The Adhesion and removal of small particles to surfaces is very important to many industries such as semiconductor manufacturing, imaging, aerospace, etc. In most cases, particles represents undesirable contaminants that lower product yield and cause defects. These particulate contaminants may be generated by the process or the product environment. The industry sets threshold specification for acceptable contamination for each generation of products.
Particle Adhesion and Removal in the Semiconductor Industry
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Busnaina, AA, Xiong, X, & Park, JG. "Particle Adhesion and Removal in the Semiconductor Industry." Proceedings of the STLE/ASME 2003 International Joint Tribology Conference. Contact Mechanics. Ponte Vedra Beach, Florida, USA. October 26–29, 2003. pp. 115-120. ASME. https://doi.org/10.1115/2003-TRIB-0277
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