Adhesion plays an important role in microelectromechanical systems (MEMS). It is a major concern in MEMS reliability and oftentimes excessive adhesion forces lead to permanent adherence of MEMS surfaces resulting in microdevice failure. The role of residual stresses in the adhesive contact between a pre-stressed membrane and a rigid flat-ended cylindrical punch is studied. Breaking the contact can be achieved under either fixed-load or fixed-grips configuration. The influence of the residual stress on the pull-off force, punch displacement, and contact area at pull-off is studied. It is shown that residual stresses have significant influence on interfacial contact behavior in MEMS and, hence, should be taken into consideration in formulating the adhesion contact mechanics.
- Tribology Division
The Influence of Residual Stress on Micromachine Stiction
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Wan, K, & Kogut, L. "The Influence of Residual Stress on Micromachine Stiction." Proceedings of the ASME/STLE 2004 International Joint Tribology Conference. ASME/STLE 2004 International Joint Tribology Conference, Parts A and B. Long Beach, California, USA. October 24–27, 2004. pp. 17-21. ASME. https://doi.org/10.1115/TRIB2004-64333
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