The quality of electrical contact resistance is important to the performance and reliability of metal-contact microelectromechanical system (MEMS) relays and switches. The cyclic degradation of contact resistance was examined for a metal multilayer sphere-on-flat contact at low contact force. The relationships between the degradation and underlying mechanisms, particularly surface contamination effects, were investigated through experimentation and analysis. Results indicated that the degradation severity could be significantly decreased with environmental control and contact current reduction. Micro-arcs at very small surface gaps, which can decompose adsorbed contaminants and leave an insulating surface film, were proposed as a cause of the resistance degradation.
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ASME/STLE 2004 International Joint Tribology Conference
October 24–27, 2004
Long Beach, California, USA
Conference Sponsors:
- Tribology Division
ISBN:
0-7918-4181-2
PROCEEDINGS PAPER
The Degradation of Electrical Contact Resistance of Metal Films at Low Contact Force
Daniel J. Dickrell, III,
Daniel J. Dickrell, III
Sandia National Laboratories, Albuquerque, NM
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Michael T. Dugger
Michael T. Dugger
Sandia National Laboratories, Albuquerque, NM
Search for other works by this author on:
Daniel J. Dickrell, III
Sandia National Laboratories, Albuquerque, NM
Michael T. Dugger
Sandia National Laboratories, Albuquerque, NM
Paper No:
TRIB2004-64332, pp. 9-15; 7 pages
Published Online:
December 22, 2008
Citation
Dickrell, DJ, III, & Dugger, MT. "The Degradation of Electrical Contact Resistance of Metal Films at Low Contact Force." Proceedings of the ASME/STLE 2004 International Joint Tribology Conference. ASME/STLE 2004 International Joint Tribology Conference, Parts A and B. Long Beach, California, USA. October 24–27, 2004. pp. 9-15. ASME. https://doi.org/10.1115/TRIB2004-64332
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