Contact-mode polycrystalline silicon microdevices were tested in reciprocating sliding in high vacuum. Changes in the adhesion and friction properties of the microdevice sidewall surfaces were evaluated by tracking the development of the adhesion force and static friction coefficient with the accumulation of sliding cycles. After a run-in period of no discernible changes, the adhesion force increased monotonically with the number of sliding cycles, while the static coefficient of friction decreased continuously. Scanning electron microscopy revealed the existence of two sliding regimes where asperity deformation and adhesion were the dominant wear processes. The evolution of adhesion and static friction at sidewall contact interfaces is interpreted in the context of physicochemical phenomena intrinsic of poly-crystalline silicon microdevices.
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STLE/ASME 2010 International Joint Tribology Conference
October 17–20, 2010
San Francisco, California, USA
Conference Sponsors:
- Tribology Division
ISBN:
978-0-7918-4419-9
PROCEEDINGS PAPER
Tribological Properties of Polycrystalline Silicon Microdevices Sliding in High Vacuum Available to Purchase
H. Xiang,
H. Xiang
University of California, Berkeley, Berkeley, CA
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K. Komvopoulos
K. Komvopoulos
University of California, Berkeley, Berkeley, CA
Search for other works by this author on:
H. Xiang
University of California, Berkeley, Berkeley, CA
K. Komvopoulos
University of California, Berkeley, Berkeley, CA
Paper No:
IJTC2010-41220, pp. 29-31; 3 pages
Published Online:
April 14, 2011
Citation
Xiang, H, & Komvopoulos, K. "Tribological Properties of Polycrystalline Silicon Microdevices Sliding in High Vacuum." Proceedings of the STLE/ASME 2010 International Joint Tribology Conference. STLE/ASME 2010 International Joint Tribology Conference. San Francisco, California, USA. October 17–20, 2010. pp. 29-31. ASME. https://doi.org/10.1115/IJTC2010-41220
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