Copper, Cycles, Deformation, Displacement, Energy dissipation, Friction, Hardening, Junctions, Sapphire, Steel
Proceedings Papers

Viscosity and Tribology of Copper Oxide Nanofluids

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A. Hernandez Battez, J. L. Viesca Rodriguez, R. Gonzalez Rodriguez, J. E. Fernandez Rico
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 205-207, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71058
https://doi.org/10.1115/IJTC2008-71058
View Paper titled, Viscosity and Tribology of Copper Oxide Nanofluids
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Topics: Copper, Nanofluids, Tribology, Viscosity, Nanoparticles, Composite materials, Friction, Wear
Proceedings Papers

Influence of Crystallographic Orientation on Energy Dissipation During Sliding

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Jeremy J. Dawkins, Richard W. Neu
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 565-567, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44259
https://doi.org/10.1115/IJTC2007-44259
View Paper titled, Influence of Crystallographic Orientation on Energy Dissipation During Sliding
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Topics: Energy dissipation, Plasticity, Crystals, Deformation, Copper, Crystal structure, Engineering simulation, Finite element analysis, Friction, Simulation
Proceedings Papers

Effect of Current Polarity on Tribological Behavior of Copper-Aluminum Electrical Interface

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Dinesh Bansal, Andriy Kovalchenko, Jeffrey Streator, Steven Danyluk
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 467-469, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44352
https://doi.org/10.1115/IJTC2007-44352
View Paper titled, Effect of Current Polarity on Tribological Behavior of Copper-Aluminum Electrical Interface
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Topics: Aluminum, Copper, Tribology, Wear, Anodes, Friction, Amperes, Coatings, Current density, Design
Proceedings Papers

An Investigation of Three Dimensional Elastic-Plastic Hemispherical Sliding Contact, Part II: Results

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John Moody, Itzhak Green
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 581-583, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44302
https://doi.org/10.1115/IJTC2007-44302
View Paper titled, An Investigation of Three Dimensional Elastic-Plastic Hemispherical Sliding Contact, Part II: Results
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Topics: Aluminum, Copper, Deformation, Energy dissipation, Finite element analysis, Steel, Stress
Proceedings Papers

Tribological Behavior of Self-Lubrication Bearing Materials of Steel-Copper-Polyoxymethylene Containing MoS2-IC Nanoparticles

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K. H. Hu, J. Wang, S. Schraube, Y. F. Xu, X. G. Hu, R. Stengler
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 787-789, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44132
https://doi.org/10.1115/IJTC2007-44132
View Paper titled, Tribological Behavior of Self-Lubrication Bearing Materials of Steel-Copper-Polyoxymethylene Containing MoS2-IC Nanoparticles
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Topics: Bearings, Copper, Lubrication, Nanoparticles, Steel, Tribology, Friction, Wear, Electron field emission, Flow (Dynamics)
Proceedings Papers

The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals

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Joseph Bonivel, Sarah Biltz, Elon Terrell, Burak Ozdoganlar, C. Fred Higgs, III
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1019-1020, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44488
https://doi.org/10.1115/IJTC2007-44488
View Paper titled, The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals
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Topics: Metals, Polishing, Thin films, Semiconductor wafers, Copper, Data storage systems, Integrated circuits, Manufacturing, Mechanical properties, Nanoindentation
Proceedings Papers

In Situ and Real Time Optical Investigation of Junction Growth in Spherical Elastic-Plastic Contact

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Andrey Ovcharenko, Gregory Halperin, Izhak Etsion
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 529-531, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44080
https://doi.org/10.1115/IJTC2007-44080
View Paper titled, In Situ and Real Time Optical Investigation of Junction Growth in Spherical Elastic-Plastic Contact
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Topics: Junctions, Copper, Sapphire
Proceedings Papers

A Finite Element Study of the Effect of Friction on the Deformations, Forces, Stress Formations, and Energy Losses in a Sliding Contact Between Aluminum and Copper Cylinders

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Raghvendra Vijaywargiya, Itzhak Green
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1051-1053, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44309
https://doi.org/10.1115/IJTC2007-44309
View Paper titled, A Finite Element Study of the Effect of Friction on the Deformations, Forces, Stress Formations, and Energy Losses in a Sliding Contact Between Aluminum and Copper Cylinders
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Topics: Aluminum, Copper, Cylinders, Deformation, Energy dissipation, Finite element analysis, Friction, Stress, Aluminum alloys, Copper alloys
Proceedings Papers

Development of a Novel Green Lubricant for Sheet Metal Forming Operation

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M. A. Kabir, C. F. Higgs, M. Lovell
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 121-123, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44289
https://doi.org/10.1115/IJTC2007-44289
View Paper titled, Development of a Novel Green Lubricant for Sheet Metal Forming Operation
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Topics: Lubricants, Sheet metal work, Crystals, Disks, Friction, Aluminum, Copper, Lubrication, Metal stamping, Particulate matter
Proceedings Papers

In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process

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Arun Sikder, Norm Gitis, Michael Vinogradov, Antanas Daugela
Proc. ASME. TRIB2004, ASME/STLE 2004 International Joint Tribology Conference, Parts A and B, 55-58, October 24–27, 2004
Publisher: American Society of Mechanical Engineers
Paper No: TRIB2004-64346
https://doi.org/10.1115/TRIB2004-64346
View Paper titled, In-Situ Tribological Properties Monitoring and Chemical Mechanical Characterization of Planarization Process
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Topics: Tribology, Signals, Acoustic emissions, Adhesion, Copper, Delamination, Friction, Integrated circuits, Semiconductor wafers, Slurries
Proceedings Papers

A Mechanics Approach to Static Friction of Elastic-Plastic Fractal Surfaces

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J. Yang, K. Komvopoulos
Proc. ASME. TRIB2004, ASME/STLE 2004 International Joint Tribology Conference, Parts A and B, 1361-1372, October 24–27, 2004
Publisher: American Society of Mechanical Engineers
Paper No: TRIB2004-64271
https://doi.org/10.1115/TRIB2004-64271
View Paper titled, A Mechanics Approach to Static Friction of Elastic-Plastic Fractal Surfaces
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Topics: Fractals, Stiction, Stress, Deformation, Friction, Materials properties, Shear strength, Contact mechanics, Copper, Surface roughness
Proceedings Papers

Thermal Fatigue of Several Babbitts on Flat Plates: Part I — Unloaded Expansion

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Lyle A. Branagan, John C. Cleminson
Proc. ASME. IJTC2006, Part A: Tribomaterials; Lubricants and Additives; Elastohydrodynamic Lubrication; Hydrodynamic Lubrication and Fluid Film Bearings; Rolling Element Bearings; Engine Tribology; Machine Components Tribology; Contact Mechanics, 463-467, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12216
https://doi.org/10.1115/IJTC2006-12216
View Paper titled, Thermal Fatigue of Several Babbitts on Flat Plates: Part I — Unloaded Expansion
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Topics: Fatigue, Flat plates, Alloys, Babbitt metal, Bearings, Steel, ASTM International, Intermetallic compounds, Stress, Testing
Proceedings Papers

The Phenomenon of Strain Burst and Pile-Up in Nanoindentation of the Single Crystal Copper

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Jyh-Wei Lee, Chao-Sheng Lee, Min-Chou Chen, Jen-Ching Huang, Yuan Kang
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 1385-1389, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12272
https://doi.org/10.1115/IJTC2006-12272
View Paper titled, The Phenomenon of Strain Burst and Pile-Up in Nanoindentation of the Single Crystal Copper
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Topics: Copper, Crystals, Nanoindentation, Stress, Elastic moduli, Atomic force microscopy, Errors
Proceedings Papers

Some Tribological Aspects of Thin Film Copper During CMP

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Subrahmanya R. Mudhivarthi, Veera Raghava Kakireddy, Jayanta Banerjee, Ashok Kumar
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 987-996, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12307
https://doi.org/10.1115/IJTC2006-12307
View Paper titled, Some Tribological Aspects of Thin Film Copper During CMP
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Topics: Copper, Thin films, Tribology, Polishing, Temperature, Friction, Mechanical properties, Slurries, Pressure, Work hardening